Systems
RF/Wireless
Optoelectronics
Digital

Substrate
High Density Wiring
Integral Passives & MEMS
Base Substrate

Module
Assembly
Reliability
Test
Thermal

Education Related
Microelectronics and Systems Packaging Education

Additional Resources:
Georgia Tech Electronic Library
Georgia Tech School of Electrical and Computer Engineering Publications Database
Delphion Intellectual Property Network

Recent Publications (2002-2003), All Alliances
1. A. V. Mule', M. Bakir, J. Jayachandran, R. A. Villalaz, H. Reed, N. Agrawal, P. Shom, J. Plawsky, P. Kohl, K. P. Martin, E. N. Glytsis, T. K. Gaylord, and J. D. Meindl, "Optical Waveguides with Embedded Air-Gap Cladding Integrated Within a Sea-of-Leads (SoL) Wafer-Level Package," Proceedings of IEEE 2002 International Interconnect Technology, 122-124, 2002.
2. A. V. Mule', A. Naeemi, E. N. Glytsis, T. K. Gaylord, and J. D. Meindl, "Towards a Comparison between Chip-Level Optical Interconnection and Board-Level Exterconnection," IEEE 2002 International Interconnect Technology Conference, 92-94, 2002.
3. L. Wan, M. Swaminathan and R. R. Tummala, "Simulation of Switching Noise in Multi-layer Structures using the Generalized Transmission Line Equation Method," Proceedings of the International Symposium on Electromagnetic Compatibility, 1026-1031, 2002.
4. K. W. Choi and A. Chatterjee, "HA2TSD: Hierarchical time slack distribution for ultra-low power CMOS VLSI," Proc. of the International Symposium on Low Power Electronics and Design, 207-212, 2002.
5. A. Venkateshan, A. Pham, and J. Harriss, "Development of an organic micromachined isolation scheme for wafer-level packaging," IEEE EPEP, 111-114, 2002.
6. K. W. Choi and A. Chatterjee, "PA-ZSA (Power Aware Zero Slack Algorithm): A graph based timing analysis for ultra low-power CMOS VLSI," Proceedings PATMOS, 178-187, 2002.
7. C. S. Seo and A. Chatterjee, "A CAD Tool for System-on-Chip Placement and Routing With Free-Space Optical Interconnect," Proceedings ICCD, 24-29, 2002.
8. S. Pourkamali Anaraki, R. Abdolvand, and F. Ayazi, "600kHz Electrically Coupled MEMS Bandpass Filter," Proc. IEEE International Micro Electro Mechanical Systems Conference (MEMS'03), 702-705, 2003.
9. G. Piazza, R. Abdolvand, and F. Ayazi, "Voltage-Tunable, Piezoelectrically-Transduced, Single-Crystal Silicon Resonators on SOI Substrates," Proc. IEEE International Micro Electro Mechanical Systems Conference (MEMS'03), 149-152, 2003.
10. M.Kuroda, N.Miura and M.M.Tentzeris, "A Novel Numerical Approach for the Analysis of 2D MEMS-Based Variable Capacitors with Motion to Arbitrary Directions," Proc. Of the ACES (Applied Computational Electromagnetics) 2003, Monterey, CA, CDROM, 2003.
11. W. Beyene, C. Yuan, J. H. Kim and M. Swaminathan, "Modeling and Analysis of Power Distribution Networks for Gigabit Applications," International Symposium on Quality Electronic Design, , 2003.
12. M.Al-Ahmad, F.Coccetti, M.Tentzeris and P.Russer, "Parametric Model Generation Algorithm for Planar Microwave Structures Based on Full-Wave Analysis and Design of Experiment," Proc. Of the ACES (Applied Computational Electromagnetics) 2003, Monterey, CA, CDROM, 2003.
13. X. Xuan and A. Chatterjee, "Reliability Evaluation for Integrated Circuit With Defective Interconnect Under Electromigration," Proceedings ISQED, 29-35, 2003.
14. G. Ponchak and J. Papapolymerou, "180 Degree Hybrid (Rat Race) Junction on CMOS Grade Silicon with a Polyimide Interface Layer," 2003 Topical Meeting on Si Monolithic Integrated Circuits in RF systems Digest, 96-99, 2003.
15. T. Euler and J. Papapolymerou, "A Novel Micromachined Planar Filter on Si Substrate at 45 GHz Based on EBG structures for Wireless Applications," 2003 Topical Meeting on Si Monolithic Integrated Circuits in RF systems Digest, 150-153, 2003.
16. K. Sundaresan, K. Brouse, K. U-Yen, F. Ayazi and P. Allen, "A 7-MHz process, temperature and supply compensated clock oscillator in 0.25um CMOS," Proc. of International Symposium on Circuits and Systems (ISCAS) 2003, 693-696, 2003.
17. Jeyakumar, A., Henderson, C.L.  , "A comparative study between organic and inorganic resists in electron beam lithography using monte carlo simulations," Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX), 1192-1203, 2003.
18. J. Shin, C. S. Seo, A. Chellappa, M. Brook, A. Chatterjee and N. M. Jokerst, "Comparison of Electrical and Optical Interconnect for Off-Chip Signalling," Proceedings IEEE ECTC, 1067-1072, 2003.
19. Berger, C.M., Henderson, C.L.  , "Equilibrium sorption and rate of diffusion of water into photoresist thin films," Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX), 984-995, 2003.
20. Jeyakumar, A., Henderson, C.L.  , "Hybrid bilayer imaging approach using single component metal-organic precursors for high resolution electron beam lithography," Proceedings of SPIE-The International Society for OpJune 2003tical Engineering, 5039(Pt. 2, Advances in Resist Technology and Processing XX), 502-512, 2003.
21. Singh, L., Ludovice, P.J., Henderson, C.L.  , "Influence of film thickness, molecular weight, and substrate on the physical properties of photoresist polymer thin films," Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX), 1008-1018, 2003.
22. Agrawal, A., Henderson, C.L.  , "Investigation of surface inhibition and its effect on the lithographic performance of polysulfone-novolac electron beam resists," Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX), 1019-1030, 2003.
23. Z. Wei and A. Pham, "Liquid crystal polymer for multi-layer microwave and millimeter packaging," IEEE IMS, 2273-2276, 2003.
24. Berger, C., Henderson, C.L., "Measurement of photoacid generation kinetics in photoresist thin films via capacitance techniques," Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX), 322-333, 2003.
25. S. Pourkamali and F. Ayazi, "SOI-Based HF and VHF Single-Crystal Silicon Resonators with Sub-100 Nanometer Vertical Capacitive Gaps," Digest of the 12th International Conference on Solid State Sensors, Actuators and Microsystems (Transducers '03), 837-840, 2003.
26. R. Abdolvand, G.K. Ho, A. Erbil, and F. Ayazi, "Thermoelastic Damping in Trench-Refilled Polysilicon Resonators," Digest of the 12th International Conference on Solid State Sensors, Actuators and Microsystems (Transducers '03), 324-327, 2003.
27. C. S. Seo and A. Chatterjee, "Wiring Optimization for Power Consumption and Propagation Delay of Chips with Free-Space Optical Interconnect," Proceedings IEEE ECTC, 1-6, 2003.
28. Ali, M.A., Gonsalves, K.E., Agrawal, A., Jeyakumar, A., Henderson, C.L., "Nanocomposite resist for low voltage electron beam lithography (LVEBL)," Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology , 442-452, 2003.
29. H.D. Thacker, M.S. Bakir, D.C. Keezer, K.P. Martin, J.D. Meindl, "Compliant Probe Structures for Testing High Pin-Count Chip Scale Packages," Proc. Of the IEEE ECTC , 1019-1023, 2002.
30. A. Kamal, C. P. Wong, J. A. Copeland, "An Original modeling Process and Technology with Intra-packaging Cross talk Consideration for Compact array Antennas on the 4G Communication Packages," Proceedings of the 4th Electronics Packaging Technology Conference, 37-39, 2002.
31. S. Hong, G. May, and D. Park, "Modeling Optical Emission Spectroscopy Data Generated during Reactive Ion Etching Using an Autoencoder Neural Network," Intelligent Engineering Systems Through Artificial Neural Networks, 945-950, 2002.
32. R. Doraiswami, S. Sankararaman, W. Kim, J. Li, Z. Zhang, P. Gupta, K. Nakanishi, M. Borkar, R. Madhavan, V. Govind, S. Choi, A. O. Aggarwal, Y. Sun, L. Fan, V. Sundaram, M. Swaminathan, C.P. Wong, R. R. Tummala, "Advances in Fine Pitch Lead Free Assembly Process," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 834-839, 2003.
33. K. Brownlee, K. Shinotani, P. M. Raj, S. K. Bhattacharya, C.P. Wong, R. R. Tummala, "Evaluation of Low Stress Dielectrics for Board Application," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 136-141, 2003.
34. S. Pinel, M.Roellig, R.Kunze, V.Sundaram, K.Lim, J.Laskar, G.White and R.Tummala , "Stacked Liquid Crystal Polymer substrates and uBGA technology for 3D integrated C-band RF Front-End Module," Asia-Pacific Microwave Conference, 955-958, 2002.
35. Z. Zhang, A. Vorakunpinij, S. K. Sitaraman, C.P. Wong, "Time Evolution of Temperature Distribution of a Flip-Chip No-Flow Underfill Package during Solder Reflow Process," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 443-448, 2003.
36. K. Arabi, K-D. Hilliges, D. Keezer, A. Tabatabaei, "Innovative Practices: Mult-GigaHertz Testing Challenges and Solutions," VLSI Test Symposium, 265, 2002.
37. B. Kaminska, D. Keezer, "Jitter Testing in Multi-Gigahertz Digital Systems," Intl. Test Conference, 700-725, 2002.
38. K. Arabi, C. Hawkins, M. Sachdev, T. Yamaguchi, M. Tripp, U. Schoettmer, D. Keezer, "Mult-GHz Era: Test Challenges and Solutions," Intl. Test Conference, 1227, 2002.
39. R. Rajsuman , D. Keezer, J. Johnson, D. Wheater, A. Crouch, H. Ranga, "Testing the Tester," Intl. Test Conference, 27, 2002.
40. K. Moon, C. Rockett, C. Kretz, W.F. Burgoyne and C.P Wong, "Adhesion Improvement of Thermoplastic Conductive Adhesives under Humid Enviroment," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 1791-1799, 2003.
41. L. Fan, Y. Kumashiro, C.P. Wong, "Integral Capacitor Dielectrics Based on Polymer Composites with Specialty Conductive Fillers," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 167-172, 2003.
42. K. Gross, S. Hackett, W. Schultz, Z. Zhang, Lianhua Fan, and C.P Wong, "Nanocomposite Underfills for Flip-Chip Applications," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 951-956, 2003.
43. Hoskins, T., Chung, W.J., Ludovice, P.J., Henderson, C.L., Seger, L.D., Rhodes, L.F., Shick, R.A.  , "Dissolution behavior of bis-trifluoromethyl carbinol substituted polynorbornenes," Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX), 600-611, 2003.
44. A. F. Peterson and M. M. Bibby, "Three discretizations of the MFIE for the linear dipole," Digest of the 2003 IEEE Antennas and Propagation Society International Symposium, Vol. 3, 6-9, 2003.
45. N.Bushyager, L.Martin, S.Khushrushahi, S.Basat and M.Tentzeris, "Design of RF and Wireless Packages Using Fast Hybrid Electromagnetic/Statistical Methods," Proc. Of the 2003 IEEE ECTC, New Orleans, LA, 1546-1549, 2003.
46. S. Nuttinck, E. Gebara, J. Laskar, H. Zirath, and M. Harris, "Comparison Between Si LDMOS and GaN-Based Microwave Power Transistors," IEEE Lester Eastman Conference, 149-154, 2002.
47. Nuttinck, S. Pinel, R. Bathia and J. Laskar, "Temperature-Dependent RF Characterization, and Analysis of SOI FETs, and Their Applications to C-Band WLAN," Asia-Pacific Microwave Conference, 1651-1654, 2002.
48. S. Sarkar, P. Sen, A. Raghavan, S. Chakarborty, J. Laskar , "Development of 2.4 Ghz RF transceiver front-end chipset in 0.25 um CMOS," 16th International Conference on VLSI Design, 42-47, 2003.
49. R.J. Pratap, S.Pinel, D.Staiculescu, J.Laskar, and G.S. May, "A Neural Network Model for Sensitivity Analysis of Circuit Parameters for Flip Chip Interconnects," Proc. Of the IEEE ECTC , 1011-1014, 2003.
50. N.Srirattana, M. S. Qureshi, A. Aude, V. Krishnamurthy, D. Heo, P. E. Allen, and J. Laskar, "SiGe HBT power amplifier for IS-95 CDMA using a novel process, voltage, and temperature insensitive biasing scheme," IEEE Int. Symp. Circuits Syst. (ISCAS'03), 437-440, 2003.
51. Z. Zhang, H. Li, C. P. Wong, "Development of No Flow Underfill for Board Level Assembly," Proceedings of the 2002 International Sym. on Electronic Materials and Packaging, 117-122, 2002.
52. Y. Rao and C.P. Wong, "Development of Novel Ultra-high Dielectric Constant Polymer Based Composite," Proceedings of the 2002 International Sym. on Electronic Materials and Packaging, 335-340, 2002.
53. W. Kim and M. Swaminathan, "Validity of Non-Physical RLGC Models for Simulating Lossy Transmission Lines," Proceedings of the International Symposium on Antennas and Propagation, 786-789, 2002.
54. T. Thongvigitmanee and G. May, "Optimization of Nanocomposite Integral Capacitor Fabrication Using Neural Networks and Genetic Algorithms," Proc. SEMICON West 2002: SEMI Technology Symposium, 123-129, 2002.
55. D. Mukherjee, J. Bhattacharjee, S. Chakraborty and J. Laskar, "A 5-6 GHz Fully-Integrated CMOS LNA for a Dual-Band WLAN Receiver," IEEE Radio and Wireless Conference, 475-478, 2002.
56. G.Zheng, S.Pinel, K.Lim, R.Li, M.Tentzeris, J.Papapolymerou and J.Laskar, "Design of Compact RF Components for Low-Cost High-Performance wireless Front-Ends," Proc. Of the 2002 ICMMT, Beijing, China, 259-262, 2002.
57. J. H. Kim, J. Choi, J. Choi, S. Chun, S. H. Min, W. Kim and M. Swaminathan, "Electromagnetic Modeling and Hardware Measurements of Simultaneous Switching Noise in High Speed Systems," Proceedings of the International Symposium on Electromagnetic Compatibility, 748-754, 2002.
58. J. Choi, L. Wan, M. Swaminathan, B. Beker and R. Master, "Modeling of Realistic On-Chip Power Grid using the FDTD Method," Proceedings of the International Symposium on Electromagnetic Compatibility, 238-243, 2002.
59. M. Maeng, K. Lim, Y. Hur, M. F. Davis, N. Lal, S. Yoon, J. Laskar, "Novel combiner for hybrid digital/RF Fiber-Optic application," IEEE Radio and Wireless Conference, 193-196, 2002.
60. A. Raghavan, B. Banerjee, S. Venkataraman and J. Laskar, "Direct extraction of InGaP/GaAs HBT large signal model," GaAsIC Symposium, 225-228, 2002.
