Introduction to System-On-Package (SOP) Technology
Rao R. Tummala, M. Swaminathan (editors), "Introduction to System-On-Package (SOP) Technology",SIP and SOC, McGraw-Hill, NY (Published March 2008).

Instructional Figures

Fundamentals of Microsystems Packaging
Rao R. Tummala, editor, "Fundamentals of Microsystems Packaging", McGraw-Hill, May 2001.

Microelectronics Packaging Design Handbook, Part I: Technology Drivers
Rao R. Tummala , Eugene Rymaszeski and Alan Klofenstein, editors, "Microelectronics Packaging Design Handbook, Part I: Technology Drivers", Kluwer, Norwell, MA, 1996.

Microelectronics Packaging Design Handbook, Part II: Semiconductor Packaging
Rao R. Tummala, Eugene Rymaszeski and Alan Klofenstein, editors, "Microelectronics Packaging Design Handbook, Part II: Semiconductor Packaging", Kluwer, Norwell, MA, 1996.

Microelectronics Packaging Design Handbook, Part III: Subsystem Packaging
Rao R. Tummala , Eugene Rymaszeski and Alan Klofenstein, editors, "Microelectronics Packaging Design Handbook, Part III: Subsystem Packaging", Kluwer, Norwell, MA, 1996.

Power Integrity Modeling and Design for Semiconductors and Systems
Swaminathan, Madhavan, and A. Ege. Engin. Power Integrity Modeling and Design for Semiconductors and Systems. Upper Saddle River, NJ: Prentice Hall, 2008.

Materials for Advanced Packaging
Lu, Daniel, and C. P. Wong. Materials for Advanced Packaging. Berlin: Springer US, 2008.