VISION
Provide industry with 1) New technical concepts and leading-edge technologies, and 2) educated human resources in future and emerging technologies of strategic importance.
The figure on the right illustrates the technology flow from exploratory or discovery stage to industry selection as strategic technologies, then onto technology development and scale up to volume manufacturing.
Most companies are driven by their desire to manufacture with which to make profits typically investing in development of new technologies 2-5 years prior to needed manufacturing. However, new technologies take more than 5 years to go from concept to manufacturing. As the figure illustrates, the role for universities and centers like PRC is in the exploratory and strategic research regimes. However, unlike most university programs, the PRC explores technologies in partnership with industry some 5-10 years ahead of the manufacturing need, connecting discoveries in a seamless fashion, eliminating the “valley of death” between university research and industry needs. In bridging the gap, the Georgia Tech PRC contributes in several modes, more than any other university with its industry collaboration programs. These modes include:
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STRATEGY
The PRC strategy to accomplish the above involves creating a new culture in the university environment: the US-Fraunhofer culture; US for innovation and Fraunhofer for effective technology transfer. Such a blended culture model involves not only academic faculty and graduate students as is typically practiced in most US universities, but also research faculty who are recognized technical experts working interactively with industry mentors who help define and steer programs and projects. These cross-discipline teams take a system view of the technologies to be developed, develops roadmaps, and completes the technology development at industry pace, starting with exploration and working through proof of concept to prototypes stages, all in constant communication with industry partners.
MODES OF ENGAGEMENT
There are several different modes of engagement with the PRC depending upon sponsor specific interests. These range from traditional university one-on-one research contracts to consortia programs where members working cooperatively leverage PRC's vast resources and consortia funding to realize strategic research and supply chain results.
One-on-one Research Contracts
Sponsors work individually with PRC faculty and student teams to address company-specific technology needs.
Costs vary depending upon project scope and duration. Intellectual property opportunities range from non-exclusive royalty-free to royalty-bearing exclusive environments.
A. Research
1. Full Member – Consortia Multiple Full Member Companies fund a thematic strategic research program, each mentoring and steering projects of specific company interest, supported by tool, materials companies and a compliment of PRC Academic and research faculty and Graduate Students.
Current PRC Thematic Consortia Programs include:
- Silicon & Glass Interposer (SiGI)
- Embedded MEMS Actives & Passives (EMAP)
- Thin Film Passive Components (TPC)
- 60GhzFEM
- Mixed Signal Design Tools (MSDT)
2. Full Member – One-on-One Sponsored Research Projects
A single company sponsored research agreement funding a specific project of interest, supported by tool, materials companies, if so desired, and a compliment of PRC Academic and research faculty and Graduate Students, on a topic of mutual interest.
Manufacturing Infrastructure Member
A low cost consortia membership where Tool, Material, and Process providers bring their state-of-the-art product offerings for inclusion into PRC/Full Member research programs enabling the providers to understand applicability of there offering in advanced applications in a neutral, non competitive environment.
B. University Industry Technology Ecosystem for Packaging
1.UnITE™ PAC
A low-cost entry level membership in PRC where companies can connect with each other, academia and other organizations to share common problems, define needs, and develop synergistic approaches to resolve infrastructure needs while sharing information in an open domain environment advancing the state-of-the-art of packaging, marketing their latest technologies and connect with students for internships and employment.
Variations on above Memberships as deemed required by the Industry Sponsor.
Typical Partnership Structure Costs and Benefits:
| Member Benefits | UnITE™PAC Member | Consortia Supply Chain | Consortia Full Member |
| UnITE™ Industry Webinars | Yes |
Yes |
Yes |
| UnITE™ Industry Conferences | Yes |
Yes |
Yes |