61. G.E.Ponchak, E.Dalton, A.Bacon, J.Papapolymerou and M.Tentzeris, "Measured Propagation Characteristics of Finite-Ground Coplanar Waveguide on Silicon with a Thick Polyimide Interface Layer," Proc. Of the 2002 European Microwave Symposium, Milan, Italy, I. 167-170, 2002.
62. S.Pinel, K.Lim, M.Maeng, M.F.Davis, R.Li, M.Tentzeris and J.Laskar, "RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-end Systems," Proc. Of the 2002 European Microwave Symposium, Milan, Italy, I. 61-64, 2002.
63. D. C. Keezer, J.S. Davis, "An FPGA-Based Digital Logic Core for Embedded Test Applications," 9th IEEE/DPC KGD Packaging and Test Workshop, 33, 2002.
64. V. Govind, S. Dalmia and M. Swaminathan, "Design of an Integrated Low Noise Amplifier with Embedded Passives in Organic Substrates," Proceedings of the Electrical Performance of Electronic Packaging, 67-70, 2002.
65. E. Matoglu, M. Swaminathan, N. Pham, D. N. de Araujo and M. Cases, "Efficient Statistical Analysis and Diagnosis of High Speed Source Synchronous Interfaces," Proceedings of the Electrical Performance of Electronic Packaging, 223-226, 2002.
66. J. Choi, M. Swaminathan, N. Do and R. Master, "Modeling of Power Supply Noise in Large Chips with Nonlinear Circuits," Proceedings of the Electrical Performance of Electronic Packaging, 257-260, 2002.
67. J.S. Davis, D.C. Keezer, "Mutli-Purpose Digital Test Core Utilizing Programmable Logic," Intl. Test Conference, 438-445, 2002.
68. M.Kuroda, N.Miura and M.Tentzeris, "A Novel Time-Domain Technique for the Analysis of MEMS-Based Variable Capacitors with Moving Metallic Parts," Proc. 2002 Asian-Pacific Microwave Symposium, Kyoto, JAPAN, III. 1208-1211, 2002.
69. J. Laskar, E. Tentzeris, K. Lim, S. Pinel, M. Davis, A. Rhagavan, M. Maeng, S-W. Yoon,and R.Tummala , "Advanced System-on-Package RF Front-ends for Emerging Wireless Communications, Invited," Asia-Pacific Microwave Conference, 1703-1708, 2002.
70. E. Tentzeris, N.Bushyager R.Li, K. Lim, S. Pinel, M. Davis, J.Laskar, E.Zheng, J.Papapolymerou , "Analysis of MEMS and embedded components in multi-layer packaging using FDTD/MRTD for system-on-package applications," Asia-Pacific Microwave Conference, 554-557, 2002.
71. E.Y.Tsai, A.M.Bacon, M.Tentzeris and J.Papapolymerou, "Design and Development of Novel Micromachined Patch Antennas for Wireless Applications," Proc. 2002 Asian-Pacific Microwave Symposium, Kyoto, JAPAN, II. 821-824, 2002.
72. D.C. Keezer, J.S. Davis, S. Ang, M. Rotaru, "A Test Strategy for Nanoscale Wafer Level Packaged Circuits," 4th IEEE Electronics Packaging Technology Conference (EPTC), 175-179, 2002.
73. S. H. Min and M. Swaminathan, "Construction of Broadband Passive Macromodels from Frequency Data for Simulation of Distributed Interconnect Networks," Internal Symposium on Electromagnetic Compatibility, 17-22, 2003.
74. S. Hong and G. May, "Neural Network Based Time Series Modeling of Optical Emission Spectroscopy Data for Fault Detection in Reactive Ion Etching," Proc. SPIE International Symposium on Advanced Microelectronic Manufacturing, 326-327, 2003.
75. J.Lee, E.T.K.Dalton, N.Bushyager, M.Kunze, W.Heinrich and M.Tentzeris, "Coupling of Electromagnetic Time-Domain Simulators with DSP/Subgridding Techniques for the Adaptive Modeling of Wireless Packaging Structures," Invited Paper in the ACES (Applied Computational Electromagnetics) 2003, Monterey, CA, CDROM, 2003.
76. N.Bushyager and M.Tentzeris, "Intracell Modeling of Metal/Dielectric Interfaces for EBG/MEMS RF Structures Using the Multiresolution Time-Domain Technique," Invited Paper in the ACES (Applied Computational Electromagnetics) 2003, Monterey, CA, CDROM, 2003.
77. M. Tentzeris, N. Bushyager, J. Laskar, G. Zheng, J. Papapolymerou, "Analysis and design of mems and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on package applications system-on-package (SOP)," Silicon Monolithic Integrated Circuits in RF Systems, 138-141, 2003.
78. S.Nuttinck, S. Pinel, J. Laskar, "Wafer level packaging solution for High performances microwaves inductors on Si substrate," Silicon monolithic integrated circuits in RF systems meeting, 154-156, 2003.
79. L. Conrad, G. May, and R. Tummala, "A Methodology for Evaluating Electronic Packaging Curricula and Certificate Programs," Proc. Elec. Comp. & Tech. Conf., CDROM, 2003.
80. H. Li, and C.P. Wong, "A Reworkable Epoxy Resin for Isotropically Conductive Adhesive," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 1391-1397, 2003.
81. Y. Rao, K. Tang, C.P. Wong, "A Study on Epoxy-Based High K Composite for Embedded Capacitor with Silver Fillers Coated Self Assembly Monolayer Insulating Materials," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 1820-1822, 2003.
82. E.T.K.Dalton, M.Kunze, W.Heinrich and M.M.Tentzeris, "Accurate Modeling of Multilayer Packaging Structures with a Hybrid FDTD Method," Proc. Of the 2003 IEEE ECTC, New Orleans, LA, 1028-1031, 2003.
83. Z. Zhang, and C.P. Wong, "Characteristics of the Curing Properties of N-Flow Underfill and B-Stage Feasibility Study for Water Level Application," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 971-977, 2003.
84. J. Laskar, S. Pinel, K. Lim, M.F. Davis M. Maeng, R. Li, M. Tentzeris, "Compact System-on-Package (SOP) Architecture for low cost RF Front-end module," GaAsIC MANTECH 2003, 201-204, 2003.
85. M.F. Davis, R.J. Pratap, S. Pinel, U. Jalan, D.-K. Kim, J. Laskar, G.May, "Design Rule Development for Electrical Modeling of RF Multilayer Packaging Inductors," Proc. Of the IEEE ECTC , 505-508, 2003.
86. J. Xu and C.P. Wong, "Development of a Novel Aluminum-Filled Composite for Embedded Passive Applications," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 173-181, 2003.
87. H. Li, K. Moon, and C.P. Wong, "Effect of Sacrificial Anodic Fillers on Contact Resistance Stability of Electrically Conductive Adhesives onto Lead-Free Alloy Surfaces," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 1373-1377, 2003.
88. Y. Sun, Shijian Luo, C.P. Wong, "Electrical and Mechanical Properties of Carbon Black Filled Ethylene Propylene Rubber During Thermal Oxidation Aging," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 1644-1647, 2003.
89. S. Pinel, CH. Lee, S-W. Yoon, K.Lim, and J. Laskar, "Embedded IC packaging technology for ultra-thin and highly compact RF Module," Proc. Of the IEEE ECTC , 201-204, 2003.
90. R.L.Li, G.DeJean, M.Tentzeris and J.Laskar, "Integration of Miniaturized Patch Antennas with High Dielectric Constant Multilayer Packages and Soft-and-Hard Surfaces (SHS)," Proc. Of the 2003 IEEE ECTC, New Orleans, LA, 474-477, 2003.
91. K.Lim, M.F. Davis, M. Maeng, S. Pinel, L. Wan, J. Laskar, Venky, G. White, M.Swaminathan, R. Tummala, "Intelligent Network Communicator: Highly integrated System-on-package (SOP) Test-bed for RF/digital/Opto applications," Proc. Of the IEEE ECTC , 463-466, 2003.
92. B. Mutnury and M. Swaminathan, "Macro-Modeling Methodology for Weakly Non-Linear Digital Drivers," Signal Propagation on Interconnects, 61-64, 2003.
93. Z. Zhang, H. Li, C.P. Wong, "Novel Reworkable Fluxing Underfill for Board level Assembly," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 940-945, 2003.
94. C. Davis, R. Tanikella, P. Kohl, and G. May, "Optimization of Variable Frequency Microwave Curing Using Neural Networks and Genetic Algorithms," Proc. Elec. Comp. & Tech. Conf., CDROM, 2003.
95. S. Pothukuchi, C.P. Wong, "Use of Dendrimers to Control Nanoparticle Size in Polymer-Metal Nanocomposites for Embedded Capacitor Application," IEEE Proceedings of the 53rd Electric Components & Technology Conference, 1804-1808, 2003.
96. D. Thompson, J. Papapolymerou and E. Tentzeris, "W-Band Characterization of Finite Ground Coplanar Transmission Lines on Liquid Crystal Polymer (LCP) Substrates," Proc. Of the IEEE ECTC , 1652-1655, 2003.
97. F. Caliskan and A. F. Peterson, "Analysis of planar layered structures using the locally corrected Nystrom method," Digest of the 2003 IEEE Antennas and Propagation Society International Symposium, Vol. 4, 106-109, 2003.
98. N. Bushyager, M. Tentzeris and J. Papapolymerou, "Electromagnetic Band Gap Structure Design Using a Composite Cell Multiresolution Time-Domain Scheme," 2003 IEEE International Microwave Symposium, 2081-2084, 2003.
99. G. Wang, S. Barstow, A. Jeyakumar, J. Papapolymerou and C. Henderson, "Low Cost RF MEMS Switches Using Photodefinable Mixed Oxide Dielectrics," 2003 IEEE International Microwave Symposium, 1633-1636, 2003.
100. R. L. Li, G. DeJean, M. M. Tentzeris, J. Laskar and J. Papapolymerou, "LTCC Multilayer Based CP Patch Antenna Surrounded by a Soft-and-Hard Surface for GPS Applications," 2003 IEEE International Symposium on Antennas and Propagation, 651-654, 2003.
101. J. M. Hobbs, S. Dalmia, V. Sundaram, L. Wan, W. Kim, G. White, M. Swaminathan and R. R. Tummala, "Development and Characterization of Embedded Thin-Film Capacitors for Mixed Signal Applications on Fully Organic System-on-package Technology," Proceedings of Radio and Wireless Conference, 201-204, 2002.
102. M. Tentzeris, "Adaptive modeling and design of highly integrated 3D microwave-millimeter wave radio front-ends," Proc. 2002 Gallium Arsenide Integrated Circuit (GaAsIC) Symposium, Monterey, CA, 109-1112, 2002.
103. D. Keezer, "Challenges and Solutions for Multi-Gigahertz Testing," Intl. Test Conference, 1230, 2002.
104. A. Pham , "Educational modules on RF MEMS and Microsystems," IEEE Transactions on Components and Packaging Technologies, 495-498, 2003.
105. P. Variyam and A. Chatterjee, "Prediction of Analog Performance Parameters Using Fast Transient Testing," IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems, 349-361, 2002.
106. R. Pendurkar, A. Chatterjee and Y. Zorian, "Switching Activity Generation with Non-Linear Feedback Shift Registers for Performance Testing of Interconnects," IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems, 1143-1158, 2002.
107. S.P. Gurrum, Y. Joshi and J. Kim, "Thermal Management of High Temperature Pulsed Electronics Using Metallic Phase Change Materials," Numerical Heat Transfer, 777-790, 2002.
108. S. Moghaddam, M. Rada, A. Shooshtari, M. Ohadi, Y. Joshi, "Evaluation of Analytical Models for Thermal Analysis and Design of Electronic Packages," Microelectronics Journal, 223-230, 2003.
109. Amitay, M. and Glezer, A., "The Role of the Actuation Frequency in Controlled Flow Reattachment over a Stalled Airfoil," AIAA Journal, 209-216, 2002.
110. Laurent Cretegny and A. Saxena, "Evolution of Surface Deformation During Fatigue of PH13-8Stainless Steel Using Atomic Force Microscopy," Fatigue and Fracture of Engineering Materials and Structures, 305-314, 2002.
111. Smith, B. L., and Glezer, A, "Jet Vectoring using Synthetic Jets," Journal of Fluid Mechanics, 1-34, 2002.
112. J. Wu, C. P. Wong, "Development of New Low Stress Epoxies for MEMS Device Encapsulation," IEEE Trans. on Components and Packaging Technologies, Vol. 25, No. 2, 278-282, 2002.
113. H. Hsu, M. Hill, J. Papapolymerou and R. Ziolkowski, "A Planar X-band Electromagnetic Bandgap (EBG) 2-Pole Filter," IEEE Microwave and Wireless Components Letters, 255-257, 2002.
114. Amitay, M. and Glezer, A, "Controlled Transients of Flow Reattachment Over Stalled Airfoils," International Journal of Heat Transfer and Fluid Flow, 690-699, 2002.
115. Amitay, M., Pitt, D. and Glezer, A., "Separation Control in Duct Flows," Journal of Aircraft, 616-620, 2002.
116. D. Newlin, A. Pham, and J. Harriss, "Development of low loss organic-micromachined interconnects on silicon at microwave frequencies," IEEE Transactions on Components and Packaging Technologies, 506-510, 2002.
117. Liu, J., Brooke, M.A., and Hirotsu, K. , "A CMOS feedforward neural-network chip with on-chip parallel learning for oscillation cancellation," IEEE Transactions on Neural Networks, Vol. 13, No. 5, 1178-1186, 2002.
118. A. V. Mule', E. N. Glytsis, T. K. Gaylord, and J. D. Meindl, "Electrical and optical clock distribution networks targeting high performance microprocessors," IEEE Trans. VLSI Systems, 582-594, 2002.
119. Shun-Der Wu and E. N. Glytsis, "Finite-Number-of-Periods and Finite-Incident Beam Holographic Gratings: Analysis Using the FDFD Method," J. Opt. Soc. Am. A, 2018-2029, 2002.
120. G. Triplett, G. May, and A. Brown, "Modeling Electron Mobility in MBE-Grown InAs/AlSb Thin Films for HEMT Applications Using Neural Networks," Solid State Electronics, 1519-1524, 2002.
121. H. Hsu, M. Hill, R. Ziolkowski and J. Papapolymerou, "A Duroid-based planar EBG cavity resonator filter with improved quality factor," IEEE Antennas and Wireless Propagation Letters, 67-70, 2002.
122. Trautman, M. A., and Glezer, A., "The Manipulation of the Streamwise Vortex Instability in a Natural Convection Boundary Layer along a Heated Inclined Flat Plate ," Journal of Fluid Mechanics, 31-61, 2002.
123. M. S. Bakir, H. A. Reed, A. V. Mulé, J. P. Jayachandran, P. A. Kohl, K. P. Martin, T. K. Gaylord, and J. D. Meindl , "Chip-to-module interconnections using `Sea of Leads' technology," Matls Res. Soc. Bull., vol. 28, pp. 61-67, Jan. 2003. (invited), 61-67, 2003.
124. James, A. J., Vukasinovic, B., Smith, M. K., and Glezer, A., "Vibration-Induced Droplet Atomization," Journal of Fluid Mechanics, 1-28, 2003.
125. Berger, C.M., Henderson, C.L.  , "The effect of humidity on water sorption in photoresist polymer thin films," Polymer, 2101-2108, 2003.
