Rockwell Collins' Advanced Technology Center is looking for 2 students with Microelectronics Packaging background to fill 2011 Summer Intern openings (Summer Engineering Project Programs, or SEPP). Interested students please either go to

http://www.rockwellcollins.com/careers/index.html, search for Job Number: MIN0000000Y, and apply online, or send resume directly to me for consideration.

This SEPP program pays participants with very competitive salary and free housing. Rockwell Collins develops advanced technologies for communication, navigation, networking, and display equipment for military and commercial airborne systems.