Publications

2017

Journal Papers

  1. K. Demir, A. Armutlulu, V. Sundaram, P. M. Raj, and R. R. Tummala, "Reliability of Copper Through-Package Vias in Bare Glass Interposers," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, pp. 829-837, 2017.

  2. C. Gianfagna, H. Yu, M. Swaminathan, R. Pulugurtha, R. Tummala, and G. Antonini, "Machine-Learning Approach for Design of Nanomagnetic-Based Antennas," Journal of Electronic Materials, 2017.

  3. T. B. Huang, B. Chou, J. Tong, T. Ogawa, V. Sundaram, and R. R. Tummala, "Via-First Process to Enable Copper Metallization of Glass Interposers With High-Aspect-Ratio, Fine-Pitch Through-Package-Vias," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, pp. 544-551, 2017.

  4. Y. Kim, J. Cho, J. J. Kim, K. Cho, S. Kim, S. Sitaraman, V. Sundaram, P. M. Raj, and R. R. Tummala, "Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling," IEEE Transactions on Electromagnetic Compatibility, vol. 59, pp. 940-951, 2017.

  5. S. McCann, V. Smet, V. Sundaram, R. R. Tummala, and S. K. Sitaraman, "Experimental and Theoretical Assessment of Thin Glass Substrate for Low Warpage," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, pp. 178-185, 2017.

  6. B. M. D. Sawyer, Y. Suzuki, R. Furuya, C. Nair, T. C. Huang, V. Smet, K. Panayappan, V. Sundaram, and R. Tummala, "Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, pp. 552-562, 2017.

  7. B. Singh, G. Menezes, S. McCann, V. Jayaram, U. Ray, V. Sundaram, R. Pulugurtha, V. Smet, and R. Tummala, "Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, pp. 726-733, 2017.

  8. S. Sitaraman, V. Sukumaran, M. R. Pulugurtha, Z. Wu, Y. Suzuki, Y. Kim, V. Sundaram, J. Kim, and R. R. Tummala, "Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. PP, pp. 1-9, 2017.

  9. Y. Suzuki, H. Hichri, F. Wei, V. Sundaram, and R. Tummala, "Embedded Trench Redistribution Layers at 2-5 µm Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20-40µm Pitch Interposers," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, pp. 838-845, 2017.

  10. T. Sun, H. Sharma, P. M. Raj, F. Yoshihiro, H. Satoshi, K. Takemura, R. Tummala, "Substrate embedded thin-film inductors with magnetic cores for Integrated Voltage Regulators," IEEE Transactions on Magnetics, vol. PP, pp. 1-1, 2017

Conference Proceedings

  1. K. Mohan, N. Shahane, P. M. Raj, A. Antoniou, V. Smet, and R. Tummala, "Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections," in 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 2017, pp. 3083-3090.

  2. R. Tummala, V. Sundaram, P. M. Raj, and V. Smet, "Future of embedding and fan-out technologies," in 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 2017, pp. 1-9.​

The following papers were presented at the 67th IEEE Electronic Components and Technology Conference (ECTC), May 30-June 2, Orlando, FL, USA

  1. C. Buch, T. Shi, D. Struk, K-J Wolter, P.J. Hesketh, C. Shearer, J. Haley, M. Findlay, M. Papageorge, V. Sundaram, and R. Tummala, “Design and Demonstration of Highly Miniaturized, Panel Level Glass Package for Low Cost Gas Sensors,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  2. S. Dwarakanath, P. M. Raj, C. Leng, M.D. Losego, and R. R. Tummala, "Organic-inorganic hybrid dielectrics with improved high-temperature reliability," 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  3. A. Gupta, E. Snyder, C. Gottschalke, K. Wenzel, J. Gunn, H. Lu, Y. Suzuki, V. Sundaram, and R. Tummala, “First Demonstration of Photoresist Cleaning for Fine Line RDL Yield Enhancement by an Innovative Atmospheric Pressure Ozone Treatment Process for Panel Fan-out and Interposers,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  4. T-C Huang, V. Smet, P. M. Raj, R. Taylor, G. Ramos, R. Nichols, A. Kilian, and R. Tummala, “Scaling Cu pillars to 20um pitch and below: strategic role of surface finish and barrier layers,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  5. V. Jayaram, S. McCann, B. Singh, R. Pulugurtha, H. Matsuura, Y. Takagi, T. Huang, V. Smet and R. Tummala, "Analysis of system-level reliability of single-chip glass BGA packages with advanced solders and polymer collars​," 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  6. H. Lee, V. Smet, P. M. Raj, and R. Tummala, “Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  7. F. Liu, C. Nair, A. Kubo, T. Ando, H. Lu, R. Zhang, H. Chen, K.S. Lee, V. Sundaram, and R. R. Tummala, “Via-in-Trench: A Revolutionary Panel-based Package RDL Configuration capable of 200-450 IO/mm/layer, an Innovation for More-Than-Moore System Integration,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  8. A. Gupta, E. Snyder, H. Lu, Y. Suzuki, V. Sundaram, R. Tummala, C. Gottschalk, K. Wenzel, J. Gunn, "First demonstration of photoresist cleaning for fine-line RDL yield enhancement by an innovative ozone treatment process for panel fan-out and interposers,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  9. N. Shahane, K. Mohan, G. Ramos, A. Kilian, R. Taylor, F. Wei, P. M. Raj, An. Antoniou, V. Smet, and R. Tummala, “Enabling chip-to-package Cu-Cu interconnections: design of engineered bonding interfaces for improved manufacturability and low-temperature bonding,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  10. T. Shi, C. Buch, V. Smet, Y. Sato, L. Parthier, F. Wei, C. Lee, V. Sundaram, and R. Tummala, “First Demonstration of Panel Glass Fan-out (GFO) Packages for High I/O Density and High Frequency Multi-Chip Integration,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 208
  11. R.G. Spurney, H. Sharma, M.R. Pulugurtha, N. Lollis, M. Romig, S. Gandhi, H. Brumm, R. Tummala, "High Voltage and High Temperature Capacitors for Next-Generation Power Modules in Electric Vehicles," 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  12. D. Struk, C. Buch, P.J. Hesketh, K-J Wolter and R. Tummala, “Thermomechanical design and simulation of miniaturized image sensor-processor 3D stack for automotive vision systems,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  13. V. Sundaram, B. DeProspo, P. M. Raj, N. Gezgin, R. Tummala, K. Byers, S. Garrison, G. Kraus, M. Elsbury, “Integrated Copper Heat Slugs and EMI shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF IC’s,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  14. Y. Suzuki, H. Hichri, L. Seongkuk, M. Arendt, Y. Chen, C. Lee, F. Wei, O. Dimov, D. Arora, S. Malik, V. Sundaram, and R. Tummala, “Embedded Trace RDL at 2-5um Width and Space by Excimer Laser, Cu Filling and Surface Planarization for 20-40um pitch Interposers,’ 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  15. S. Viswanathan, T. Huang, T. Ogawa, P. M. Raj, F. Liu, V. Sundaram, R. Tummala, "High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine Pitch, Copper Metallized Through Package Vias (TPVs) in Ultra-Thin Glass Substrates,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  16. A. O. Watanabe, M. Ali, B. Tehrani, J. Hester, H. Matsuura, T. Ogawa, M. R. Pulugurtha, V. Sundaram, M. M. Tentzeris, R. R. Tummala, “First Demonstration of 28GHz and 39GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017
  17. R. Zhang, B. Chou, F. Liu, V. Sundaram, M. Gallagher, C. O’Connor, R. Tummala, “First demonstration of single-mode polymer optical waveguides with circular cores for fiber-to-waveguide coupling in 3D Glass Photonic Interposer” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017

