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About the
PRC
The
Microsystems Packaging Research Center (PRC), housed in the Manufacturing
Research Center building on the Georgia Tech campus, was established
in 1994 as a U.S. National Science Foundation Engineering Research
Center. The PRC is the largest global research center dedicated to
System-on-Package (SOP) and other emerging microsystems packaging technologies.
Based on the US-Fraunhofer academic research model—involving highly effective collaborations and mentoring between academic professors, graduate students, and industry project owners—the PRC has comprised as many as 7 academic departments, 600 students involved in SOP development, 40 faculty, 20 researchers,
and over 160 companies from around the world. The PRC offers unique and
interdisciplinary degree programs at the B.S., M.S., and Ph.D. levels
as well as continuing education in SOP technologies. It manages its own $50 million, 13,000 foot square clean labs, and it leads
several conferences and workshops in packaging research and education.
Leadership &
Organization
Core Technologies & Teams Chart | Core Technology Teams | Consortia Development Teams | Student Council
Directors
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Prof.
Rao R. Tummala
Director
Profiles: PRC
Bio, ECE, MSE,
www.RaoTummala.com
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Dean
Sutter
Director of Operations
PRC Bio
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Infrastructure
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Finance
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Accounting
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Marketing
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Associate Director |
Assistant Director |
Assistant Director |
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Dr.
Ritwik Chatterjee
Associate Director, Silicon Systems Research and Program Manager, 3DASSM Consortium
Profile
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Dr. Raj
Pulugurtha
Assistant Research Director, Bio SOP Consortium
Profile
- Nano Bio Components
- Chip Last Interconnect / Bonding
- Advanced Materials & Characterizations
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Venky Sundaram
Assistant Research Director
Micro & Nano SOP Integration
Profile
- Thin Substrate, Core, Silicon
- Embedded RF, Opto and Active Components
- Assembly and Reliability
- Module Prototypes
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Operations &
Administration

Patricia Allen |
Financial
Management

Traci Walden-Monroe

Christine Baker |
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| Core Technology Teams, Consortia Programs & Student Leadership |
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CORE TECHNOLOGY TEAMS
SUBSTRATE
Prof. Rao Tummala
Dr. Ritwik Chatterjee
Venky Sundaram
Prof. John Papapolymerou
Prof. Gee-Kung Chang
DESIGN & TEST
Dr. Daehyun Chung
Prof. David Keezer
Prof. Abhijit Chatterjee
INTERCONNECTS
Nitesh Kumbhat
Prof. Rao Tummala
Prof. Suresh Sitaraman
NANO BIOELECTRONICS
Dr. Raj Pulugurtha
Prof. Maysam Ghovanloo
Prof. Z. L. Wang
Prof. Farrokh Ayazi
THERMAL & MECHANICAL
Prof. Yogendra Joshi
Prof. Suresh Sitaraman
Prof. Sam Graham
Prof. Jianmin Qu
MATERIALS
Prof. C. P. Wong, Leader
Dr. Jack Moon
Prof. Meilin Liu
CONSORTIA DEVELOPMENT TEAMS
BASE SOP
Prof. Rao Tummala, Faculty Leader
Dean Sutter, Program Mgr.
MIXED SIGNAL DESIGN TOOLS (MSDT)
Prof. Madhavan Swaminathan, Faculty Leader
Daehyun Chung, Program Mgr.
Prof. Gee-Kung Chang
Prof. Abhijit Chatterjee
Prof. Rao Tummala
Dr. Sung Kyu Lim
EMBEDDED ACTIVES & PASSIVES
(EMAP)
Prof. Rao Tummala, Faculty Leader
Venky Sundaram, Program Mgr.
Prof. Madhavan Swaminathan
Prof. C. P. Wong
Dr. Raj Pulugurtha
Baik Woo Lee
Dr. Fuhan Liu
THERMAL INTERFACE MATERIALS
(TIM)
Prof. Yogendra Joshi, Faculty Leader
Nitesh Kumbhat, Program Mgr.
Prof. Sam Graham
Prof. Suresh Sitaraman
Prof. Jianmin Qu
Prof. Rao Tummala
Dr. Raj Pulugurtha
NEXT-GENERATION FLIP CHIP (NGFC)
Prof. Suresh Sitaraman, Faculty Leader
Nitesh Kumbhat, Program Mgr.
Prof. Rao Tummala
3D ALL SILICON SYSTEM MODULE (3DASSM)
Prof. Rao Tummala, Faculty Leader
Dr. Ritwik Chatterjee, Program Mgr.
Prof. Herbert Reichl (IZM Fraunhofer)
Rolf Aschenbrenner (IZM Fraunhofer)
Prof. Joungho Kim (KAIST)
STUDENT
COUNCIL
Jin Liu - President
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