Technology Alliances
Digital Packaging, Microvia and Global Interconnect, Embedded Optoelectronics,
SOP Design Technology, RF Packaging, Thermal Management, Wafer Level Packaging

Industry's Strategic Need back

High-speed processors (clock frequencies above 2 GHz), broadband wireless computer networks (802.11, HiperLAN 2) and multi-band RF/microwave devices require highly compact and multifunctional integrated modules with efficient low-cost packages. Critical issues such as wideband and low-loss interconnects, high-Q multi layer passives including R, L, and Cs, board-compatible embedded functions (antennas, MEMS), low-loss and low-cost boards, efficient partitioning of MMIC's, low-cross talk single-moded packages, as well as design rules for vertically integrated transceivers are major barriers that have to be addressed accurately over a very wide frequency range. In addition, there exists a significant gap in the area of hybrid CAD needed to model novel functions that require fast and accurate modeling of electromagnetic, circuit, solid-state and mechanical. Full acceptance of RF-SOP requires cost effectiveness and reliability. All of these challenges are fully addressed by the RF packaging alliance.

Research Directions back

1. Challenges and solutions for highly compact and functional integrated modules for RF-SOP
2. Design rules for the vertical and multi-layer integration of embedded functions (e.g. antennas, MEMS) in wireless SOP-based transceivers (cellular devices, WLAN)
3. Organic and ceramic materials and processes to achieve low-loss, compact, wideband and multifunctional RF communication systems
4. Development of hermetically-packaged RF MEMS components for SOP
5. Design libraries for fundamental components of multi-layer packages
6. Development of ultra-fast electromagnetic/mechanical CAD simulators for geometry-adaptive full-wave analysis, design and modeling of RF Wireless packaging structures
7. Embedded materials and process fabrication development
8. Development of test methodology and reliability assessment

Integrated Testbed and Deliverables back

1. Design and fabricate a highly compact functional, integrated RF-SOP module
2. Develop design guidelines for the integration of embedded functions (antennas, micro machined structures, MEMS) in wireless SOP-based transceivers
3. Develop materials (organics, ceramics) and processes compatible with the SOP approach in RF/microwave frequencies
4. Create CAD tools and design libraries for high-Q passives, wideband low-loss interconnects, antennas and MEMS in Multi-layer Packages for Wireless Applications
5. Develop test and reliability methodologies for these components
6. Assess reliability of substrate and integration process
 
Recent PRC Advances back

1. Developed highly integrated module for wireless (1.9/2.4GHz), WLAN (OFDM/802.11 standards), satellite systems (14GHz), LMDS (28.8GHz) and OSCM-based systems
2. Integrated High-Q multi-layer passives on organic and ceramic substrates
3. Embedded functions (antennas, MEMS) for re-configurable multi-band communication nodes
4. Developed Adaptive Ultrafast CAD tools for combined electromagnetic/mechanical and solid-state modeling
5. Developed materials for high k capacitance, and high sheet resistivity
6. Assessed reliability of high Q passive components in SOP testbed
7. Developed low actuation voltage copper-based RF MEMS switch for SOP

Selected Publications back

1. K.Lim, S.Pinel, M.Davis, A.Sutono, C.-H.Lee, D.Heo, A.Obateyinbo, J.Laskar, E.M.Tentzeris, R.Tummala, "RF-System-On-Package (SOP) for Wireless Communications", IEEE Microwave Magazine, Vol.3, No.1, pp.88-99, March 2002.
2. D.Staciulescu, J.Laskar and E.M.Tentzeris, "Design Rule Development for Microwave Flip-Chip Applications", IEEE MTT Journal, Vol.48, No.9, pp.1476-1481, September 2000.
3. A.Sutono, C.Lee, A.Obatoyinbo, K.Lim, E.M.Tentzeris and J.Laskar, "Development of Highly Integrated 3D Microwave-Millimeter Wave Radio Front-End System-on-Package (SOP)", Invited Paper in the 2001 European GaAs Conference 2001, London, England, pp235-238, September 2001.
4. N.Bushyager and E.M.Tentzeris, "Modeling and Design of RF MEMS Structures Using Computationally Efficient Numerical Techniques", Invited Paper in the 2001 Electronic Components and Technology Conference, Lake Buena Vista, FL, pp. 324-327, May 2001.
5. D. Balaraman, S. Bhattacharya, F. Ayazi, and J. Papapolymerou, "Low Cost Low Actuation Voltage Copper RF MEMS Switches," in Proc. 2002 IEEE MTT-S International Microwave Symposium (IMS 2002), Seattle, WA, June 2002.
6. Characterization of thin film organic materials at high frequency; Dalmia, S.; Hobbs, J.M.; Sundaram, V.; Swaminathan, M.; White, G.E.; Tummala, R.R.; Ogitani, S., IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, p.133-6, 2001

PRC Research Facilities back

Industry Partners and Sponsor back
 
Microsubstrates, Kyocera, Toray, Agilent, AVX, IBM, EKC, Motorola,
National Science Foundation, NASA

Contact for Additional Information back 
 
Prof. John Papapolymerou
School of Electrical and Computer Engineering (M/C ECE 0250)
Phone: (404) 894-5250 E-Mail: papapol@ece.gatech.edu