 

 

2016​

Books and Book Chapters

  1. P. M. Raj, D. W. Lee, L. Li, S. X. Wang, P. Chakraborti, H. Sharma, S. Jain, and R. Tummala "Embedded Passives," in Materials for Advanced Packaging, ed: Springer, 2016, pp. 537-588.

Journal Papers

  1. P. Chakraborti, H. Sharma, M. R. Pulugurtha, K.-P. Rataj, C. Schnitter, N. Neuhart, S. Jain, S. Ghandi and R. Tummala, "Ultrathin, Substrate-Integrated, and Self-Healing Nanocapacitors with Low-Leakage Currents and High-Operating Frequencies," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, pp. 1776-1784, 2016
  2. S. Cho, V. Sundaram, R. Tummala, Y. Joshi, "Multi-scale thermal modeling of glass interposer for mobile electronics application," International Journal of Numerical Methods for Heat and Fluid Flow, vol. 26, pp. 1157-1171, 2016
  3. B.C. Chou, W. Vis, R. Furuya, V. Sundaram, R. Tummala, "Modeling, design, fabrication, and characterization of Ultra-High bandwidth 3D glass photonic substrates," Advancing Microelectronics, vol. 43, pp. 12-16, 2016

  4. S. Gandhi, M. R. Pulugurtha, H. Sharma, P. Chakraborti, R. R. Tummala, "High-k Thin-Film Capacitors With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, issue 10, pp. 1561-1566, 2016 

  5. S. Gandhi, S. Xiang, M. Kumar, H. Sharma, P. Chakraborti, P. M. Raj, R. Tummala, "Dielectric–electrode interactions in glass and silicon-compatible thin-film (Ba, Sr) TiO3 capacitors," Journal of Materials Science: Materials in Electronics, pp. 1-6, Sept 2016

  6. K. Han, M. Swaminathan, R. Pulugurtha, H. Sharma, R. Tummala, S. Yang, et al., "Magneto-Dielectric Nanocomposite for Antenna Miniaturization and SAR Reduction," IEEE Antennas and Wireless Propagation Letters, vol. 15, pp. 72-75, 2016

  7. Y. Kim, J. Cho, J. J. Kim, K. Kim, K. Cho, S. Kim, S. Sitaraman, V. Sundaram, R. Tummala,  "Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel," IEEE Transactions on Electromagnetic Compatibility, vol. 58, pp. 1747-1759, 2016
  8. G. Kumar, S. Sitaraman, J. Cho, V. Sundaram, J. Kim, R. R. Tummala, "Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, pp. 87-99, 2016
  9. H. Lu, R. Furuya, B. M. D. Sawyer, C. Nair, F. Liu, V. Sundaram, R. Tummala, "Design, Modeling, Fabrication and Characterization of 2-5 µm Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, pp. 959-967, 2016
  10. S. McCann, Y. Sato, V. Sundaram, R. R. Tummala, S. K. Sitaraman, "Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates," IEEE Transactions on Device and Materials Reliability, vol. 16, pp. 43-49, 2016
  11. S. McCann, B. Singh, V. Smet, V. Sundaram, R. Tummala, S. Sitaraman, "Process Innovations to Prevent Glass Substrate Fracture from RDL Stress and Singulation Defects," IEEE Transactions on Device and Materials Reliability, vol. pp. 1-1, 2016