126. Liu, T., Henderson, C.L., Samuels, R.  , "Quantitative characterization of the optical properties of absorbing polymer films: Comparative investigation of the internal reflection intensity analysis method," Journal of Polymer Science, Part B: Polymer Physics, 842-855, 2003.
127. Chinthakindi, A. K., Bhusari, D., Dusch, B. P., and Kohl, P. A.,, "Recrystallization and Intermetallic Formation in Au/Al and Au/Zn Bimetallic Films," Journal of Electronic Materials, 1096, 2002.
128. Journal of Electronic Materials, "The Acceleration of Non Formaldehyde Electroless Copper Plating," Journal of the Electrochemical Society, C631-636, 2003.
129. G. Ponchak, E.M. Tentzeris, "Finite Ground Coplanar Waveguide (FGC) Low Loss, Low Coupling 90-Degree Crossover Junctions," IEEE Transactions on Advanced Packaging, Vol. 25, No. 3, pp. 385-392, 2002.
130. A. Muliana, R. Steward, R. Haj-Ali, and A. Saxena, "Artificial Neural Network and Finite Element Modeling of Nanoindentation Tests," Metallurgical and Materials Transactions A, 1939-1947, 2002.
131. Nuttinck, E. Gebara, J. Laskar, and M. Harris , "High Frequency Noise in AlGaN/GaN HFETs," IEEE Microwave and Wireless Components Letter, 149-151, 2003.
132. Padovani, A. M., Rhodes, L., Allen, S. A., and Kohl, P. A, "Chemically Bonded Porogens in Methylsilsesquioxane, Part I: Structure and Bonding," Journal of The Electrochemical Society, F161-170, 2002.
133. Wu, X., Reed, H. R., Rhodes, L. F., Elce, E., Ravikiran, R., Shick, R. A., Henderson, C. L., Allen, S. A., and Kohl, "Lithographic Characteristics and Thermal Processing of Photosensitive Sacrificial Materials," Journal of Electrochemical Society, G555-561, 2002.
134. Padovani, A. M., Riester, L., Rhodes, L., Allen, S. A., and Kohl, P. A, "Chemically Bonded Porogens in Methylsilsesquioxane, Part II: Electrical, Optical, and Mechanical Properties," Journal of the Electrochemical Society , F171-180, 2002.
135. Y. Rao, S. Ogitani, P. Kohl, C. P. Wong, "Novel polymer-ceramic Nanocomposite Based on High Dielectric Constant Epoxy Formula for Embedded Capacitor Application," J. Applied Polymer Science, Vol. 83, 1084-1090, 2002.
136. S. Nuttinck, E. Gebara, J. Laskar, J. Shealy, and M. Harris, "Improved RF Modeling Techniques for Enhanced AlGaN/GaN HFETs," IEEE Microwave and Wireless Components Letter, 140-142, 2003.
137. J. Wu, S. Bhattacharya, M. Wong, C. Lloyd, C. P. Wong, H. B. Pogge, R. Tummala, "Development of High- Performance Filling Encapsulants for System Chips Technology," IEEE Trans. on Components and Packaging Technologies, Vol. 25, No. 2, 217-223, 2002.
138. H. Li, L. Wang, K. Jacob and C. P. Wong, "Syntheses and characterizations of Thermally Degradable Epoxy Resins Part III," Journal of Polymer Science, Part A, Vol. 40, No. 11, 1796-1807, 2002.
139. R.Li, E.M.Tentzeris, J.Laskar, V.F.Fusco and R.Cahill, "Broadband Loop Antenna for DCS-1800/IMT-2000 Mobile Phone Handsets," IEEE Microwave and Wireless Components Letters, 305-307, 2002.
140. A. Pal, Y. Joshi, M. Beitelmal, C. Patel, T. Wenger, "Design and Performance Evaluation of a Compact Thermosyphon," IEEE Transactions on Components and Packaging Technologies, 601-607, 2002.
141. C. Ramaswamy, Y. Joshi, W. Nakayama, and W.B. Johnson, "High Speed Visualization of Boiling from an Enhanced Structure," Int. J. Heat Mass Transfer, 4761-4771, 2002.
142. S. Kalahasti and Y. Joshi, "Performance Characterization of a Novel Flat Plate Micro Heat Pipe Spreader," IEEE Transactions on Components and Packaging Technologies, 554-560, 2002.
143. S. S. Murthy, Y. Joshi and W. Nakayama, "Single Chamber Compact Thermosyphons With Micro-fabricated Components," IEEE Transactions on Components and Packaging Technologies, 156-163, 2002.
144. S. V. Garimella, Y. K. Joshi, A,. Bar-Cohen, R. Mahajan, K. C. Toh, V. P. Carey, M. Baelmans, J. Lohan, B. Sammakia, F. Andros, "Thermal Challenges in Next Generation Electronic Systems - Summary of Panel Discussions," IEEE Transactions on Components and Packaging Technologies, 569-576, 2002.
145. T. Meurer, Qu., J. and Jacobs, L.J., "Wave Propagation in Nonlinear and Hysteretic Media - A Numerical Study," Int. J. Solids and Structures, Vol. 39, 5585-5614, 2002.
146. O. Suzuki, Y.K. Joshi, W. Nakayama, "Dynamics of a Liquid Plug in a Capillary Powered by Vapor Explosion," Microelectronics Journal, 195-200, 2003.
147. L. Yuan, Y. Joshi, W. Nakayama, "Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon," Microscale Thermophysical Engineering, 163-179, 2003.
148. C. Ramaswamy, Y. Joshi and W. Nakayama, "Effects of Varying Geometrical Parameters On Boiling From Microfabricated Enhanced Structures," J. Heat Transfer, 103-109, 2003.
149. J. Guerra, D. Vezenov, L. Thulin, W. Haimberger, P. Sullivan, K. Nelson, E. N. Glytsis, and T. K. Gaylord, "Embedded nano-optic media for near-field high density optical data storage: modeling, fabrication, and performance," Proc. SPIE, vol. 4342, 285-293, 2002.
150. C. Tavernier, R. Henderson and J. Papapolymerou, "A Reduced Size Silicon Micromachined High-Q Cavity Resonator at 5.7 GHz," IEEE Transactions on Microwave Theory & Techniques, 2305-2314, 2002.
151. J. Papapolymerou, K. Lange, C. Goldsmith, A. Malczewski and J. Kleber, "Reconfigurable double stub tuners using MEMS switches for intelligent RF front ends," IEEE Transactions on Microwave Theory & Techniques, 271-278, 2003.
152. E. Anemogiannis, E. N. Glytsis, and T. K. Gaylord, "Transmission Characteristics of Long-Period Fiber Gratings having Arbitrary Azimuthal/Radial Refractive-Index Perturbations," J. Lightwave Technology, 218-227, 2003.
153. Wu, X., Reed, H.A., Rhodes, L.F., Elce, E., Ravikiran, R., Shick, R.A., Henderson, C.L., Bidstrup Allen, S.A., Kohl, P.A.  , "Photoinitiation systems and thermal decomposition of photodefinable sacrificial materials," Journal of Applied Polymer Science, 1186-1195, 2003.
154. M. M. Bibby and A. F. Peterson, "High accuracy calculation of the magnetic vector potential on surfaces," Applied Computational Electromagnetics Society (ACES) Journal, 12-22, 2003.
155. Jayachandran, J.P., Reed, H.A., Zhen, H., Rhodes, L.F., Henderson, C.L., Bidstrup Allen, S.A., Kohl, P.A.  , "Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates," Journal of Microelectromechanical Systems, 147-159, 2003.
156. C.H.Lee, A.Sutono, S.Han, K.Lim, S.Pinel, J.Laskar and E.M.Tentzeris, "A Compact LTCC-based Ku-band Transmitter Module," IEEE Transactions on Advanced Packaging, Vol. 25, No. 3, pp. 374-384, 2002.
157. Xue, Y., Jairazbhoy, V.A., Niu, X. and Qu, J., "Large Deflection of Thin Plates under Certain Mixed Boundary Conditions - Cylindrical Bending," J. Electronic Packaging, Vol. 125, 53-58, 2003.
158. A. Sutono, J. Laskar, W. R. Smith, "Design of miniature multilayer on-package integrated image-reject filters," IEEE Transactions on Microwave Theory and Techniques, 156-162, 2003.
159. Geddes, D., Seo, S., Jokerst, N, "A Bi-Directional Optical Link Using a Stacked Thin Film Emitter and Detector," IEEE Photonics Technology Letters, 455-457, 2003.
160. Lee, H. Y., and Qu., J., "Microstructure, Adhesion Strength and Failure Path at a Polymer/Roughened Metal Interface," J. Adhesion Science and Technology, Vol. 17, 195-215, 2003.
161. Ferguson, T. and Qu, J., "Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials," J. Electronic Packaging, Vol. 125, 24-30, 2003.
162. Xue, Y. and Qu, J., 2003, "On the Energy Release Rate of Elliptical Cracks in Anisotropic Elastic Media," Chinese Journal of Mechanics-Series A, Vol. 19, 233-239, 2003.
163. X.J. Wei and Y. Joshi, "Optimization Study of Stacked Micro-channel Heat Sinks for Micro-electronic Cooling," IEEE Transactions on Components and Packaging Technologies, 55-62, 2003.
164. Z. Zhang, C. P. Wong, "Assembly of Lead-free Bumped Flip-chip with No Flow Underfills," IEEE Trans. On Electronic Packaging Manufacturing, Vol. 25, No. 2, 113-119, 2002.
165. N. Imam, E. N. Glytsis, and T. K. Gaylord, "Spatially Varying Effective Mass Effects on Energy Level Populations in Semiconductor Quantum Devices," Superlattices and Microstructures, 1-9, 2002.
166. T. Kim and G. May, "Time Series Modeling of Photosensitive Polymer Development Rate for Via Formation Applications," IEEE Trans. Elec. Pack. Manufac., 203-209, 2002.
167. Z. Zhang, C.P. Wong, "Study on the Catalytic Behavior of Metal Acetylacetonates for Epoxy Curing Reactions," Journal of Applied Polymer Science, vol. 86, 1572-1579, 2002.
168. R. A. Villalaz, E. N. Glytsis, and T. K. Gaylord, "Volume Grating Couplers: Polarization and Loss Effects," Appl. Optics, 5223-5229, 2002.
169. C. C. Montarou, T. K. Gaylord, R. A. Villalaz, and E. N. Glytsis, "Colorimetry-Based Retardation Measurement Method Using White-Light Interference," Appl. Optics, 5290-5297, 2002.
170. S. Luo, T. Yamashita, C. P. Wong, "Study on Property of Underfill Based on Epoxy Cured with Acid Anhydride for Flip Chip Application," J. Electronics Manufacturing, Vol. 10, No. 3, 191-200, 2002.
171. B. L. Bachim and T. K. Gaylord, "Automated flexure testing of axially rotated optical fiber gratings," Rev. Sci. Instr., 3454-3457, 2002.
172. Y. Rao, J. Yue, C. P. Wong, "Materials characterizations of High Dielectric Constant Polymer-ceramic Composite for Embedded Capacitor for RF Application," Active and Passive Elec. Comp., Vol. 25, 123-129, 2002.
173. Z. Zhang, E. Beatty, C.P. Wong, "Study on the Curing Process and the Gelation of Epoxy/Anhydride System for No-Flow Underfill for Flip-Chip Applications," Macromolecular Materials and Engineering, Vol. 288, 365-371, 2002.
174. L. Fan, Christopher K. Tison and C. P. Wong, "Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation," IEEE Transactions on Advanced Packaging, Vol. 25, No. 4, 473-480, 2002.
175. D.Staiculescu, J.Laskar and E.M.Tentzeris, "Design of Experiments Technique (DOE) for Microwave / Millimeter Wave Flip-Chip Optimization," International Journal of Numerical Modeling, Vol. 16, pp. 97-103, 2003.
176. S. Pannala and M. Swaminathan, "Extraction of S-Parameters from TDR/TDT Measurements using Rational Functions," International Journal of RF and Microwave Computer Aided Engineering, 74-85, 2003.
177. N. Imam, E. N. Glytsis, T. K. Gaylord, K. K. Choi, P. G. Newman, and L. Detter-Hoskin, "Quantum Well Infrared Photodetector Structure Synthesis: Methodology and Experimental Verification," IEEE J. Quantum Electronics, 468-477, 2003.
178. H. Li, A. Johnson, and C.P. Wong, "Development of New No-Flow Underfill Materials for Both Eutectic Solder and a High Temperature Melting Lead-Free Solder," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 1, 25-32, 2003.
179. F. Caliskan and A. F. Peterson, "The need for mixed-order representations with the locally-corrected Nyström method," IEEE Antennas and Wireless Propagation Letters, 72-73, 2003.
180. S. Nuttinck, B. Banerjee, S. Venkataraman, J. Laskar, and M. Harris, "High Temperature Performances of AlGaN/GaN Power HFETs," IEEE MTT-S 2003 International Microwave Symposium Technical Digest, 221-223, 2003.
181. Tanikella, R. V., Agraharam, S., Bidstrup Allen, S. A., Hess, D. W. and Kohl, P. A., "Moisture Absorption Studies of Fluorocarbon Films Deposited from Pentafluroethane and Octafluoroecyclobutane Plasmas," Journal of Electronic Materials, 1096-1103, 2002.
182. Tanikella, R. V., Kohl, P. A. and Bidstrup Allen, S. A., "Variable Frequency Microwave Curing of Benzocyclobutene," Journal of Appliced Polymer Science, 3055-3067, 2002.
183. Cho, S., Seo, S., Brooke, M., Jokerst, N., "Integrated Detectors for Embedded Optical Interconnections On Electrical Boards, Modules, and Integrated Circuits," IEEE Journal of Special Topics in Quantum Electronics: Integrated Optoelectronics, 1427-1434, 2002.
184. F. Ayazi, "The HARPSS Process for Fabrication of Precision MEMS Inertial Sensors," Mechatronics Elsevier Science Ltd., 1185-1199, 2002.
185. S.-D. Wu and E. N. Glytsis, "Holographic Grating Formation in Photopolymers: Parameter Determination Based on a Nonlocal Diffusion Model and the Rigorous Coupled-Wave Analysis," Optical Society of America Annual Meeting Program, OSA Annual Meeting/ILS-XVIII, 115, 2002.
186. B. L. Bachim, M. I. Braiwish, D. D. Davis, T. K. Gaylord, E. N. Glytsis, S. E. Mettler, G. D. VanWiggeren, "Variable Attenuation and Wavelength Tuning of Flexed CO2-Laser-Fabricated Long-Period Fiber Gratings in 1550nm Range," Optical Society of America Annual Meeting Program, OSA Annual Meeting/ILS-XVIII, 52, 2002.
187. B. L. Bachim, M. I. Braiwish, T. K. Gaylord, and E. N. Glytsis, "Spectral Characteristics of Flexed Long-Period Fiber Gratings Fabricated using UV and CO2 Lasers," Optical Society of America Annual Meeting Program, OSA Annual Meeting/ILS-XVIII, 126, 2002.
188. R. A. Villalaz, E. N. Glytsis, and T. K. Gaylord, "Wavelength-Dependent Characteristics of Volume Grating Couplers," Optical Society of America Annual Meeting Program, OSA Annual Meeting/ILS-XVIII, 115, 2002.
189. S. Hong and G. May, "Neural Network Based Time Series Modeling of Optical Emission Spectroscopy Data for Fault Prediction in Reactive Ion Etching," Proc. NSF Design and Manufacturing Research Conference, CDROM, 2003.
190. Glezer, A. and Amitay, M., "Synthetic Jets," Ann. Rev. Fluid Mechanics, 503-529, 2002.
191. A. Saxena, "The Role of Materials Science and Engineering in Interdisciplinary Education on Campus," FACETS, 2-3, 2002.

