VISION & STRATEGY
The long term vision is to explore and demonstrate electronic systems with the highest functionality at lowest cost in smallest size. These system functions include the ability to sense, communicate, provide power, actuate, and process information - all in a small package enabled by SOP innovations in designs, materials and processes.
As illustrated in Figure 1, 3D systems that combine both 2D and 3D devices as well as smallest packages with-ultra-high density interconnections, embedded thin film passive components, ultra-low resistance thermal interfaces are the critical and strategic technologies. These are being explored and developed in two platforms: 1) Ultra-thin organic packages, and 2) Panel-based glass and silicon packages, potentially leading to 3D systems with 1000x improvement in volumetric functionality and component density as the current miiliscale component technologies are developed to nanoscale. In addition, heterogeneous modules combining digital, analog, RF, MEMS and sensors functions using devices such as silicon, GaAs, SiGe and passives such as, IPDs and embedded thinfilm passives are being explored and developed. The system integration research is being pursued in partnership with the entire supply-chain companies thus leading to commercialization of PRC technologies.
CURRENT RESEARCH PROJECTS
 Figure 2: RXP-1 and RXP-4 Low Loss 1+2+1 Substrate (150um thick) |
1. Low Loss FR-4 Process Compatible Organic Substrates for DC-110 GHz Applications
This theme explores integration of high density wiring and embedded high Q RF components in ultra-thin substrates using low moisture uptake polymer-glass laminate cores and thin dry film build-up dielectrics. A main focus is on materials and substrates compatible with existing FR-4 process infrastructure unlike past low loss materials like BCB and LCP. The integration research in organic packages includes embedding thin and thick passive components, module demonstration with embedded actives and passives, single package integration for sensor systems and bio-medical implants.
Research Projects
 Figure 3: Digital/RF/Opto INC Module with Embedded Components |
- RXP-1 Core and RXP-4 Build-up Films for RF, microwave and mm-wave packaging (Figure 2)
- High/low dielectric constant and low loss organic substrates
- Next generation halogen-free epoxy laminates for flip-chip and embedded chip packages
- Conductive anodic filament (CAF) and surface insulation resistance (SIR) of halogen-free substrates with fine pitch through vias and ultra-fine lines
- Chip-last embedded ICs in ultra-thin (<0.25mm) organic substrates with high yield and manufacturability
- Low leak rate, flexible organic substrates, packages and feedthroughs for bio-medical implants
- Single package integration for retinal prosthesis applications with near-hermetic reliability
- Intelligent Network Communicator (INC) – First demonstration of digital, RF and optical functions in a single package with embedded components (Figure 3)
- Embedding thick and thin film high density capacitors in BT/ABF substrates
- Mobile phone module with embedded resistors and capacitors
- Embedded SMT passive components in organic substrates
Panel Based Glass and Silicon Packages & Low CTE Packages
 Figure 3: Fine pitch TPV in Glass Core |
A fundamentally new approach is being pursued to explore and demonstrate low CTE packages and interposers based on ultra-thin glass and silicon panels targeting a~10x cost reduction from wafer-based silicon interposers. Key focus areas include sub-50um pitch through package vias (TPV) in glass and silicon substrates, highly reliable TPV and wiring structures on glass and silicon cores, electrical and mechanical design, 1st and 2nd level interconnect reliability.
Research Projects
- Fine Pitch Through Package Vias (TPV) in Glass Package
- Fine Pitch Through Package Vias (TPV) in Silicon Package
- Novel double side processed through silicon vias (TSV) in thick silicon for high reliability applications including MEMS
- Logic-memory high bandwidth interconnects using ultra-fine pitch TPV in glass interposer
- Conformal high density neural electrode arrays with hermeticity and bio-compatible polymers
- Low CTE substrate based sensor module integration with embedded resistors and capacitors
- 100um pitch lead-free solder flip-chip and wafer level package reliability using low CTE substrates
SYSTEM INTEGRATION INDUSTRY CONSORTIA RESEARCH
1. Embedded MEMS, Actives and Passives (EMAP)
2. Silicon & Glass Interposer (SiGI)
SELECTED PUBLICATIONS
1. Sundaram, V.; Tummala, R.R.; Fuhan Liu; Kohl, P.A.; Jun Li; Bidstrup-Allen, S.A.; Fukuoka, Y.; “Next-generation microvia and global wiring technologies for SOP”, IEEE Transactions on Advanced Packaging, Volume: 27, Issue: 2, May 2004, Pages: 315 – 325.
2. Bavisi, A.; Dalmia, S.; Swaminathan, M.; White, G.; Sundaram, V.; “Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate”, IEEE Transactions on Advanced Packaging, Volume 29, Issue 3, Aug. 2006 Page(s):390 – 402.
3. Sundaram, V.; Tummala, R.; White, G.; Lim, K.; Lixi Wan; Guidotti, D.; Fuhan Liu; Bhattacharya, S.; Pulugurtha, R.M.; Abothu, I.R.; Doraiswami, R.; Pucha, R.V.; Laskar, J.; Tentzeris, M.; Chang, G.K.; Swaminathan, M.; “System-on-a-package (SOP) substrate and module with digital, RF and optical integration”, Proceedings of Electronic Components and Technology Conference 2004, Volume: 1 , June 2004, Pages:17 – 23.
4. Liu, Fuhan; Sundaram, Venky; Min, Sunghwan; Sridharan, Vivek; Chan, Hunter; Kumbhat, Nitesh; Lee, Baik-Woo; Tummala, Rao; Baars, Dirk; Kennedy, Scott; Paul, Sankar; “Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications”, Proceedings of the 60th Electronic Components and Technology Conference, 2010, Page(s): 758 - 763
5. Sukumaran, Vijay; Chen, Qiao; Liu, Fuhan; Kumbhat, Nitesh; Bandyopadhyay, Tapobrata; Chan, Hunter; Min, Sunghwan; Nopper, Christian; Sundaram, Venky; Tummala, Rao; “Through-package-via formation and metallization of glass interposers”,
Proceedings of the 60th Electronic Components and Technology Conference, 2010, Page(s): 557 – 563.
RECENT INVENTIONS
1. Baik-Woo Lee, Venky Sundaram, Rao Tummala and Chong Yoon, “Embedded Actives and Discrete Passives in Substrate Cavity”, US Patent Pending
2. “Novel Through Package Via Structures and Process Methods in Glass Interposer”, US Patent Application