  12. D. Mishra, P. M. Raj, R. Tummala, "Design, fabrication and characterization of thin power inductors with multilayered ferromagnetic-polymer composite structures," Microelectronic Engineering, vol. 160, pp. 34-38, 2016

  13. D. Mishra, P. Raj, J. Rishler, T. Sun, E. Shipton, R. Tummala, "Multilayered ferromagnetic-polymer composite structures for high-density power inductors," IEEE Transactions on Magnetics, vol. 52, pp. 1-5, 2016​
  14. K. P. Murali, P. Markondeya Raj, H. Sharma, R. Tummala, "CoY hexaferrite-PEEK composites for integrated and miniaturized RF components," Journal of Materials Science: Materials in Electronics, vol. 27, pp. 7010-7017, 2016
  15. K. Murali, H. Sharma, P. M. Raj, D. Mishra, M. Goyal, K. Silver, E. Shipton, R. Tummala "Structure-magnetic property correlations in nickel-polymer nanocomposites," Journal of Materials Science: Materials in Electronics, vol. 27, pp. 154-162, 2016
  16. B. Sawyer, Y. Suzuki, Z. Wu, H. Lu, V. Sundaram, K. Panayappan, R. Tummala, "Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-μm Bump Pitch," Journal of Microelectronics and Electronic Packaging, vol. 13, pp. 128-135, 2016
  17. H. Sharma, P. M. Pulugurtha, R. Tummala, "Chemical synthesis of low-coercivity, silica/Co composites for high-frequency magnetic components," Materials Chemistry and Physics, vol. 175, pp. 46-53, 2016
  18. J. Tong, Y. Sato, K. Panayappan, V. Sundaram, A. F. Peterson, R. R. Tummala, "Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, pp. 775-783, 2016

Conference Proceedings

  1. C. Buch, P. M. Raj, B. Brown, H. Sharma, T. Sun, K.-S. Moon, K-J Wolter, R. Tummala, "Ultra-Thin Wireless Power Module with Integration of Wireless Inductive Link and Supercapacitors," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2364-2371

  2. P. Chakraborti, N. Neuhart, K. P. Rataj, C. Schnitter, S. Gandhi, H. Sharma, P. M. Raj, F. Stepniak, M. Romig, N. Lollis, R. R. Tummala, "Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1958-1963.

  3. B.C. Chou, B. Sawyer, W. Vis, R. Furuya, F. Liu, V. Sundaram, R. Tummala, “Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass Substrate,” in International Symposium on Microelectronics: FALL 2016, Vol. 2016, No. 1, pp. 7-12

  4. B. C. Chou, W. Vis, B. Khan, R. Furuya, F. Liu, V. Sundaram, R. Tummala, "Design and Demonstration of Micro-Mirrors and Lenses for Low Loss and Low Cost Single-Mode Fiber Coupling in 3D Glass Photonic Interposers," in 66th IEEE Electronic Components and Technology Conference. (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 497-503

  5. K. Demir, A. Benali, V. Sundaram, P. M. Raj, R. Tummala, "Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-Situ Stress Measurements Using Raman Spectroscopy," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 799-805

  6. S. Dwarakanath, P. M. Raj, K. Demir, V. Smet, V. Sundaram, R. Tummala, "Electrodeposited copper-graphite composites for low-CTE integrated thermal structures," in International Symposium on Microelectronics: FALL 2016, Vol. 2016, No. 1, pp. 88-93 *Best Paper Award*

  7. T. C. Huang, V. Smet, P. M. Raj, R. R. Tummala, G. Ramos, A. Kilian, R. Taylor, R. Nichols, "Demonstration of Next-Generation Au-Pd Surface Finish with Solder-Capped Cu Pillars for Ultra-Fine Pitch Applications," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2553-2560

  8. V. Jayaram, S. McCann, T. C. Huang, S. Kawamoto, R. Pulugurtha, V. Smet, R. Tummala, "Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 101-107

  9. M. S. Kim, M. R. Pulugurtha, Z. Wu, V. Sundaram, R. Tummala, "Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2384-2388

  10. Y. Kim, J. Cho, J. Song, S. Kim, V. Sundaram, R. Tummala, J. Kim, "Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1856-1861

  11. A. Kubo, C. Nair, R. Furuya, T. Ando, H. Lu, F. Liu, V. Sundaram, R. Tummala, "Demonstration of 20 um I/O Pitch RDL Using a Novel, Ultra-Thin Dry Film Photosensitive Dielectric for Panel-Based Glass Interposers," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 172-177

  12. F. Liu, A. Kubo, C. Nair, T. Ando, R. Furuya, S. Dwarakanath, V. Sundaram, R. R. Tummala, "Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-Fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1515-1521

  13. H. Lu, F. Wei, R. Furuya, A. Kubo, F. Liu, V. Sundaram, R. Tummala, "Advances in Panel Scalable Planarization and High Throughput Differential Seed Layer Etching Processes for Multilayer RDL at 20 Micron I/O Pitch for 2.5D Glass Interposers," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2210-2215
  14. S. McCann, S. Kuramochi, H. Yun, V. Sundaram, M. R. Pulugurtha, R. R. Tummala, S. K. Sitaraman, "Board-Level Reliability of 3D through Glass via Filters during Thermal Cycling," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1575-1582

  15. J. Min, Z. Wu, M. R. Pulugurtha, V. Smet, V. Sundaram, A. Ravindran, C. Hoffman, R. Tummala, "Modeling Design Fabrication and Demonstration of RF Front-End Module with Ultra-Thin Glass Substrate for LTE Applications,66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1297-1302