RF/Wireless Researchback

2001-2002:
1. E. Chen, D. Heo, J. Laskar, and D. Bien, “ 0.24-um CMOS Technology and BSIM RF Modeling for Bluetooth Power Applications,” Microwave Journal, Vol. 44, pp. 142-152, 2001.

2. A. Pham, R. Ramachandran, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, “Development of a Millimeter Wave System on a Package Utilizing an MCM Process,” IEEE Trans. on Microwave Theory and Techniques, Vol. 49, No. 10, pp. 1747-1749, Oct. 2001.

3. A. Sutono, D.Heo, E.Chen, K. Lim, J. Laskar, "High Q LTCC-based passive library for wireless system-on-package (SOP) module development," IEEE Transactions of Microwave Theory and Techniques, Vol. 49, No. 10, pp. 1715-1724, October 2001.

4. B. Matinpour, N. Lal, J. Laskar, R. E. Leoni III, and C. S. Whelan, "K-Band Receiver Front-Ends in GaAs Metamorphic HEMT Process," IEEE MTT Special Issue Transactions, vol. 49, No. 12, pp. 2459-2463, Dec. 2001.

5. Nuttinck, S., Gebara, E., Laskar J., Wagner, B., and Harris, M., “RF Performance And Thermal Analysis of AlGaN/GaN Power HEMTs in Presence of Self-Heating Effects,” IEEE MTT-S 2002 International Microwave Symposium Technical Digest, pp. 921-924, June 2002.

6. Nuttinck, S., Gebara, E., Laskar J., and Harris, M., “Study of Self-Heating Effects and Temperature-Dependent Modeling And Pulsed Load-Pull Measurements on GaN HEMTs,” IEEE Trans. on Microwave Theory and Techniques, Vol. 49, No. 12, pp. 2579-2587, Dec. 2001.

7. N. Bushyager and M.M.Tentzeris, "RF MEMS: Development of Design Rules", Proc. of the 2001 Interpack (Pacific Rim/International, Intersociety, Electronic Packaging Technical Conference), Kauai, HA, July 2001.

8. N. Bushyager, A.Obatoyinbo, M.Tentzeris and J.Laskar, "Multilayer Package Modeling Using the Multiresolution Time-Domain Technique", Proc. of the 2001 IEEE AP-S Symposium Boston, MA, July 2001, pp.IV.806-809.

9. A. Sutono, C.Lee, A.Obatoyinbo, K.Lim, M.Tentzeris and J.Laskar, "Development of Highly Integrated 3D Microwave-Millimeter Wave Radio Front-End System-on-Package (SOP)", Invited Paper in the 2001 European GaAs Conference 2001, London, England, September 2001, pp.235-238.

10. A. McGarvey and M.Tentzeris, "Coupling of Solid-State and Electromagnetic Equations for Simulation of Wireless Packaged Geometries", Proc. of the 2001 European Microwave Symposium, London, England, September 2001, pp.217-220. (vol.I)

11. G.E. Ponchak, J.Papapolymerou and M.Tentzeris, "Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si", Proc. of the 2001 European Microwave Symposium, London, England, September 2001, pp.25-28. (vol.I).

12. A. McGarvey, R.Cicconetti, N.Bushyager, E.Dalton and M.Tentzeris, "Beowulf Cluster Design for Scientific PDE Models", Proc. of the 2001 Annual Linux Showcase, Oakland, CA, November 2001.

13. N. Bushyager, E.Dalton, J.Papapolymerou and M.Tentzeris, "Modeling of Large Scale RF-MEMS Circuits Using Efficient Time-Domain Techniques", Invited Paper in the 2002 ACES Conference, Monterey, CA, pp.49-54, 2002.

14. N. Bushyager, K.Lange, M.Tentzeris and J.Papapolymerou, "Modeling and Optimization of RF-MEMS Reconfigurable Tuners with Computationally Efficient Time-Domain Techniques", Proc. 2002 International Microwave Symposium, Seattle, WA, June 2002, pp.883-886.

15. G.E. Ponchak, E.Dalton, E.M.Tentzeris and J.Papapolymerou, "Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMIC's on Si", Proc. 2002 International Microwave Symposium, Seattle, WA, June 2002, pp.2221-2224.

16. J. Papapolymerou, G.E.Ponchak and E.M.Tentzeris, "A Wilkinson Power Divider on a Low Resistivity Si Substrate with a Polyimide Interface Layer for Wireless Circuits", Proc. 2002 International Microwave Symposium, Seattle, WA, June 2002, pp.593-596.

17. S. Pinel, S.Chakraborty, M.Roellig, R.Kunze, S.Mandal, H.Liang, C.H.Lee, R.Li, K.Lim, G.White, M.Tentzeris and J.Laskar, “3D Integrated LTCC Module Using microBGA Technology for Compact C-Band RF Front-End Module”, Proc. 2002 International Microwave Symposium, pp.1553-1556, 2002.

18. M.F. Davis, S.-W.Yoon, S.Mandal, N.Bushyager, M.Maeng, K.Lim, S.Pinel, A.Sutono, J.Laskar, M.Tentzeris, T.Nonaka, V.Sunderam, F.Liu and R.Tummala, “RF-Microwave Multiband Design Solutions for Multilayer Organic System-on-Package Integrated Passives”, Proc. 2002 International Microwave Symposium, pp.2217-2221, 2002.

19. G. DeJean, R.L.Li, E.Tsai, M.Tentzeris and J.Laskar, "Novel Small Folded Shorted-Patch Antennas", Proc. 2002 IEEE AP-S Symposium, San Antonio, TX, June 2002, pp.26-29 (Vol.IV).

20. M. Tentzeris, R.L.Li, K.Lim, M.Maeng, E.Tsai, G.DeJean and J.Laskar, "Design of Compact Stacked-Patch Antennas on LTCC Technology for Wireless Communication Applications", Proc. 2002 IEEE AP-S Symposium, San Antonio, TX, June 2002, pp.500-503 (Vol.II).

21. A. Bacon, G.Ponchak, J.Papapolymerou, N.Bushyager and M.Tentzeris, “Folded Coplanar Waveguide Slot Antenna on Silicon Substrates with a Polyimide Interface Layer”, Proc.2002 IEEE AP-S Symposium, San Antonio, TX, June 2002, pp.432-435 (Vol.II).

22. A. Sutono, G.Cafaro, J.Laskar and M.Tentzeris, "Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects", IEEE Trans. on Advanced Packaging, Vol.24, No.2, pp.595-603, November 2001.

23. M. Tentzeris, A.Cangellaris, L.P.B.Katehi, J.Harvey, "Multiresolution time-domain (MRTD) adaptive schemes using arbitrary resolutions of wavelets", IEEE MTT Journal, Vol.50, No.2, pp.501-516, March 2002.

24. K. Lim, S.Pinel, M.Davis, A.Sutono, C.-H.Lee, D.Heo, A.Obateyinbo, J.Laskar, E.M.Tentzeris, R.Tummala, "RF-System-On-Package (SOP) for Wireless Communications", IEEE Microwave Magazine, Vol.3, No.1, pp.88-99, March 2002.

25. N. Bushyager, B.McGarvey and E.M.Tentzeris, "Introduction of an Adaptive Modeling Technique for the Simulation of RF Structures Requiring the Coupling of Maxwell's, Mechanical and Solid-State Equations", Applied Computational Electromagnetics (ACES) Society Journal, Vol.17, No.1, pp.104-111, March 2002.

26. Venky Sundaram, Sidharth Dalmia, Joseph Hobbs, Swapan Bhattacharya, Madhavan Swaminathan, George White, Rao Tummala, "Recent Advances in SOP Integration," Proceedings of the 2001 International Conference on Solid State Materials and Devices, September 2001. PAGE #S

27. S.Pinel, S. Charkrabrty, M. Roellig, R. Kunze, S. Mandal, H. LIang, C-H Lee, R. Li, K. Lim, G. White, M. Tentzeris, and J. Laskar, "3D Integrated LTCC Module using MicroBGA technology for compact C-band RF Front-End Module", Proceedings of IMS 2002, Seattle, Washington PAGE #S

2000-2001:
E.M.Tentzeris, D.Staciulescu, N.G.Cafaro and J.Laskar, "Design and Optimization of Novel RF Packaging Structures Using Multiresolution and Statistical Schemes", Invited Paper in the PIERS 2000, Boston, MA, July 5-14, 2000, p.384.

N.Bushyager, B.McGarvey and E.M.Tentzeris, "Modeling of Photonic Bandgap (PBG) Devices Using MRTD Adaptive Schemes", Invited Paper in the PIERS 2000, Boston, MA, July 5-14, 2000, p.58.
A.Sutono, N.G.Cafaro, J.Laskar and E.M.Tentzeris, "Experimental study and modeling of microwave bond wire interconnects ", Proc. of the 2000 AP-S Symposium, Salt Lake, UT, July, 2000, pp.2020-2023.

B.McGarvey, D.Staciulescu, E.M.Tentzeris and J.Laskar, "Adaptive Modeling of Complex Packaging Geometries Using Haar-based MRTD Algorithms", Proc. of the 2000 European Microwave Conference, Paris, France, October, 2000, pp.413-416 (Vol.I).

G.E.Ponchak, E.M.Tentzeris and J.Papapolymerou, "Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si", Proc. of the 2001 International Microwave Symposium, Phoenix, AZ, May 2001, pp.1723-1726.

