About the PRC

The Microsystems Packaging Research Center (PRC), housed in the Manufacturing Research Center building on the Georgia Tech campus, was established in 1994 as a U.S. National Science Foundation Engineering Research Center. The PRC is the largest global research center dedicated to System-on-Package (SOP) and other emerging microsystems packaging technologies. Based on the US-Fraunhofer academic research model—involving highly effective collaborations and mentoring between academic professors, graduate students, and industry project owners—the PRC has comprised as many as 7 academic departments, 600 students involved in SOP development, 40 faculty, 20 researchers, and over 160 companies from around the world. The PRC offers unique and interdisciplinary degree programs at the B.S., M.S., and Ph.D. levels as well as continuing education in SOP technologies. It manages its own $50 million, 13,000 foot square clean labs, and it leads several conferences and workshops in packaging research and education.

 

Leadership & Organization

Core Technologies & Teams Chart  |  Core Technology Teams  |  Consortia Development Teams  |  Student Council

Directors

Dean Sutter
   

Prof. Rao R. Tummala
Director

Profiles: PRC Bio, ECE, MSE, www.RaoTummala.com

  • Vision & Leadership
  • Innovation & Technology Development
  • Education & Mentoring
  • Funding

Dean Sutter
Director of Operations

PRC Bio

  • Infrastructure
  • Finance
  • Accounting
  • Marketing

 

   
Associate Director
Assistant Director
Assistant Director
 
Dr. Ritwik Chatterjee
Dr. Raj Pulugurtha
Venky Sundaram
 
Dr. Ritwik Chatterjee
Associate Director, Silicon Systems Research and Program Manager, 3DASSM Consortium

Profile

  • 3D All Silicon Systems Module Consortium (3DASSM)

 

Dr. Raj Pulugurtha
Assistant Research Director, Bio SOP Consortium

Profile

  • Nano Bio Components
  • Chip Last Interconnect / Bonding
  • Advanced Materials & Characterizations
Venky Sundaram
Assistant Research Director
Micro & Nano SOP Integration

Profile

  • Thin Substrate, Core, Silicon
  • Embedded RF, Opto and Active Components
  • Assembly and Reliability
  • Module Prototypes
 

Operations &
Administration

Patricia Allen

Financial
Management

Traci Walden-Monroe

Christine Baker

 

 

       

Core Technology Teams, Consortia Programs & Student Leadership

 

CORE TECHNOLOGY TEAMS

SUBSTRATE
Prof. Rao Tummala
Dr. Ritwik Chatterjee
Venky Sundaram
Prof. John Papapolymerou
Prof. Gee-Kung Chang

DESIGN & TEST
Dr. Daehyun Chung
Prof. David Keezer
Prof. Abhijit Chatterjee

INTERCONNECTS
Nitesh Kumbhat
Prof. Rao Tummala
Prof. Suresh Sitaraman

NANO BIOELECTRONICS
Dr. Raj Pulugurtha
Prof. Maysam Ghovanloo
Prof. Z. L. Wang
Prof. Farrokh Ayazi

THERMAL & MECHANICAL
Prof. Yogendra Joshi
Prof. Suresh Sitaraman
Prof. Sam Graham
Prof. Jianmin Qu

MATERIALS
Prof. C. P. Wong, Leader
Dr. Jack Moon
Prof. Meilin Liu

 

CONSORTIA DEVELOPMENT TEAMS

BASE SOP
Prof. Rao Tummala, Faculty Leader
Dean Sutter, Program Mgr.

MIXED SIGNAL DESIGN TOOLS (MSDT)
Prof. Madhavan Swaminathan, Faculty Leader
Daehyun Chung, Program Mgr.
Prof. Gee-Kung Chang
Prof. Abhijit Chatterjee
Prof. Rao Tummala

Dr. Sung Kyu Lim

EMBEDDED ACTIVES & PASSIVES (EMAP)
Prof. Rao Tummala, Faculty Leader
Venky Sundaram, Program Mgr.
Prof. Madhavan Swaminathan
Prof. C. P. Wong
Dr. Raj Pulugurtha
Baik Woo Lee
Dr. Fuhan Liu

THERMAL INTERFACE MATERIALS (TIM)
Prof. Yogendra Joshi, Faculty Leader
Nitesh Kumbhat, Program Mgr.
Prof. Sam Graham
Prof. Suresh Sitaraman
Prof. Jianmin Qu
Prof. Rao Tummala
Dr. Raj Pulugurtha

NEXT-GENERATION FLIP CHIP (NGFC)
Prof. Suresh Sitaraman, Faculty Leader
Nitesh Kumbhat, Program Mgr.
Prof. Rao Tummala

3D ALL SILICON SYSTEM MODULE (3DASSM)
Prof. Rao Tummala, Faculty Leader
Dr. Ritwik Chatterjee, Program Mgr.
Prof. Herbert Reichl (IZM Fraunhofer)
Rolf Aschenbrenner (IZM Fraunhofer)
Prof. Joungho Kim (KAIST)


STUDENT COUNCIL

Jin Liu - President

 


 


   

 


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