  16. C. Nair, H. Lu, K. Panayappan, F. Liu, V. Sundaram, R. Tummala, "Effect of Ultra-Fine Pitch RDL Process Variations on the Electrical Performance of 2.5D Glass Interposers up to 110 GHz," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2408-2413

  17. B. Sawyer, B. C. Chou, J. Tong, W. Vis, K. Panayappan, S. Deng, H. Tournier, V. Sundaram,  R. Tummala, "Design and Demonstration of 2.5D Glass Interposers as a Superior Alternative to Silicon Interposers for 28 Gbps Signal Transmission," i66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 972-977

  18. N. Shahane, K. Mohan, R. Behera, A. Antoniou, P. R. Markondeya, V. Smet, et al., "Novel High-Temperature, High-Power Handling All-Cu Interconnections through Low-Temperature Sintering of Nanocopper Foams," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 829-836

  19. T. Shi, B. Chou, T. C. Huang, T. Ogawa, Y. Sato, H. Matsuura, V. Smet, R. Tummala, "Design, Demonstration and Characterization of Ultra-Thin Low-Warpage Glass BGA Packages for Smart Mobile Application Processor," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1465-1470

  20. B. Singh, T. C. Huang, S. Kawamoto, V. Sundaram, R. Pulugurtha, V. Smet, R. Tummala, "Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1377-1385

  21. T. Sun, P. M. Raj, J. Min, Z. Wu, H. Sharma, T. Takahashi, K. Takemura, H. Yun, F. Carobolante, R. Tummala, "Magnetic Materials and Design Trade-Offs for High Inductance Density, High-Q and Low-Cost Power and EMI Filter Inductors," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 374-379

  22. ​V. Sundaram, R. Tummala, "Glass panel fan-out packaging for function and cost scaling," in IMAPS 12th International Conference and Exhibition on Device Packaging, March 14, 2016 - March 17, 2016, Fountain Hills, AZ, United States, 2016

  23. J. Tong, K. Panayappan, V. Sundaram, R. Tummala, "Electrical Comparison between TSV in Silicon and TPV in Glass for Interposer and Package Applications," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2581-2587

  24. R. Tummala, K. J. Wolter, V. Sundaram, V. Smet, P. M. Raj, "New era in automotive electronics, a co-development by Georgia tech and its automotive partners," in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), January 25, 2016 - January 28, 2016, Big Island, HI, United States, 2016, pp.1-4

  25. R. R. Tummala, "System scaling for new era of automotive electronics: An ultimate system integration opportunity for RD and supply-chain Mfg consortium," in IMAPS 12th International Conference and Exhibition on Device Packaging, March 14, 2016 - March 17, 2016, Fountain Hills, AZ, United States, 2016

  26. A.O. Watanabe, S. Jeong, S. Kim, Y. Kim, J. Min, D. Wong, R. Mullapudi​, P. M. Raj, R. R. Tummala, Y. Kim, J. Kim, "Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 206-210

  27. F. Wei, V. Smet, N. Shahane, H. Lu, V. Sundaram, R. Tummala, "Ultra-Precise Low-Cost Surface Planarization Process for Advanced Packaging Fabrications and Die Assembly: A Survey of Recent Investigations on Unit Process Applications and Integrations," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1740-1745

  28. Z. Wu, J. Min, M. Kim, M. R. Pulugurtha, V. Sundaram, R. R. Tummala, "Design and Demonstration of Ultra-Thin Glass 3D IPD Diplexers," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, ​May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2348-2352

Books and Book Chapters Accepted for Publication

  1. P. M. Raj, T. Sun, G. C. Jha, S. K. Bhattacharya and R. R. Tummala, "Nanogranular magnetic core inductors: Design, fabrication and packaging", in Nanopackaging: Nanotechnologies & Electronics Packaging, J E Morris, Ed. Wiley: 2nd edition. Accepted 2016.

Journal Papers Accepted for Publication

  1. T. B. Huang, B. Chou, J. Tong, T. Ogawa, V. Sundaram, R. R. Tummala, “Via-First Process to Enable Copper Metallization of Glass Interposers with High Aspect Ratio, Fine-Pitch Through-Package-Vias,” IEEE Transactions on Components, Packaging and Manufacturing Technology, accepted Nov 2016
  2. Y. Kim, J. Cho, J. J. Kim, K. Kim, K. Cho, S. Kim, V. Sundaram, R. Tummala "Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel," Electromagnetic Compatibility, Transactions on, 2016
  3. S. McCann, B. Singh, V. Smet, V. Sundaram, R. Tummala, and S. K. Sitaraman, "Process Innovations to Prevent Glass Substrate Fracture from RDL Stress and Singulation Defects," accepted for publication, IEEE Transactions Device and Materials Reliability, 2016
  4. S. McCann, V. Smet, V. Sundaram, R. Tummala, S. K. Sitaraman, "Experimental and Theoretical Assessment of Thin Glass Substrate for Low Warpage," IEEE Transactions on Components, Packaging, and Manufacturing Technology, accepted 2016, copyright transferred on Dec 15, 2016
  5. B. Sawyer, Y. Suzuki, R. Furuya, N. Chandrasekharan, T.C. Huang, V. Smet, K. Panayappan, V. Sundaram, R.R. Tummala, “Design and demonstration of a 2.5D glass interposer BGA package for high bandwidth and low cost, high reliability, and direct attach to system PWB,” accepted for publication, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2016
  6. S. Sitaraman, V. Sukumaran, P. Markondeya Raj, Z. Wu, Y. Suzuki, Y. Kim, V. Sundaram, R. R. Tummala, J. Kim, “Miniaturized Band-Pass filters as Ultra-thin 3D IPDs and Embedded Thinfilms in 3D Glass Modules”, IEEE Transactions on Components, Packaging and Manufacturing Technology, accepted 2016

