The Georgia Tech 3D Systems Packaging Research Center (PRC) is a leading university driven center that focuses on advanced packaging using 2.5D and 3D heterogeneous integration technologies. The center conducts research and education in all aspects of advanced packaging and heterogeneous integration that includes materials, design, processes, thermal management, power delivery, and assembly and integration driven by applications that include high-performance computing, artificial intelligence, automotive, mm-wave communication, and photonic connectivity.

The 3D-PRC has access to unique cleanroom facilities and characterization tools enabling the center to pursue glass-core panel-based as well as silicon wafer-based technologies and processes. The center features up to 300 mm x 300 mm glass-core package panel facility that includes lithography, lamination, RDL/TGV metallization, laser drilling, and chiplet embedding. In parallel, the center also has access to up to 200 mm silicon wafer processing including lithography, physical vapor deposition, chemical vapor deposition, deep reactive ion etching, and electroplating processes. Together, these facilities provide our faculty, staff, students with state-of-the-art capabilities to advance heterogeneous integration and advanced packaging research.

The Center’s interdisciplinary faculty are affiliated with the School of Electrical and Computer Engineering (ECE), George W. Woodruff School of Mechanical Engineering (ME), School of Materials Science and Engineering (MSE), and Georgia Tech Research Institute (GTRI). With our approximately 30 member companies, 3D-PRC serves as a leading national center for university-industry parentship on advanced packaging and heterogeneous integration. Education is a core mission of the Center with several graduate and undergraduate courses devoted to advanced packaging and heterogeneous integration offered each year by the Center’s faculty.