N.Bushyager, M.M.Tentzeris, L.Gatewood and J.DeNatale, "A Novel Adaptive Approach to Modeling MEMS Tunable Capacitors Using MRTD and FDTD Techniques", Proc. of the 2001 International Microwave Symposium, Phoenix, AZ, May 2001, pp.2003-2006.

N.Bushyager and M.M.Tentzeris, "Modeling and Design of RF MEMS Structures Using Computationally Efficient Numerical Techniques", Proc. of the 2001 Electronic Components and Technology Conference, Lake Buena Vista, FL, May 2001, pp.324-327.

E.M.Tentzeris, "Numerical Techniques in RF and Microwave Design", Invited Section for the Book: "The RF and Microwave Handbook" edited by M.Golio, pp.8.13-8.34, CRC Press, 2000.

J.Laskar, E.M.Tentzeris, J.Schutt-Aine and R.Tummala, "Fundamentals of RF Packaging", Invited Chapter for the Book:"Fundamentals of Microsystems Packaging" edited by R.Tummala, pp.500-541, McGraw-Hill, 2001.

S. Han, C.H. Lee, B. Matinpour, J. Laskar, and D.J. Blumenthal, "Fully monolithic four-channel transmitter IC for RF/Optical subcarrier multiplexed communications," IEEE Microwave and Guided Wave Letters, vol. 10, pp. 282-284, July 2000.

C-H.Lee, S.Han, B.Matinpour, and J.Laskar, "A Low Phase Noise X-Band MMIC GaAs MESFET VCO," IEEE Microwave and Guided Wave Letters, Vol. 10, pp. 325-327, August 2000.

D.Staiculescu, J.Laskar, and E.M.Tentzeris, "Design Rule development for Microwave Flip-Chip Applications," IEEE Transactions on Microwave Theory and Techniques, Vol 48, pp. 1476-1481, September 2000.

D. Heo, E. Gebara, Y. Chen, S. Yoo, M. Hamai, Y. Suh, and J. Laskar, "An Improved Deep Submicrometer MOSFET RF Nonlinear Model with New Breakdown Current Model and Drain-to-Subtrate Nonlinear Coupling," IEEE Transactions on Microwave Theory and Techniques, Vol 48, pp. 2361-2369, December 2000. Winner of Best Student Paper Award for 1999 IEEE International Microwave Symposia.

H.Liang, H.Barnes, J.Laskar, and D.Estreich, "Application of Digital PGA Technology to K-band Microcircuit and Microwave Subsystem Packages," IEEE Transactions on Microwave Theory and Techniques, Vol 48, pp. 2644-2651, Dec. 2000.

M.R. Murti, J. Laskar, S. Nuttinck, S. Yoo, A. Raghavan, J.I. Bergman, J. Bautista, R. Lai, R. Grundbacher, M. Barsky, P. Chin, and P.H. Liu, "Temperature-Dependent Small-Signal and Noise Parameter Measurements and Modeling on INP HEMTs," IEEE Transactions on Microwave Theory and Techniques, Vol 48, pp. 2579-2587, Dec. 2000.

B. Matinpour, S. Chakraborty, and J. Laskar, "Novel DC-Offset Cancellation Techniques for Even-harmonic Direct Conversion Receivers," IEEE Transactions on Microwave Theory and Techniques, Vol 48, pp. 2554-2559, Dec. 2000.

A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, "Development of microwave multi-layer plastic-based multi-chip modules," IEEE Trans. on Advanced Packaging, Vol. 24, pp. 37-40, Feb. 2001.

E. Chen, D. Heo, J. Laskar, and D. Bien, " 0.24-um CMOS Technology and BSIM RF Modeling for Bluetooth Power Applications," Microwave Journal, Vol. 44, pp. 142-152, 2001.

Nuttinck, S., Gebara, E., Laskar J., and Harris, M. " Study of Self-Heating Effects in GaN HEMTs", IEEE MTT-S 2001 International Microwave Symposium Technical Digest, pp. 461-464, May 2001.

D. Heo, A. Sutono, E. Chen, Y. Suh, J. Laskar, "A 1.9GHz DECT CMOS power amplifier with fully integrated multiplayer LTCC passives," IEEE Microwave and wireless Components Lett., Vol. 11, pp. 249-251, June 2001.

H. Liang, J. Laskar, M. Hyslop, R. Panicker, "Development of a 36GHz millimeter-wave BGA package," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 1, pp. 65-68, June 2000.
H. Liang, J. Laskar, H. Barnes, D. Estreich, "Application of digital PGA technology to 20GHz microwave packages," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 2, pp. 1051-1054, June 2000.

B. Matinpour, S. Chakraborti, M. Hamai, C. Chun, J. Laskar, "A novel DC-offset Cancellation Technique for Subharmonic Direct Conversion Receivers," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 2, pp. 631-634, June 2000.

D. Heo, S, Yoo, E. Chen, E. Gebara, M. Hamai, J. Laskar, "An Improved Deep-Submicron MOSFET Large Signal Model Incorporating a New Breakdown Model and Drain to Substrate Nonlinear Coupling, " Presented at the IEEE International Microwave Symposium, Boston MA, , Vol. 2, pp. 745-748, June 2000.

E. Chen, M. Hamai, D. Heo, A. Sutono, and J. Laskar, "RF CMOS Power Amplifier Integration," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 1, pp. 545-548, June 2000.
S. Yoo, C-H. Lee, B. Matinpour, S. Chakraborty, J. Laskar, "A 5.8Ghz OFDM GaAs MESFET MMIC chip set," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 3, pp. 1273-1276, June 2000.

M.R. Murty, S. Yoo, A. Raghavan, S. Nuttinck, R. Lai, J. Bautista and J. Laskar, "Temperature-dependent noise parameters and modeling of InP/InAlAs/InGaAs HEMTs," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 2, pp. 1241-1244, June 2000.

Y. Suh, E. Seok, J.-H. Shin, B. Kim, D. Heo, A. Raghavan, and J. Laskar, "Direct Extraction Method for Internal Equivalent Circuit Parameters of HBT Small-Signal Hybrid-p model," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 3, pp. 1401-1404, June 2000.

A. Sutono, J. Laskar, W.R. Smih, " Development of integrated three dimensional Bluetooth image reject filter," Presented at the IEEE International Microwave Symposium, Boston MA, Vol. 1, pp. 339-342, June 2000.

V. Hietala, C. Chun, J. Laskar, K. Choquette, A. Allerman, J. Hindi, "Two-dimensional 8x8 photoreceiver array and VCSEL drivers for high-throughput optical data links," Presented at the GaAsIC Symposium, 2000, pp. 189-192.

E. Chen, D. Heo, M. Hamai, J. Laskar, and D. Bien, " 0.24-um CMOS Technology for Bluetooth Power Applications," Proceedings, 2000 IEEE Radio and Wireless Conference, pp. 163-166, September 2000.

D. Staiculescu, A. Sutono, J. Laskar, " Wideband Scaleable Electrical Model for Microwave/Millimeter Wave Flip Chip Interconnects," Presented at the 2000 IEEE EPEP Topical Meeting, Scottsdale, AZ, , pp.99-102, October 23-25.

J.Laskar, E.M.Tentzeris, A.Sutono, H.Liang, N.Bushyager and K.Lim, "Next Generation Packaging Architectures for Highly Integrated Wireless Systems", Proc. of the 2000 European Microwave Conference, Paris, France, October, 2000, pp.136-139 (Vol.III).

D.Staciulescu, J.Laskar and E.M.Tentzeris, "Flip ChipDesign Rule Development for Multiple Signal and Ground Bump Configurations" Proc. of the 2000 Asia-Pacific Microwave Conference Sydney, Australia, December, 2000,pp.136-139

M.F. Davis, A. Sutono, K. Lim, J. Laskar and R. Tummala, " Multi-layer fully organic-based System on Package (SOP) technology for RF applications," presented at the 2000 IEEE EPEP Topical Meeting, Scottsdale, AZ, , pp.103-106, October 23-25.

A. Sutono, D. Heo, E. Chen, K. Lim, J. Laskar, " Compact implementation of component library in LTCC technology and its application to CMOS RF power amplifier design," Presented at the 2000 IEEE EPEP Topical Meeting, Scottsdale, AZ, pp.288-291, October 23-25, 2000.

C.-H. Lee, S. Han, B. Matinpour, and J. Laskar, " GaAs MESFET-based MMIC VCO with low phase noise performance," IEEE GaAS IC Symposium, pp. 95-98, November 2000.

S. Han, C.-H. Lee, B. Matinpour, and J. Laskar, " Single MMIC Transmitter Module for Four Channel Optical Subcarrier Multiplexed Communications Applications," IEEE GaAS IC Symposium, pp. 111-114, November 2000.

D. Heo, A. Sutono, E. Chen, E. Gebara, Y. Yoo, Y. Suh, J.Laskar, and E.M. Tertzeris, "A High Efficiency 0.25-mm CMOS PA with LTCC Multi-layer High-Q Integrated Passives for 2.4 GHz ISM Band," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 2, pp. 915-918, May 2001.

S. Nuttinck, E. Gebara, J. Laskar, and M. Harris, "Study of Self-heating Effects in GaN HEMTs," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 3, pp. 2151-2154, May 2001.

C-H. Lee, A. Sutono, S. Han, and J. Laskar, "A Compact LTCC Ku-band Transmiitter Module with Integrated Filter for Satellite Communication Applications," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 2, pp. 945-948., May 2001.

M.F.Davis, A.Sutono, K.Lim, J.Laskar, V.Sundaram, J.Hobbs, G.E.White, and R.Tummala, "RF-Microwave Multi-Layer Integrated Passives using Fully Organic System on Package (SOP) Technology," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 3, pp. 1731-1734., May 2001.

Y.Suh, D.Heo, A.Raghavan, E.Gebara, S.Nuttnick, K.Lim, and J.Laskar, "Direct Extraction and Modeling method for Temperature Dependeant Large Signal CAD Model of Si-BJT," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 2, pp. 971-973, May 2001.

B.Matinpour, N.Lal, J.Laskar, R.E.Leoni III, and C.S.Whelan, "A K-Band Subharmonic, Down-Converter in a GaAs Metamorphic HEMT Process," Presented at IEEE International Microwave Symposium, Phoenix,, Vol. 2, pp.1337-1339, May 2001.

B.Matinpour, A.Sutono, and J.Laskar, "A Low-Power Direct Conversion Receiver Module for C-Band Wireless Applications," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 1,pp 567-570, May 2001.

B. Matinpour, and J. Laskar, "A Highly Integrated Low-Power Direct Conversion Receiver MMIC for Broadband Wireless Applications," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 2, pp. 1089-1091, May 2001.

A.Raghavan, E.Gebara, C-H.Lee, S.Chakraborty, D.Mukherjee, J.Bhattacharjee, D.Heo, and J.Laskar, "A GaAS HBT OFDM Transmitter MMIC Chip Set," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 1, pp. 571-574, May 2001.

E. Chen, Y.Yoon, J.Laskar, and M.Allen, "A 2.4 GHz Integrated CMOS Power Amplifier with Micromachined Inductors," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 1, pp. 523-526, May 2001.

H.Liang, J.Laskar, H.Barnes, and D.Estreich, "Design and Optimization for Coaxial-to-Microstrip Transition on Multilayer Substrates," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 3, pp. 1915-1918., May 2001.

K.Lim, A.Obatoyinbo, A.Sutono, S.Chakraborty, C-H.Lee, E.Gebara, A.Raghavan, and J.Laskar, "A Highly Integrated Transceiver Module for 5.8 GHz OFDM Communication System using Multi-layer Packaging Technology," Presented at IEEE International Microwave Symposium, Phoenix, Vol. 3, pp. 1739-1742, May 2001.

1999-2000:
E.Tentzeris, J.Harvey and L.P.B.Katehi, "Time Adaptive Time-Domain Techniques for the Design of Microwave Circuits", IEEE Microwave and Guided Wave Letters, Vol.9, No.3, pp.96-98, 1999.

A. Sutono, A. Pham, J. Laskar, W. R. Smith, "Investigations of multi-layer ceramic-based MCM technology," IEEE Transactions on Advanced Packaging, vol.22, no.3, pp. 326-331, August 1999.

S. Yoo,M.R. Murti, D. Heo, J. Laskar and S. Taylor, "A C-band Low Power High Dynamic Range GaAs MESFET Low Noise Amplifier," Microwave Journal, pp.90-100, February,2000.

D. Staiculescu, J. Laskar and J. Mather, "Design Rule Development for Microwave Flip Chip Applications", IEEE EPEP Topical Meeting, pp. 231-234, San Diego CA, October 1999.
D. Staiculescu, J. Laskar, J. Mendelsohn, E. Sweetman, D. Rudy, I Artaki - "Ni-Au surface finish effects on RF perfoamance" - presented at the 1999 IEEE IMS Symposium, Annaheim, CA, pp. 1909-1912, June 6-11,1999.

D. Staiculescu, J. Laskar, J. Mather - "Design rule development for microwave flip chip applications", Proceedings of the 1999 IEEE EPEP Topical Meeting - San Diego, CA - October 25 - 27, pp.231-234, 1999.

S. Yoo, D. Heo, J. Laskar and S. Taylor, "A C-band Low Power High Dynamic Range GaAs MESFET Low Noise Amplifier," IEEE Radio and Wireless Conference Digest 1999, Denver, CO, pp.191-194, August 1999.

E. Chen, D. Heo, J. Laskar and T. Anderson, "Investigation of Q Enhancement for Inductors Processed in BiCMOS Technology," IEEE Radio and Wireless Conference Digest 1999, Denver, CO, pp.263-266, August 1999.

G.E.Ponchak and E.M.Tentzeris, "Finite Ground Coplanar (FGC) Waveguide 90 Degree E.Tentzeris, R.Robertson, J.Harvey amd L.P.B.Katehi, "Stability and Dispersion Analysis of Battle-Lemarie Based MRTD Schemes", IEEE MTT Journal, Vol.47, No.7, pp.1004-1013, July 1999.