Conference Papers Accepted for Publication

  1. C. Buch, T. Shi, D. Struk, K-J Wolter, P.J. Hesketh, C. Shearer, J. Haley, M. Findlay, M. Papageorge, V. Sundaram, R. Tummala, “Design and Demonstration of Highly Miniaturized, Panel Level Glass Package for Low Cost Gas Sensors,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  2. S. Dwarakanath, P.M. Raj, C. Leng, M.D. Losego, and R. R. Tummala, "Organic-inorganic hybrid dielectrics with improved high-temperature reliability," 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  3. A. Gupta, E. Snyder, C. Gottschalke, K. Wenzel, J. Gunn, H. Lu, Y. Suzuki, V. Sundaram, R. Tummala, “First Demonstration of Photoresist Cleaning for Fine Line RDL Yield Enhancement by an Innovative Atmospheric Pressure Ozone Treatment Process for Panel Fan-out and Interposers,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  4. V. Jayaram, S. McCann, B. Singh, R. Pulugurtha, H. Matsuura, Y. Takagi, T. Huang, V. Smet, R. Tummala,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017,​ accepted Nov 2016
  5. H. Lee, V. Smet, P.M. Raj, and R. Tummala, “Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017,​ accepted Nov 2016
  6. F. Liu, C. Nair, A. Kubo, T. Ando, H. Lu, R. Zhang, H. Chen, K.S. Lee, V. Sundaram, R. R. Tummala, “Via-in-Trench: A Revolutionary Panel-based Package RDL Configuration capable of 200-450 IO/mm/layer, an Innovation for More-Than-Moore System Integration," 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017,​ accepted Nov 2016
  7. K. Mohan, N. Shahane, P.M. Raj, A. Antoniou, V. Smet, R. Tummala, "Low-temperature, organics-free sintering of nanocopper foams for reliable, high-temperature and high-power die-attach interconnections" 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), Tampa, FL, 2017, accepted Oct 2016
  8. N. Shahane, K. Mohan, G. Ramos, A. Kilian, R. Taylor, F. Wei, P.M. Raj, An. Antoniou, V. Smet, R. Tummala, “Enabling chip-to-package Cu-Cu interconnections: design of engineered bonding interfaces for improved manufacturability and low-temperature bonding,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  9. T. Shi, C. Buch, V. Smet, Y. Sato, L. Parthier, F. Wei, C. Lee, V. Sundaram, R. Tummala, “First Demonstration of Panel Glass Fan-out (GFO) Packages for High I/O Density and High Frequency Multi-Chip Integration,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  10. V. Smet, P. M. Raj, R. Taylor, G. Ramos, R. Nichols, A. Kilian, R. Tummala, “Scaling Cu pillars to 20um pitch and below: strategic role of surface finish and barrier layers,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  11. R.G. Spurney, H. Sharma, M.R. Pulugurtha, N. Lollis, M. Romig, S. Gandhi, H. Brumm, R. Tummala, "High Voltage and High Temperature Capacitors for Next-Generation Power Modules in Electric Vehicles,"67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  12. D. Struk, C. Buch, P.J. Hesketh, K-J Wolter, R. Tummala, “Thermomechanical design and simulation of miniaturized image sensor-processor 3D stack for automotive vision systems,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  13. V. Sundaram, B. DeProspo, P. M. Raj, N. Gezgin, R. Tummala, K. Byers, S. Garrison, G. Kraus, M. Elsbury, “Integrated Copper Heat Slugs and EMI shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF IC’s,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  14. Y. Suzuki, H. Hichri, L. Seongkuk, M. Arendt, Y. Chen, C. Lee, F. Wei, O. Dimov, D. Arora, S. Malik, V. Sundaram, R. Tummala, “Embedded Trace RDL at 2-5um Width and Space by Excimer Laser, Cu Filling and Surface Planarization for 20-40um pitch Interposers,“ 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  15. S. Viswanathan, T. Huang, T. Ogawa, P. M. Raj, F. Liu, V. Sundaram, R. Tummala, "High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine Pitch, Copper Metallized Through Package Vias (TPVs) in Ultra-Thin Glass Substrates,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  16. A. O. Watanabe, M. Ali, B. Tehrani, J. Hester, H. Matsuura, T. Ogawa, M. R. Pulugurtha, V. Sundaram, M. M. Tentzeris, R. R. Tummala, “First Demonstration of 28GHz and 39GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules,” 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
  17. R. Zhang, B. Chou, F. Liu, V. Sundaram, M. Gallagher, C. O’Connor, R. Tummala, "First demonstration of single-mode polymer optical waveguides with circular cores for fiber-to-waveguide coupling in 3D Glass Photonic Interposer," 67th IEEE Electronic Components and Technology Conference (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016

2015​

Books and Book Chapters

  1. P.M. Raj, P. Chakraborti, D. Mishra, H. Sharma, S. Gandhi, S. Sitaraman, et al., "Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components," in Nanopackaging: From Nanomaterials to the Atomic Scale, X. Baillin, C. Joachim, and G. Poupon, Eds., ed: Springer International Publishing, pp. 175-189, 2015

Journal Papers

  1. P. Chakraborti, H. Sharma, M. Pulugurtha, and R. Tummala, "XPS depth profiling and leakage properties of anodized titania dielectrics and their application in high-density capacitors," Journal of Materials Science, vol. 50, pp. 7600-7609, 2015
  1. Q. Chen, H. Lu, V. Sundaram, R.R. Tummala, "Modeling, Fabrication, and Reliability of Through Vias in Polycrystalline Silicon Panels," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol.5, no.7, pp.938-944, July 2015
  2. S. Cho, V. Sundaram, R. R. Tummala, and Y. K. Joshi, "Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers," Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, pp. 1075-1084, 2015
  3. K. Han, M. Swaminathan, R. Pulugurtha, H. Sharma, R. Tummala, B. M. Rawlings, et al., "RF Characterization of Magnetodielectric Material Using Cavity Perturbation Technique," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, pp. 1850-1859, 2015
  4. K. Han, M. Swaminathan, R. Pulugurtha, H. Sharma, R. Tummala, S. Yang, et al., "Magneto-dielectric Nanocomposite for Antenna Miniaturization and SAR reduction," Antennas and Wireless Propagation Letters, IEEE, vol. PP, pp. 1-1, 2015
  5. G. Kumar, S. Sitarman, V. Sundaram, J. Kim, and R. Tummala, "Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages,” Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 6(1), pp. 87-89, 2015
  6. K. P. Murali, H. Sharma, P. Markondeya Raj, D. Mishra, M. Goyal, K. Silver, et al., "Structure-magnetic property correlations in nickel-polymer nanocomposites," Journal of Materials Science: Materials in Electronics, pp. 1-9, 2015
  7. X. Qin, P.M. Raj, V. Smet, and R. Tummala, "Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays," Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, pp. 1709-1719, 2015
  8. K. Ramachandran, T. Pruyn, T. Huang, Y. Wang, P. Singh, W. Jud Ready, et al., "Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy," Journal of Materials Science: Materials in Electronics, vol. 26, pp. 2563-2570, 2015
  9. H. Sharma, S. Jain, P. Raj, K. P. Murali, and R. Tummala, "Magnetic and Dielectric Property Studies in Fe- and NiFe-Based Polymer Nanocomposites,"Journal of Electronic Materials, vol. 44, pp. 3819-3826, 2015
  10. Y. Suzuki, R. Furuya, V. Sundaram, and R. R. Tummala, "Demonstration of 10um Microvias in Thin Dry-Film Polymer Dielectrics for High-Density Interposers," Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, pp. 194-200, 2015
  11. R. Tummala, “System scaling: the next frontier for a new era of electronic systems” Chip Scale Review, vol. 19(5), pp. 5-8, 2015