E.Tentzeris, J.Harvey and L.P.B.Katehi, "Time Adaptive Time-Domain Techniques for the Design of Microwave Circuits", IEEE Microwave and Guided Wave Letters, Vol.9, No.3, pp.96-98, 1999

1998-1999:
Pham, J. Laskar, V. Krishnamurthy, H. Cole, T., and Sitnik-Nieters, "Ultra low loss millimeter wave multichip module interconnects," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 21, pp. 302-308, Aug. 1998.

D. Klotzkin, K. Kamath, K. Vineberg, P. Bhattacharya, R. Murty and J. Laskar, "Enhanced Bandwidth of Self-Organized Quantum Dot Lasers at Cryogenic Temperatures: Role of Carrier Relaxation and Differential Gain," IEEE Photonic Technology Letters, vol. 10, no. 7, pp. 932-934, July 1998.

A. Sutono, A. Pham, J. Laskar, W.R. Smith, "Investigations of Multilayer Ceramic Based MCM Technology", IEEE EPEP Digest, pp.83-86, 1998.

E.Tentzeris, M.Krumpholz, N.Dib, J.-G.Yook and L.P.B.Katehi, "FDTD Characterization of Waveguide Probe Structures", IEEE MTT Journal, Vol.46, No.10, pp.1452-1460, October 1998.

D. Staiculescu, H. Liang, J. Laskar, J. Mather - " Full wave analysis and development of circuit models for flip-chip interconnects" - presented at the 1998 IEEE EPEP Topical Meeting - West Point, NY, pp. 241-244, October 26-28 1, 1998.

J.I. Bergman, J. Chang, Y. Joo, B. Matinpour, J. Laskar, N. M. Jokerst, M. A. Brooke, B. Brar, and E. Beam III, "RTD/CMOS Nanoelectronic Circuits: Thin Film InP-Baes Resonant Tunneling Diodes Integrated with CMOS Circuits," IEEE Electron Device Lett., vol. 20, pp. 119-122, March 1999.

P. Bhattacharya, K. Kamath, J. Singh, D. Klotzkin, J. Phillips, H.T. Jiang, N. Chervela, T. Norris, T. Sosnowski, J. Laskar and Ramana Murty, "In(Ga)As/GaAs Self-organizes Quantum Dot Lasers: DC and Small Signal Modulation Properties" IEEE Transactions on Electron Devices, vol. 46, no. 5, page 871, May 1999.

D. Heo, E. Chen, E. Gebara, S. Yoo, J. Laskar and T. Enderson, "Temperature Dependent MOSFET RF Large Signal Model Incorporating Self- heating Effects," IEEE International Microwave Symposium, Anaheim CA, pp.415-418, June 1999.

A. Sutono, A. Pham, J. Laskar, W.R. Smith, "Development of Three Dimensional Ceramic-Based MCM Inductors for Hybrid RF-Microwave Applications," IEEE-RFIC Symposium Digest, Anaheim CA, pp. 175-178, June 1999.

H. Liang, A. Sutono, J. Laskar, W.R. Smith, "Material Parameter Characterization of Multi-Layer LTCC and Implementation of High Q Resonators," IEEE-MTT Digest, Anaheim CA, Vol.4, pp. 1901-1904, June 1999.

B. Matinpour and J. Laskar, "A Compact Direct Conversion Receiver for C-band Wireless Applications," IEEE RFIC Symposium, Anaheim CA, pp. 25-28, June 1999.

B. Matinpour, J. Bergman, C. Chun, J. Laskar and N. M. Jokerst, "Mixed Material Integration for Power Amplifier MMICs," IEEE MTT International Microwave Symposium, Anaheim CA, Vol. 2, pp. 625-628, June 1999.

S. Han, C-H Lee, B. Matinpour, J. Laskar, and D. Blumenthal "Four Channel MMIC-Based Transmitter Module for RF/Optical Subcarrier Multiplexed Communications" IEEE MTT-S International Microwave Symposium, Anaheim CA, vol. 3, pp. 1121-1124, June 1999.

C-H. Lee, S. Han, J. Laskar, "GaAs MESFET Dual-Gate Mixer with Active Filter Design for Ku-Band Applications," IEEE MTT-S International Microwave Symposium, vol. 2, pp. 841-844, June 1999.
Harris, H.M., Wagner, B., Halpern, S., Dobbs, M., Pagel, C., Stuffle, B., Henderson, J. and Johnson, K., "Full Two-dimensional Electroluminescent Analysis of GaAs/AlGaAs HBTs", 1999 International Reliability Physics Symposium Proceedings, pp. 121-127, March 1999.

1997-1998:
Chun, C., Pham, A., Hutchison, B., and Laskar, J., " Development of microwave package model utilizing on-wafer measurement techniques," IEEE Transactions on Microwave Theory and Techniques, vol. 45, pp. 1948-1954, October 1997.

Blumenthal, D. J., Laskar, J., Gaudino, R., Han, S., Shell, M., and Vaughn, M. D., " High-Performance Baseband Data and Subcarrier-Multiplexed Control Links in Fiber-Optic Networks and the Impact of MMIC Photonic/Microwave Interfaces," IEEE Trans. on Microwave Theory and Technology, vol. 45, pp. 1443-1452, August 1997.

Gebara, E., Laskar, J., Harris, M., and Kikel, T., " Development of Cryogenic Load-Pull Analysis: Power Amplifier Technology Performance Trends," 1998 IEEE International Microwave Symposium Digest, Vol. 3, pp. 1663-66, 1998.

Harris, M., Lesniak, C., Erichsen, C., Dobbs, M., " Design and Implementation of a Microwave Materials Database," 1998 IEEE International Microwave Symposium Digest, Vol. 3, pp. 1827-30, 1998.

Pham, A. V., Laskar, J., Mathis, A. W., Peterson, A. F., and Hayden, L., " Membrane probel technology for non-destructive thin film material characterization," Proceedings of the 1998 International Microwave Symposium, Baltimore, pp. 957-960, June 1998.

A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, and H. Cole, T. Sitnik-Nieters, " Development of Millimeter Wave Multi-layer Organic Based MCM Technology", IEEE IMS Digest, , vol. 2, pp. 1103-1106, June 1998

A. Pham, J. Laskar, and L. Hayden, "Membrane Probe Technology for Non-destructive Thin-Film Material Characterization," IEEE IMS Digest, , vol. 2, pp. 1659-1662, June 1998

D. Staiculescu, A. Pham, J. Laskar, S. Consolazio and S. Moghe - "Analysis and Performance of BGA Interconnects for RF Packaging"- Proceedings of 1998 IEEE RFIC Symposium - Baltimore, MD - June 7-9, pp. 131-134, 1998.

1996-1997:
Hao, J., Richter, A., Laskar, J., Swaminathan, M., and Mosley, J., "Characterization of a Small Peripheral Array Package," IEEE Transactions on Components, Packaging and Manufacturing Technology - Advanced Packaging (Special Issue), Vol. 19, No 3, p 512-517, Aug 1996.

Laskar, J., Bautista, J.J., Nishimoto, M., Hamai, M., and Lai, R., " Development of Accurate On-Wafer, Cryogenic Characterization Techniques," IEEE Transactions on Microwave Theory and Techniques. Vol. 44, pp. 1178-1183, July, 1996.

Evers, N., Laskar, J., Jokerst, N. M., Moise, T. S., and Kao, Y.-C., "DC and High Frequency Performance of Thin Film InP-based Tunneling Hot Electron Transfer Amplifiers," Applied Physics Letters, Vol. 70, no. 18, pp. 2452-2454, May 7, 1997.

1995-1996:
Hao, J., Richter, A., Laskar, J., Swaminathan, M., and Mosley, J., "Fequency Domain Measurements of VSPA: A Novel Packaging Technology",4th Topical Meeting on Electrical Performance of Electronic Packaging Proceedings, Portland, pp 113-136, Oct. `95.

Evers, N., Vendier, O., Chun, C., Murti, M. R., Laskar, J., Jokerst, N. M., Moise, T. S., and Kao, Y.-C., "Thin Film Pseudomorphic AlAs/In0.53Ga0.47As/InAs Resonant Tunneling Diodes Integrated onto Si Substrates," IEEE Electron Device Letters, vol. 17,
no. 9, pp.443-445, 1996.

Optoelectronicsback
(i) indicates books or book Articles

2001-2002:
1. A.S. Brown, N.M. Jokerst, A. Doolittle, M. Brooke and T.F. Kuech, “Heterogeneous Integration: From Substrate Technology to Active Packaging,” Proceedings of the 2001 IEEE International Electron Devices Meeting, pp. 9.3.1-9.3.4, Washington, DC, December 3 - 5, 2001 (Invited).

2. Chu, L.C. and Brooke, M. “A Study on Multi-user DSL Channel Capacity with Crosstalk Environment,” Proceedings of IEEE Pacific Rim, Conference on Communications, Computers and signal Processing, 2001, (PACRIM., 2001), pp. 176–179, August , 2001.

3. Chu, L.C.; Brooke, M., “Mitigation of Crosstalk on the SDSL Upstream Transmission with Vector Equalization,” ICC 2001. IEEE International Conference on Communications, Vol.1, pp. 165-169, 2001.

4. Chu, L.C., Brooke, M., “An Enhancement Study on the SDSL Upstream Receiver”, 2001 IEEE International Symposium on Circuits and Systems, ISCAS 2001, vol. 4, pp. 442-445, 2001.

5. N. Imam, E. N. Glytsis, and T. K. Gaylord, "Semiconductor intersubband laser/detector performance optimization using a simulated annealing algorithm," Superlattices Microstructures, vol. 30, pp. 29-43, July 2001.

6. J. M. Bendickson, E. N. Glytsis, and T. K. Gaylord, “Focusing Diffractive Cylindrical Mirrors: Rigorous Evaluation of Various Design Methods,” J. Opt. Soc. Am. A, vol. 18, pp. 1487-1494, Jul. 2001.

7. J. M. Bendickson, E. N. Glytsis, T. K. Gaylord, and A. F. Peterson, “Modeling Considerations for Rigorous Boundary Element Method Analysis of Diffractive Optical Elements,” J. Opt. Soc. Am. A, vol. 18, pp. 1495-1506, Jul. 2001.

8. J. M. Bendickson, E. N. Glytsis, T. K. Gaylord, and D. L. Brundrett, “Guided-mode Resonant Subwavelength Gratings: Effects of Finite Beams and Finite Gratings,” J. Opt. Soc. Am. A, vol. 18, pp. 1912-1928, Aug. 2001.

9. N. Imam, E. N. Glytsis, and T. K. Gaylord, “Optimization of Semiconductor Intersubband Laser/Detector Performance Parameters using a Simulated Annealing Algorithm,” Superlattices and Microstructures, vol. 30, No. 1, pp. 29-43, Jul. 2001.

10. E. N. Glytsis, “Two-Dimensionally-Periodic Diffractive Optical Elements: Limitations of Scalar Analysis,” J. Opt. Soc. Am. A, vol. 19, pp. 702-714, Apr. 2002.

11. G. Triplett, G. May, and A. Brown, "Use of Designed Experiments to Model a Molecular Beam Epitaxy Process for InAs/AlSb-based Devices," TechSolutions, Orlando, FL, July, 2001.

12. K. Lee, W. Doolittle, A. Brown, G. May, and S. Stock, "A Comparative Study on Surface Reconstruction of Wurtzite GaN on (0001) Sapphire by RF Plasma-Assisted Molecular Beam Epitaxy," J. Crystal Growth, vol. 231, pp. 8-16, 2001.

13. Y. Wang, Z. Wang, T. Brown, A. Brown, and G. May, "Interfacial Roughening in Lattice Matched GaInP/GaAs Heterostructures," Thin Solid Films, vol. 397, p. 162, 2001.

14. G. Triplett, G. May, and A. Brown, "Modeling Electron Mobility in MBE-Grown InAs/AlSb Thin Films for HEMT Applications Using Neural Networks," Proc. International Semiconductor Device Research Symposium, Washington, DC, Dec., 2001, pp. 264-265.

15. G. Triplett, A. Brown, and G. May, "Using Neural Networks for RHEED Modeling of Interfaces in AlGaSb- InAs HEMT Devices," Proc. International Conference on Compound Semiconductor Manufacturing Technology, San Diego, CA, Apr., 2002, pp. 157.

16. S. Seo, K. Lee, S. Kang, S. Huang, W. Doolittle, N. M. Jokerst, A. S. Brown, M. A. Brooke, “The Heterogenous Integration of GaN Thin Film Metal-Semiconductor-Metal Photodetectors Onto Silicon,” IEEE Photonics Technology Letters, Vol. 14, No. 2, pp. 185-187, Februrary, 2002.

17. A.S. Brown, N.M. Jokerst, A. Doolittle, M. Brooke and T.F. Kuech, “Hetrogeneous Integration: From Substrate Technology to Active Packaging,” Proceeding of the IEEE International Electronic Devices Meeting, Washington, DC, pp. 9.3.1-9.3.4, Dec. 2-5, 2001, Invited paper.

18. N. M. Jokerst, M. A. Brooke, A. S. Brown, M. Vrazel, S. Seo, S. Cho, R. Huang, I. Song, S. Hyun, “High Data Rate Access Network Interfaces That Everyone Can Afford,” Proceedings of the IEEE International Conference on Advances in Infrastructure for e-Business, e-Education, e-Science, and e-Medicine on the Internet, L’Aquila, Italy, pp. 24: 1-8, January 21-25, 2002, Invited paper.

19. Martin A. Brooke, April S. Brown, Michael Vrazel, Sang-Woo Seo, Sang-Yeon Cho, Rena Huang, Indal Song, Seok-Hun Hyun, and Hung-Fei Kuo, “Toward terabit integrated optoelectronic interconnections for system on a chip and system on a package implementations,” Proceedings of the Wireless Design Conference, London, England, May 15-18, 2002.

20. S. Cho, M. Thomas, D. Kim, N. Jokerst, and M. Brooke, “Polymer waveguide optical interconnections on Si CMOS circuits,” Proceedings of the IEEE Conference on Lasers and Electro-Optics, Long Beach, CA, p. 161, May, 2002.
21. D. L. Geddis and N. M. Jokerst, “Co-located Stacked Thin-film Bi-directional Device,” Proceedings of the IEEE Conference on Lasers and Electro-Optics, Long Beach, CA, pp. 138-139, May, 2002.