Conference Proceedings

  1. P. Chakraborti, S. Gandhi, H. Sharma, P.M. Raj, K.P. Rataj, R. Tummala, "Demonstration of ultra-thin tantalum capacitors on silicon substrates for high-frequency and high-efficiency power applications in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.2254-2258
  2. K. Demir, S. Gandhi, T. Ogawa, R. Pucha, V. Smet, V. Sundaram, R. Tummala, "First demonstration of copper-plated through-package-via (TPV) reliability in ultra-thin 3D glass interposers with double-side component assembly," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.666-671
  3. R. Furuya, H. Lu, F. Liu, H. Deng, T. Ando, V. Sundaram, et al., "Demonstration of 20 µm RDL wiring using dry film photoresists and 50 µm RDL via by projection lithography for low-cost 2.5D panel-based glass and organic interposers," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 1488-1493
  4. C. Gianfagna, M. Swaminathan, P. M. Raj, R. Tummala, and G. Antonini, "Enabling antenna design with nano-magnetic materials using machine learning," in 2015 IEEE Nanotechnology Materials and Devices Conference (NMDC), 2015, pp. 1-5
  5. S. Gandhi, P.M. Raj, B.C. Chou, P. Chakraborti, M.S. Kim, S. Sitaraman, H. Sharma, V. Sundaram, R. Tummala, "Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.230-235
  6. K. Han, M. Swaminathan, P. M. Raj, H. Sharma, R. Tummala, B. Rawlings, et al., "Synthesis of magneto-dielectrics from first principles and antenna design" in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 2228-2234
  7. T. Huang, B. Chou, V. Sundaram, H. Sharma, R. Tummala, "Novel copper metallization schemes on ultra-thin, bare glass interposers with through-vias," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1208-1212
  8. TC Huang, V. Smet, S. Kawamoto, V. Sundaram, P.M. Raj, R.R. Tummala Ting-Chia Huang; Smet, V.; Kawamoto, S.; Sundaram, V.; Raj, P.M.; Tummala, R.R., "Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu-Sn interconnections with high-throughput SLID assembly," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1377-1384
  9. I. Hwang, J. Kim, Y. Kim, J. Cho, J. Kim, V. Sundaram, et al., "Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer," in Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE, 2015, pp. 85-88
  10. W. T. Khan, J. Tong, S. Sitaraman, V. Sundaram, R. Tummala, and J. Papapolymerou, "Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 2138-2143
  11. J. Kim, I. Hwang, Y. Kim, H. Kim, J. Kim, V. Sundaram, et al., "Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV)," in Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE, 2015, pp. 93-96
  12. J. Kim, I. Hwang, Y. Kim, J. Cho, V. Sundaram, R. Tummala, et al., "Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 254-259
  13. M.S. Kim, S. Cho, J.K. Min, P.M. raj, TC Huang, S. Sitaraman, V. Sundaram, M. Velez, A. Ravidran, Y. Joshi, R. Tummala, “Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation" in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1163-1167
  14. S.J. Kim, Y.S. Kim, C.K. Yoon, V. Sundaram, R. Tummala, "A novel non-solder based board-to-board interconnection technology for smart mobile and wearable electronics," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1122-1127
  15. Y. Kim, J. Cho, K. Kim, V. Sundaram, R. Tummala J. Kim, "Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.738-743
  16. F. Liu, C. Nair, V. Sundaram, R.R. Tummala, "Advances in embedded traces for 1.5µm RDL on 2.5D glass interposers in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1736-1741
  17. S.R. McCann, Y. Sato, V. Sundaram, R.R. Tummala, S.K. Sitaraman, "Study of cracking of thin glass interposers intended for microelectronic packaging substrates," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1938-1944
  18. D. Mishra, S. Sitaraman, S. Gandhi, T. Sun, P.M. Raj, H. Sharma, R. Tummala, T.N. Aruagiri, Z. dordi, R. Mullapudi, "Nanomagnetic structures for inductive coupling and shielding in wireless charging applications in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.941-945
  19. C. Nair, F. Pieralisi, F. Liu, V. Sundaram, U. Muehlfeld, M. Hanika, S. Ramaswami, R. Tummala "Sputtered Ti-Cu as a superior barrier and seed layer for panel-based high-density RDL wiring structures," in in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.2248-2253
  20. P.M. Raj, C. Nair, H. Lu, F. Liu, V. Sundaram, D.W. Hess, R. Tummala, "zero-undercut” semi-additive copper patterning - a breakthrough for ultrafine-line RDL lithographic structures and precision RF thinfilm passives," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.402-405
  21. B. Sawyer, B.C. Chou, S. Gandhi, J. Mateosky, V. Sundaram, R. Tummala, "Modeling, design, and demonstration of 2.5D glass interposers for 16-channel 28 Gbps signaling applications," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.2188-2192
  22. N. Shahane, S. McCann, G. Ramos, A. Killian, R. Taylor, V. Sundaram P.M. Raj, V. Smet, R. Tummala, "Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1859-1865
  23. E. Shipton, T. Sun, P. M. Raj, H. Hayden, D. Brown, D. Mishra, et al., "Nanomagnetic films and arrays for nonlinear devices in highly-integrated RF modules," in Nanotechnology (IEEE-NANO) , 2015 IEEE 15th International Conference on, 2015, pp. 588-591
  24. B. Singh, V. Smet, J. Lee, G. Menezes, M. Kobayashi, P.M. Raj, V. Sundaram, B. Roggeman, U. Ray, R. Radojcic, R. Tummala, "First demonstration of drop-test reliability of ultra-thin glass BGA packages directly assembled on boards for smartphone applications," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1566-1573
  25. S. Sitaraman, J. Min, P.M. Raj, M.S. Kim, V. Sundaram, R. Tummala, "Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.1956-1960
  26. V. Smet, TC Huang, S. Kawamoto, B. Singh, V. Sundaram, P.M. Raj, R. Tummala, "Interconnection materials, processes and tools for fine-pitch panel assembly of ultra-thin glass substrates," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.475-483
  27. Y. Suzuki, J. Brune, R. Senczuk, R. Tummala, et al., "Demonstration of 20µm pitch micro-vias by excimer laser ablation in ultra-thin dry-film polymer dielectrics for multi-layer RDL on glass interposers," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 922-927
  28. J. Tong, V. Sundaram, A. Shorey, R. Tummala, "Substrate-integrated waveguides in glass interposers with through-package-vias," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.2222-2227
  29. R. Tummala, K. J. Wolter, V. Sundaram, V. Smet, and P. M. Raj, "Industry consortium for new era of automotive electronics with entire system-on-package vision at Georgia Tech," in 2015 European Microelectronics Packaging Conference (EMPC), 2015, pp. 1-5
  30. W. Vis, B.C. Chou, V. Sundaram, R. Tummala, "Self-aligned chip-to-chip optical interconnections in ultra-thin 3D glass interposers," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.804-809
  31. F. Wei, V. Sundaram, S. McCann, V. Smet, and R. Tummala, "Empirical investigations on die edge defects reductions in die singulation processes for glass-panel based interposers for advanced packaging," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 1991-1996
  32. Z. Wu, C. Nair, Y. Suzuki, F. Liu, V. Smet, D. Foxman, H. Mishima, R. Furuya, V. Sundaram, R.R. Tummala, "Modeling, design and fabrication of ultra-thin and low CTE organic interposers at 40µm I/O pitch," in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp.301-307

2014

  1. Sitaraman, S.; Suzuki, Y.; White, C.; Nair, V.; Kamgaing, T.; Juskey, F.; Sung Jin Kim; Raj, P.M.; Sundaram, V.; Tummala, R., "Modeling, design and demonstration of multi-die embedded WLAN RF front-end module with ultra-miniaturized and high-performance passives," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1264-1271, 27-30 May 2014
  2. Sangbeom Cho; Sato, Y.; Sundaram, V.; Joshi, Y.; Tummala, R., "Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1247-1252, 27-30 May 2014
  3. Sundaram, V.; Sato, Y.; Seki, T.; Takagi, Y.; Smet, V.; Kobayashi, M.; Tummala, R., "First demonstration of a surface mountable, ultra-thin glass BGA package for smart mobile logic devices," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.365-370, 27-30 May 2014
  4. Smet, V.; Kobayashi, M.; Tao Wang; Raj, P.M.; Tummala, R., "A new era in manufacturable, low-temperature and ultra-fine pitch Cu interconnections and assembly without solders," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.484-489, 27-30 May 2014
  5. Qiao Chen; Xi Liu; Sundaram, V.; Sitaraman, S.K.; Tummala, R.R., "Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications," in Device and Materials Reliability, IEEE Transactions on , vol.14, no.4, pp.1041-1048, Dec. 2014
  6. Kumar, G.; Raj, P.M.; Jounghyun Cho; Gandhi, S.; Chakraborti, P.; Sundaram, V.; Joungho Kim; Tummala, R., "Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.541-547, 27-30 May 2014
  7. Jialing Tong; Sato, Y.; Takahashi, S.; Imajyo, N.; Peterson, A.F.; Sundaram, V.; Tummala, R., "High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.2271-2276, 27-30 May 2014
  8. Hao Lu; Takagi, Y.; Suzuki, Y.; Sawyer, B.; Taylor, R.; Sundaram, V.; Tummala, R., "Demonstration of 3–5 μm RDL line lithography on panel-based glass interposers," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1416-1420, 27-30 May 2014
  9. Sung Jin Kim; Zihan Wu; Kobayashi, M.; Fuhan Liu; Smet, V.; Raj, P.M.; Sundaram, V.; Tummala, R., "Design and demonstration of paper-thin and low-warpage single and 3D organic packages with chip-last embedding technology for smart mobile applications," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1384-1388, 27-30 May 2014
  10. Tao Wang; Smet, V.; Kobayashi, M.; Sundaram, V.; Raj, P.M.; Tummala, R., "Modeling, design, and demonstration of low-temperature Cu interconnections to ultra-thin glass interposers at 20 μm pitch," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.284-289, 27-30 May 2014
  11. Sukumaran, V.; Kumar, G.; Ramachandran, K.; Suzuki, Y.; Demir, K.; Sato, Y.; Seki, T.; Sundaram, V.; Tummala, R.R., "Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon," in Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.4, no.5, pp.786-795, May 2014
  12. Huang, T.; Sundaram, V.; Raj, P.M.; Sharma, H.; Tummala, R., "Adhesion and reliability of direct Cu metallization of through-package vias in glass interposers," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.2266-2270, 27-30 May 2014
  13. Raj, P.M.; Chakraborti, P.; Sharma, H.; KyuHwan Han; Gandhi, S.; Sitaraman, S.; Swaminathan, M.; Tummala, R., "Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics," in Nanotechnology (IEEE-NANO), 2014 IEEE 14th International Conference on , vol., no., pp.27-31, 18-21 Aug. 2014
  14. Qiao Chen; Suzuki, Y.; Kumar, G.; Sundaram, V.; Tummala, R.R., "Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers," in Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.4, no.12, pp.2035-2041, Dec. 2014
  15. Xian Qin; Kumbhat, N.; Raj, P.M.; Sundaram, V.; Tummala, R., "Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections," in Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.4, no.5, pp.796-806, May 2014
  16. McCann, S.R.; Sundaram, V.; Tummala, R.R.; Sitaraman, S.K., "Flip-chip on glass (FCOG) package for low warpage," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.2189-2193, 27-30 May 2014
  17. Demir, K.; Armutlulu, A.; Jialing Tong; Pucha, R.; Sundaram, V.; Tummala, R., "First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1098-1102, 27-30 May 2014
  18. Menezes, G.; Smet, V.; Kobayashi, M.; Sundaram, V.; Raj, P.M.; Tummala, R., "Large low-CTE glass package-to-PCB interconnections with solder strain-relief using polymer collars," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1959-1964, 27-30 May 2014
  19. Sawyer, B.; Hao Lu; Suzuki, Y.; Takagi, Y.; Kobayashi, M.; Smet, V.; Sakai, T.; Sundaram, V.; Tummala, R., "Modeling, design, fabrication and characterization of first large 2.5D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.742-747, 27-30 May 2014
  20. Youngwoo Kim; Kiyeong Kim; Jonghyun Cho; Joungho Kim; Sundaram, V.; Tummala, R., "Analysis of Power Distribution Network in glass, silicon interposer and PCB," in Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on , vol., no., pp.470-474, 4-8 Aug. 2014
  21. Chou, B.C.; Razdan, S.; HaiPeng Zhang; Jibin Sun; Bowen, T.; Smet, V.; Gee-Kung Chang; Sundaram, V.; Tummala, R., "Modeling, design, and demonstration of ultra-miniaturized and high efficiency 3D glass photonic modules," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1054-1059, 27-30 May 2014
  22. Sitaraman, S.; Suzuki, Y.; Fuhan Liu; Kumbhat, N.; Sung Jin Kim; Sundaram, V.; Tummala, R., "Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate," in Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.4, no.8, pp.1276-1283, Aug. 2014
  23. Broas, M.; Demir, K.; Sato, Y.; Sundaram, V.; Tummala, R., "A comparative reliability study of copper-plated glass vias, drilled with CO2 and ArF excimer lasers," in Electronics System-Integration Technology Conference (ESTC), 2014 , vol., no., pp.1-5, 16-18 Sept. 2014
  24. Chinmay Honrao; Ting-Chia Huang; Kobayashi, M.; Smet, V.; Raj, P.M.; Tummala, R., "Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1160-1165, 27-30 May 2014
  25. Gandhi, S.; Liyi Li; Ho-Yee Hui; Chakraborti, P.; Sharma, H.; Raj, P.M.; Wong, C.P.; Tummala, R., "Nanowires-based high-density capacitors and thinfilm power sources in ultrathin 3D glass modules," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th , vol., no., pp.1492-1497, 27-30 May 2014