22. S. Cho, N. Jokerst, “Polymer waveguide optical interconnections for electrical interconnection substrates,” Proceedings of the IEEE Conference on Lasers and Electro-Optics, Long Beach, CA, pp. 161-162, May, 2002.

23. S. Seo, S. Kang, S. Huang, K. Lee, W. Doolittle, N. Jokerst, A. Brown, M. Brooke, “Thin film GaN metal-semiconductor-metal photodetectors integrated onto silicon,” Proceedings of the IEEE Conference on Lasers and Electro-Optics, Long Beach, CA, pp. 630-631, May, 2002.

24. S. Seo, K. Lee, S. Kang, S. Huang, W. Doolittle, N. M. Jokerst, and A. S. Brown, “GaN Metal-Semiconductor-Metal Photodetectors Grown on Lithium Gallate Substrates by Molecular-Beam Epitaxy,” Applied Physics Letters, Vol. 79, Issue 9, pp. 1372-1375, 2001.

2000-2001:
Polymer Metal Nanocluster Composites, in Functionalization and Surface Treatment of Nanoparticles, Ed. M.-I. Baraton, "Advances in Nanoscale Materials and Nanotechnology" Book Series, Limoges, France, to appear in September 2001.

N. Imam, E. N. Glytsis, T. K. Gaylord, and E. Anemogiannis, "Dipole Matrix Elements of Semiconductor Intersubband Quantum Structures," Superlattices and Microstructures, vol. 28, no. 1, pp. 11-28, July 2000.

D. L. Brundrett, E. N. Glytsis, T. K. Gaylord, and J. M. Bendickson "Effects of Modulation Strength in Guided-Mode Resonant Subwavelength Gratings at Normal Incidence," J. Opt. Soc. Am. A,, vol. 17, no. 7, pp. 1221-1230, July 2000.

G. D. VanWiggeren, T. K. Gaylord, D. D. Davis, E. Anemogiannis, B. D. Garrett, M. I. Braiwish, and E. N. Glytsis, "Axial Rotation Dependence of Resonances in Curved CO2-Laser-Induced Long-Period Fibre Gratings" Electronic Letters, vol. 36, no. 16, pp. 1354-1355, Aug. 3, 2000.

G. D. VanWiggeren, T. K. Gaylord, D. D. Davis, M. I. Braiwish, E. N. Glytsis, E. Anemogiannis, and B. D. Garrett, "Tuning, Attenuating, and Switching by Controlled Flexture of Long-Period Fiber Gratings" Optics Letters, vol. 26, pp. 61-63, Jan. 15, 2001.

1999-2000:
Chen, X.C.; Tolbert, L.M.; Hess, D.W.; Henderson, C.L.; "New Polymers for Thin Film Lithography"; Macromolecules, 34(12), pp. 4104-4108, (2001).

A. Erdmann, C.L. Henderson, C.G. Willson, "The Impact of Exposure Induced Refractive Index Changes of Photoresists on the Photolithographic Process," J. Appl. Phys., 89(12), pp. 8163-8168, (2001).

Bhusari, D.; Reed, H.; Wedlake, M.; Allen, S.A.; Henderson, C.L.; Kohl, P.A.; "Fabrication of Air-Channel Structures for Microfluidic Applications," Proc. NSF DMII Conference 2001, (2001).

K.M. McCoy, D.W. Hess, L.M. Tolbert, C.L. Henderson, "Top Surface Imaging via Surface Initiated Polymerization," Proc. SRC TECHCON 2000, (2000).

1999-2000:
Healy, W. M., Hartley, J. G. and Abdel-Khalik, S. I., "Surface Wetting Effects on the Spreading of Liquid Droplets Impacting a Solid Surface at Low Weber Numbers," International Journal of Heat and Mass Transfer, Vol. 44, pp. 235-240, 2001.

1998-1999:
Healy, W. M., Hartley, J. G. and Abdel-Khalik, S. I., "Surface Wetting Effects on the Spreading of Liquid Droplets Impacting a Solid Surface at Low Weber Numbers," International Journal of Heat and Mass Transfer, Vol. 44, pp. 235-240, 2001.

Jokerst, N.M.; Brooke, M.A.; Laskar, J.; Wills, D.S.; Brown, A.S.; Vrazel, M.; Jung, S.; Joo, Y.; Chang, J.J., "Microsystem optoelectronic integration for mixed multisignal systems," IEEE Journal on Special Topics in Quantum Electronics Millenium Issue, Vol. 6, No. 6, pp. November/December, 2000.

Vrazel, M.; Chang, J.J.; Brooke, M.; Jokerst, N.M.; Dagnali, G.; Brown, A., "Alignment tolerant hybrid photoreceivers using inverted MSMs," Proceedings of the LEOS Summer Topical Meeting on Electronics-Enhanced Optics, Miami, FL, p.I23-I24, July, 2000.

Lee, K.; Seo, S.; Huang, S.; Joo, Y.; Doolittle, W.A.; Fike, S.; Jokerst, N.; ; Brooke, M.; Brown, A., "Design of a smart pixel multispectral imaging array using 3D stacked thin film detectors on Si CMOS circuits," Proceedings of the LEOS Summer Topical Meeting on Electronic-Enhanced Optics, Miami, FL, pp. I57-I58, July, 2000.

Chen, T.D.; Spaziani, S.M.; Vaccaro, K.; Lorenzo, J.P.; Jokerst, N.M., "Epilayer transfer for integration of III-V photodetectors onto a silicon platform using Au-Sn and Pd-Ge bonding," Proceedings of the 2000 International Conference on Indium Phosphide and Related Materials, Providence, RI, p.502-5, March, 2000.

Youngjoong Joo; Brooke, M.A.; Jokerst, N.M., "Compact current input oversampling modulator design for a scalable high frame rate focal plane arrays," Proceedings of the 2000 IEEE International Symposium on Circuits and Systems: Emerging Technologies for the 21st Century, p.9-12 vol.5, 2000.

Vrazel, M.; Chang, J.J.; Brooke, M.; Jokerst, N.M.; Dagnall, G.; Brown, A., "Alignment tolerant InP/Si CMOS hybrid integrated photoreceivers operating at 0.9 Gbps," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, San Juan, Puerto Rico, Volume 2, November, 2000, pp. 884 -885.

Jung, S.; Brooke, M.A.; Jokerst, N.M., "Packaging consideration for 1 Gbps Si CMOS optical driver," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, Puerto Rico, Volume: 2, November, 2000, pp. 882 -883.

Joo, Y.; Lee, K.; Seo, S.; Jokerst, N.; Brooke, M., "A modulator design for smart pixel multispectral imaging arrays," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, Puerto Rico, Volume: 1, November, 2000, pp. 171 -172.

Lee, K.; Seo, S.; Vrazel, M.; Huang, S.; Doolittle, W.; Jokerst, N., Brown, A., "GaN thin film material bonded to host substrates using selective chemical etching," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, Vol. 2, November, 2000, pp. 559 -560.

N. M. Jokerst, M. A. Brooke, J. Laskar, D. S. Wills, A. S. Brown, S. W. Bond, M. Vrazel, R. Huang, M. Thomas, H. Kuo, S. Cho, S. Jung, Y. Joo, J. Chang, "Smart Photonic Links: Optoelectronic Devices Integrated With Circuits and Interconnection Substrates," Digest of the Optical Society of America Annual Meeting, Providence, RI, October, 2000, p. 94 Invited.

Chu, L.C.; Brooke, M., "An enhancement study on the SDSL upstream receiver," The 2001 IEEE International Symposium on Circuits and Systems, ISCAS 2001, Vol. 4, pp. 442 -445, Sydney, Australia, 6-9 May 2001.

Brooke, M.A., "Enhanced imaging arrays using a sigma delta ADC in Si CMOS for each array pixel," Digest of the LEOS Summer Topical Meetings, Page(s): I11 -I12, July 2000. Invited

Yun, I., Poddar, R., Carastro, L., Brooke, M., and May, G., "Statistical Analysis of Embedded Capacitors Using Carlo Analysis," ETRI Journal, vol. 23, no. 1, pp. 23-32, March, 2001..

Jokerst, N.M.; Brooke, M.A.; Laskar, J.; Wills, D.S.; Brown, A.S.; Vrazel, M.; Jung, S.; Joo, Y.; Chang, J.J., "Microsystem optoelectronic integration for mixed multisignal systems," IEEE Journal on Special Topics in Quantum Electronics Millenium Issue, Vol. 6, No. 6, pp. November/December, 2000.

Vrazel, M.; Chang, J.J.; Brooke, M.; Jokerst, N.M.; Dagnali, G.; Brown, A., "Alignment tolerant hybrid photoreceivers using inverted MSMs," Proceedings of the LEOS Summer Topical Meeting on Electronics-Enhanced Optics, Miami, FL, p.I23-I24, July, 2000.

Lee, K.; Seo, S.; Huang, S.; Joo, Y.; Doolittle, W.A.; Fike, S.; Jokerst, N.; ; Brooke, M.; Brown, A., "Design of a smart pixel multispectral imaging array using 3D stacked thin film detectors on Si CMOS circuits," Proceedings of the LEOS Summer Topical Meeting on Electronic-Enhanced Optics, Miami, FL, pp. I57-I58, July, 2000.

Chen, T.D.; Spaziani, S.M.; Vaccaro, K.; Lorenzo, J.P.; Jokerst, N.M., "Epilayer transfer for integration of III-V photodetectors onto a silicon platform using Au-Sn and Pd-Ge bonding," Proceedings of the 2000 International Conference on Indium Phosphide and Related Materials, Providence, RI, p.502-5, March, 2000.

Youngjoong Joo; Brooke, M.A.; Jokerst, N.M., "Compact current input oversampling modulator design for a scalable high frame rate focal plane arrays," Proceedings of the 2000 IEEE International Symposium on Circuits and Systems: Emerging Technologies for the 21st Century, p.9-12 vol.5, 2000.

Vrazel, M.; Chang, J.J.; Brooke, M.; Jokerst, N.M.; Dagnall, G.; Brown, A., "Alignment tolerant InP/Si CMOS hybrid integrated photoreceivers operating at 0.9 Gbps," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, San Juan, Puerto Rico, Volume 2, November, 2000, pp. 884 -885.

Jung, S.; Brooke, M.A.; Jokerst, N.M., "Packaging consideration for 1 Gbps Si CMOS optical driver," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, Puerto Rico, Volume: 2, November, 2000, pp. 882 -883.

Joo, Y.; Lee, K.; Seo, S.; Jokerst, N.; Brooke, M., "A modulator design for smart pixel multispectral imaging arrays," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, Puerto Rico, Volume: 1, November, 2000, pp. 171 -172.

Lee, K.; Seo, S.; Vrazel, M.; Huang, S.; Doolittle, W.; Jokerst, N., Brown, A., "GaN thin film material bonded to host substrates using selective chemical etching," Proceedings of the IEEE Lasers and Electro-Optics Society 2000 Annual Meeting, Vol. 2, November, 2000, pp. 559 -560.

N. M. Jokerst, M. A. Brooke, J. Laskar, D. S. Wills, A. S. Brown, S. W. Bond, M. Vrazel, R. Huang, M. Thomas, H. Kuo, S. Cho, S. Jung, Y. Joo, J. Chang, "Smart Photonic Links: Optoelectronic Devices Integrated With Circuits and Interconnection Substrates," Digest of the Optical Society of America Annual Meeting, Providence, RI, October, 2000, p. 94 Invited.

Chu, L.C.; Brooke, M., "An enhancement study on the SDSL upstream receiver," The 2001 IEEE International Symposium on Circuits and Systems, ISCAS 2001, Vol. 4, pp. 442 -445, Sydney, Australia, 6-9 May 2001.

Brooke, M.A., "Enhanced imaging arrays using a sigma delta ADC in Si CMOS for each array pixel," Digest of the LEOS Summer Topical Meetings, Page(s): I11 -I12, July 2000. Invited

Yun, I., Poddar, R., Carastro, L., Brooke, M., and May, G., "Statistical Analysis of Embedded Capacitors Using Carlo Analysis," ETRI Journal, vol. 23, no. 1, pp. 23-32, March, 2001.

1999-2000:
D. K. Guthrie, P. N. First, T. K. Gaylord, E. N. Glytsis, and R. E. Leibenguth, "Ballistic-Electron- Emission-Spectroscopy Detection of Monolayer Fluctuations in the Thickness of Semiconductor Quantum Heterostructures," Appl. Phys. Lett., vol. 74, pp. 283-285 July 12, 1999.

D. K. Guthrie, P. N. First, T. K. Gaylord, E. N. Glytsis, and R. E. Leibenguth, "Measurement of quasibound states in semiconductor heterostructures using ballistic electron emission spectroscopy," Microelectronics J., vol. 30, pp. 975-983, Oct. 1999.

C. C. Montarou and T. K. Gaylord, "Analysis and design of modified Wollaston prisms," Appl. Opt., vol. 38, pp. 6604-6616, Nov. 1, 1999.

S. M. Schultz, E. N. Glytsis, and T. K. Gaylord, "Volume grating preferential-order focusing waveguide coupler," Opt. Lett., vol. 24, pp. 1708-1710, Dec. 1, 1999.

E. Anemogiannis, E. N. Glytsis, and T. K. Gaylord, "Quasibound State Determination of Arbitrary-Geometry Quantum Heterostructures," Microelectronics J., vol. 30, pp. 935-951, Oct. 1999.

E. N. Glytsis (Guest Editor), "Quasibound States in Quantum Semiconductor Devices: Introduction," Microelectronics J., vol. 30, no. 10, pp. 923-924, Oct. 1999.

K. M. Rosfjord, R. A. Villalaz, and T. K. Gaylord, "Constant-bandwidth scanning of the Czerny-Turner monochromator," Appl. Opt., vol. 39, pp. 568-572, Feb. 1, 2000.

S. M. Schultz, E. N. Glytsis, and T. K. Gaylord, "Design, fabrication, and performance of preferential-order volume grating waveguide couplers," Appl. Opt., vol. 39, pp. 1223-1232, Mar. 10, 2000.

1998-1999:
E. N. Glytsis, M. E. Harrigan, T. K. Gaylord, and K. Hirayama, "Effects of Fabrication Errors on the Diffraction Efficiency of Cylindrical Diffractive Lenses: Rigorous Boundary Element and Scalar Approximation,"Appl. Opt., vol. 37, pp. 6591-6602, Oct. 1, 1998.

J. M. Bendickson, E. N. Glytsis, and T. K. Gaylord, "Scalar Integral Diffraction Methods: Unification, Accuracy, and Comparison to Rigorous Boundary Element Method with Application to Diffractive Cylindrical Lenses," J. Opt. Soc. Am. A, vol. 15, No. 7, pp. 1822-1837, July 1998.

Shen, Jeng-Jung, Jokerst, Nan Marie, Brown, April S., "Compliant substrate strain modulated epitaxy for WDM laser arrays," Proceedings of 1998 11th Annual Meeting of IEEE Lasers and Electro-Optics Society, LEOS., Orlando, FL, Part 1 (of 2), pp. 95-96, Dec. 1-4, 1998.

J. M. Bendickson, E. N. Glytsis, and T. K. Gaylord, "Metallic Surface-Relief On-Axis and Off-Axis Focusing Diffractive Cylindrical Mirrors," J. Opt. Soc. Am. A, vol. 16, pp. 113-130, Jan. 1999.
E. Anemogiannis, E. N. Glytsis, and T. K. Gaylord, "Determination of Guided and Leaky Modes of Lossless and Lossy Planar Multilayer Waveguides: The Reflection Pole and the Perturbed Wavevector Methods," J. Lightwave Technol., vol. 17, pp. 929-941, May 1999.

D. D. Davis, T. K. Gaylord, E. N. Glytsis, and S. C. Mettler, "Very-High-Temperature Stable CO2-Laser-Induced Long-Period Fibre Gratings," Electron. Lett., vol. 35, no.9, pp. 740-742, Apr. 29, 1999.
P. Meliopoulos, E. N. Glytsis, R. E. Loyd, and P. B. Horton, "Performance Evaluation of Steel Conduit Enclosed Power Systems," IEEE Transactions on Industrial Applications, vol. 35, pp. 515-525, May/June 1999.

K. Hirayama, K. Igarashi, Y. Hayashi, E. N. Glytsis, and T. K. Gaylord, "Finite-Substrate-Thickness Cylindrical Diffractive Lens: Exact and Approximate Boundary Element Methods," J. Opt. Soc. Am. A, vol. 16, pp. 1294-1302, June 1999.

1997-1998:
Anemogiannis, E., Glytsis, E. N., and Gaylord, T. K., " Quantum reflection pole method for determination of quasibound states in semiconductor heterostructue," Superlattices and Microstructures, Vol. 22, No. 4, pp. 481-496, Dec. 1997.

Carter-Coman, C., Brown, April S., Metzger, Robert A., Jokerst, Nan M., Pickering, Jason, Bottomley, Lawrence, " A New Mechanism for Spontaeous nanostructure Formation on Bottom-Patterned Complinat Substrates," Appl. Phys. Lett, Vol. 71, No. 19, pp. 2773-2775, November 10, 1997.

Vendier, O., Bond, S., Jung, S., Lee, M., Brooke, M., and Jokerst, N., " Optical Communication Directly Through Stacked CMOS Circuits Operating at 50 Mbps," Proceedings of the Annual Conference of the IEEE Lasers and Electro-Optics Society, San Francisco, CA, pp. 198-199, November 10-13, 1997.

Guthrie, D. K., First, P. N., Gaylord, T. K., Glytsis, E. N., and Leibenguth, R. E., " Electron Wave Interference Effects in a Single Ga_{1-x}A1_{x}As barrier structure measured by ballistic electron emission spectroscopy, " Appl. Phys. Lett., Vol. 71, pp. 2292-2294, Oct. 1997.

Carter-Coman, C., Bicknell-Tassius, R., Brown, A., and Jokerst, N., " Metastability Modeling of Compliant Substrate Critical Thickness Using Experimental Strain Relief Data," Appl. Phys. Lett., Vol. 71, No. 10, pp. 1344-1346, September 8, 1997.

Fournier, F., Brown, A. S., Metzger, R. A., Doolittle, A., Carter-Coman, C., Jokerst, N. M., and Bicknell-Tassius, R., " Growth Dynamics of InGaAs/GaAs by MBE," J, Crystal Growth, Vol. 175/176, pp.203-210, 1997.

Jokerst, N.M., " Hybrid Integrated Optoelectronics: Thin Film Devices Bonded to Host Substrates," Emerging Optoelectronic Technologies and Applicantions, (Y. H. Lo, editor), New Jersey, World Scientific, pp. 93-124, 1997.

Jokerst, N., " Integrated Optoelectronics Using Thin Film Epitaxial Liftoff Materials and Devices," The International Journal of Nonlinear Optical Physics, Vol 6, No. 1, pp. 19-48, 1997.

Brundrett, D. L., Gaylord, T. K., and Glytsis, E. N., " Polarizing Mirror/Absorber for Visible Wavelengths Based on a Silicon Subwavelength Grating: Design and Interferometric Photolithographic Fabrication," Appl. Opt., Vol. 37, pp. 2534-2541, May 1, 1998.

Brundrett, D. L., Glytsis, E. N., and Gaylord, T. K., " Normal-incidence guided-mode resonant grating filters: Design and experimental demonstration," Optics Letts., vol. 23, pp. 700-703, May 1, 1998.

Kropewnicki, T., Doolittle, W., Carter-Coman, C., Kang, S., Kohl, P., Jokerst, N., and Brown, A., " Selective Wet Etching of Lithium Galate," Journal of the Electrochemical Society, Vol. 145, No. 5, pp. L88-L90, May 1998.

Poddar, R., Moon, E., Brooke, M., and Jokerst, N., " Accurate, High Frequency Predictive Modeling of Arbitrary Geometry Planar Resistive Passive Devices," IEEE Transactions on Components and Manufacturing, Vol. 21, No. 2, pp. 177-183, May 1998.

Vendier, O., Bond, S., Lee, M., Jung, S., Brooke, M., Jokerst, N., and Leavitt, R., " Stacked Silicon CMOS Circuits with a 40 Mb/s Through-Silicon Optical Interconnect," IEEE Phot. Tech. Lett., Vol. 10., No. 4, pp. 606-608, April 1998.

Schultz, S. M., Glytsis, E. N., and Gaylord, T. K., " High-Efficiency Volume Grating Coupler for Line Focusing: Design and Performance Comparisons," Appl. Opt., Vol, 37, pp. 2278-2287, Apr. 1998.

Davis, D. D., Gaylord, T. K., Glytsis, E. N., Kosinski, S. G., Vengsarkar, A. M., and Mettler, S. C., " Long-Period Fibre Grating Fabrication by CO2 Laser Exposure," Electron. Letts., Vol. 34, No. 3, pp. 302-303, Feb. 1998.

Davis, D. D., Gaylord, T. K., Glytsis, E. N., and Mettler, S. C., "CO2 -laser-induced long-period-fibre gratings: Spectra characteristics, cladding modes, and polarisation independence," Electron. Letts., Vol. 34, pp. 1416-1417, July 1998.

Walker, D. B., Glytsis, E. N., and Gaylord, T. K., " Surface Mode at Isotropic-Uniaxial and Isotropic-Biaxial Interfaces," J. Opt. Soc. Am. A, Vol. 15, pp. 248-260, Jan. 1998.

Guthrie, D. K., First, P. N., Gaylord, T. K., Glytsis, E. N., and Leibenguth, R. E., " Measurement of the Zero-Bias Electron Transmittance as a Function of Energy for Half- and Quarter-Electron-Wavelength Semiconductor Quantum-Interference Filters," Appl. Phys. Lett., Vol. 72, No. 3, pp. 374-376, Jan. 1998.

Cruz-Rivera, J. L., Wills, D. S., and Gaylord, T. K., "Optimal usage of the available wiring resources in diffracitve-reflective optoelectric Multichip modules," Appl. Opt., Vol. 37, No. 2, pp. 233-253, Jan. 1998.

Glytsis, E. N., Harrigan, M. E., Hirayama, K., and Gaylord, T. K., "Collimating Cylindrical DiffractiveLenses: Rigorous Electromagnetic Analysis and Scalar Approximation," Appl. Opt., Vol. 37, pp. 34-43, Jan. 1998.

Doolittle, W.A.; Kropewnicki, T.; Carter-Coman, C.; Stock, S.; Kohl, P.; Jokerst, N.M.; Metzger, R.A.; Sangbeom Kang; Kyeong Kyun Lee; May, G.; Brown, A.S., "Growth of GaN on lithium gallate substrates for development of a GaN thin compliant substrate," Journal of Vacuum Science & Technology B (Microelectronics and Nanometer), vol.16, no.3, p.1300-4, May-June 1998.

1996-1997:
Carter-Coman, C., Brown, A.S., Bicknell-Tassius, R., Jokerst, N.M., Allen, M., "Strain-Modulated Epitaxy: A Flexible Approach to 3-D Band Structure Engineering Without Surface Patterning," Applied Physics Letters, vol. 69, no. 2, pp. 257-259, 1996.

Carter-Coman, C., Brown, A.S., Bicknell-Tassius, R., Jokerst, N.M., Fournier, F., and Dawson, D.E., "Strain Modulated Epitaxy: Modification of Growth Kinetics via Patterned, Compliant Substrates," J. Vac. Sci. Tech. B., Vol. 14, No. 3, pp. 2170-2171, 1996.

Carter-Coman, C., Brown, A.S., Jokerst, N.M., Dawson, D.E., Bicknell-Tassius, R., Feng, Z.C., Rajkumar, K.C., and Dagnall, G., "Strain Accommodation in Mismatched Overlayers by MBE: Introduction of a New Compliant Substrate Technology," J. Electron. Mat., Vol. 25, No. 7, pp. 1044-1047, 1996.

Cross, J., Buchanan, B., Carastro, L., Lopez-Lagunas, A., Wang, T., Jokerst, N., Brooke, M., Wills, S., and Ingram, M., "A Smart Pixel Single Fiber Bi-Directional Optical Link," Proceedings of the IEEE Lasers and ElectroOptics Society Summer Topical Meeting on Smart Pixels, Keystone, CO, pp. 45-46, August 1996.

Guthrie, D.K., Harrell, L.E., Henderson, G.N., First, P.N., Gaylord, T.K., Glytsis, E.N., and Leibenguth, R.E., "Ballistic Electron Emission Spectroscopy of Au/Si and Au/GaAs Interfaces: Low-Temperature Measurements and Ballistic Models," Physical Review B, vol. 54, pp. 16972-16982, Dec. 15, 1996.

Wang, S.C. and Ingram, M.A., "A Performance Analysis of an Optical Serial-to-Parallel Converter with EDFA Amplification," IEEE/OSA Journal of Lightwave Technology, Vol. 14, No. 12, pp. 2736-2748, December 1996.

Guthrie, D.K., Gaylord, T.K., and Glytsis, E.N., "Understanding the Number and Density of States in Quantum Semiconductor Structures," IEEE Transactions on Education, vol. E39, pp. 465-470, Nov. 1996.

Hirayama, K., Glytsis, E.N., Gaylord, T.K., and Wilson, D.W., "Rigorous Electromagnetic Analysis of Diffractive Cylindrical Lenses," J. Opt. Soc. Am. A, vol. 13, pp. 2219-2231, Nov. 1996.

Brundrett, D.L., Glytsis, E.N., and Gaylord, T.K., "Subwavelength Transmission Grating Retarders for Use at 10.6 microns," Appl. Optics, vol. 35, pp. 6195-6202, Nov. 1, 1996.

Moniri-Ardakani S. and Glytsis, E.N., "Lossy Multilayer Slab and Channel Optical Waveguides Analyzed by the Transmission Line Matrix (TLM) Method," Appl. Optics , vol. 35, pp. 5979-5987, Oct. 20, 1996.

Wang, S.C. and Ingram, M.A., "A Novel Fourier Technique for Calculating Fiber-to-LED Coupling Efficiency with Misalignments," IEEE/OSA Journal of Lightwave Technology, Vol. 14, No. 10, pp. 2407-2413, October 1996.

Cross, J., Lopez-Lagunas, A., Buchanan, B., Carastro, L., Wang, S.C., Jokerst, N.M., Wills, S., Brooke, M., and Ingram, M.A., "A Single Fiber Bi-Directional Optical Link Using Co-Located Emitters and Detectors," IEEE Photonics Technology Letters, Vol. 8, No. 10, pp. 1385-1387, October 1996.

Jokerst, N. M., Twyford, E., Laskar, J., Wills, D. S., "Packaging of Optoelectronics with Electronics," Microelectronics Packaging Handbook (R. Tummala and E. Rymanszewski, editors), New York, Chapman-Hall Publishers, 1996.

Chou, H., Rohatgi, A., Jokerst, N., Kamra, S., Stock, S., Lowrie, S., Ahrenkiel, R., and Levi, D., "An Approach Toward High Efficiency CdTe/CdS Heterojunction Solar Cells," Journal of Materials Chemistry and Physics, Vol. 43, pp. 178-182, 1996.

Chou, H., Rohatgi, A., Jokerst, N.M., Thomas, E., and Kamra, S., "Cu Migration in CdTe Heterojunction Solar Cells," J. Electronic Materials, Vol. 25, No. 7, pp. 1093-1098, 1996.

Ahmed, S. and Glytsis, E. N., "Comparison of Beam Propagation Method and Rigorous Coupled-Wave Analysis for Single and Multiplexed Volume Gratings", Appl. Optics, vol. 35, pp 4426-4435, August 1996.