| UnITE™ Eco System Access | Yes |
Yes |
Yes |
| Annual Report/Newsletters | Yes |
Yes |
Yes |
| Awareness of Pkg Know How |
Yes |
Yes |
Yes |
| Materials/Equipment in Program | -- |
Yes |
Yes |
| Consortia Meeting Participation | -- |
Yes |
Yes |
| In-kind Specific Consortia Reports | -- |
Yes |
Yes |
| Engineer Short Term on Campus | -- |
Yes |
Yes |
| Early Infrastructure Development | -- |
Yes |
Yes |
| Mentorship and Steering | -- |
-- |
Yes |
| I/P Rights – N.E.R.F License | -- |
-- |
Yes |
| Test Vehicle Rights/Info | -- |
-- |
Yes |
| Engineer Long Term on Campus | -- |
-- |
Yes |
| Infrastructure Co-Development | -- |
-- |
Yes |
| Leveraging of Membership $ | -- |
-- |
Yes |
| 25% Super-Member Discount | -- |
-- |
Yes |
| Annual Membership Cost | $10K US |
$15K-$25KUS |
$60K-100K US |
List of Industry Members & Affiliates:
| AGC Electronics | Delphi Automotive | Jacket Micro Devices | Polymer Solutions |
| Agere | Delphi Packard | JDS Uniphase | Power Delivery Net. |
| Agilent | Dexter Research | Johns Hopkins | Pratt & Whitney |
| Air Product & Chem. | Dickerson Vision | Johnson & Johnson | Praxair |
| Alcatel USA | Disco | Johnson Matthey | Promerus |
| Altera Corporation | Divine | Kimberly Clark | QualComm |
| AMAT | Dow | Kodak | Quellan |
| AMD | Dow Chemical | KYMA | Rambus |
| Amkor | Dow Corning | Kyocera | Raytheon |
| AMP/Tyco Int’l. | Draper Laboratory | Lambda Electronics | Research Devices |
| Analog Devices | Duke Energy Systems | Lambda Technologies | RF Solutions |
| Ansoft Corporation | DuPont | LG Electronics | Rockwell Collins |
| Anvik | DuPont W.VA | Livermore Labs | Rogers |
| Applied Materials | Dynetics | Lockheed Martin | Rohm & Haas |
| Applied Simulation | Eaton | Loctite | R-Soft |
| Ardex | ECI | Logic Vision | SAIC |
| Ardext | ELO Technologies | Lord Corporation | SAMEER |
| Asahi Glass | Emerg. Tech. (ETS) | Lucent Technologies | Samsung |
| Asymtek | Emerson & Cumm | Matsushita Electric | Samsung Electronics |
| AT&S | EMS | Maxtek | Samsung Techwin |
| AT&T | Endicott Interconnect | MCT | Savantage Corp. |
| Atotech-Berlin | Engent | Media One | Sawtek |
| AVX Corporation | EPCOS | Medtronic | Schlumberger |
| BAE Systems | Ericcson | Melita International | Scientific Atlanta |
| Batelle-Pacific | EVGroup | Merek | Scintera Networks |
| BellSouth | Flipchip Tech. | Micro Substrates | SEMCO |
| Boeing | Florida Power & Light | Micro-ASI | Shipley |
| Bosch | Ford | MicroCoating (MCT) | Siemens |
| Bourns | Form Factor | MicroModule Systems | SkyWorks |
| BPW | Fujitsu | Micron Technologies | Smith Klien |
| Brewer Science | General Dynamics | Microsoft | Solectron |
| British Petroleum | General Electric | Mitsubishi | Sonoscan |
| BTU | General Motors | Mitsubishi Gas Chemical | SONY |
| Cadence Design | Goodrich | Motorola | Sony Chemicals |
| Cameron | Gould Electronics | MPR Associates | Specialty Coating |
| Cascade Microtech | Guidant | Multilink | SRC |
| Caterpillar | Hadco | Nanonexus | SSEC Corp |
| Chemfirst EKC | Halliburton Energy | National Semiconductor | ST Microelectronics |
| Chemical Products | Harima Chemicals | National Starch | Starfire Systems |
| Chrysler | Harris Corporation | Navair | Sun Microsystems |
| Circuit Tech. | Henkel | NCR | Symbol Tech |
| Cirrex | Hewlett Packard | NEC-Japan | Tellabs |
| Cirrus Logic | Hitachi Chemical | Nitronex | Tessera Technologies |
| Cisco | Honeywell Int’l | Nokia | Texas Instruments |
| Cold King | Hughes | Nortel | Toray |
| Compaq Corp. | Hynix | Northrop-Grumman | TriQuint Semiconductor |
| Condis | Ibiden | NTK/NGK | Verifiber |
| Contec | IBM | NXP Semiconductors | Verizon |
| Cookson America | Indium Corporation | Oak-Mitsui | VIB Systems |
| Corning | Industrial Logic Corp. | Pall Corp. | Visteon |
| Cree | Infineon | Panasonic | VT Silicon |
| CYC Enterprises | Inframat Corporation | Panda Project | Xerox-PARC |
| Cypress Semiconductor | Inplane Photonics | Philips | Zenith Electronics |
| Delco Electronics | Intel Corp. | Polaroid | Zeon Chemical |
| Dell | Irvine Sensors | Polymer Aging |
PRC Government Agency Affiliations
| AFOSR | Jet Propulsion Lab-CA | NIST | SAMEER |
| DARPA | NASA | NSA / DOD | Oak Ridge Nat. Labs |
| DOE | NAVY | National Science Foundation | U.S. Army/AMCOM |
| EPA | NIH | Sandia National Labs |
PRC Academia Collaborations
| Arizona State University | Clemson University | National University of Singapore | University of Illinois |
| Auburn University | Fraunhofer University | Polytechnic di Torino | University of Maryland |
| Budapest University | IME-Singapore (A*Star) | Rutgers University | University of Michigan |
| Calif. Inst. of Technology | Indian Institute of Technology | SUNY-Binghamton | University of Minn. |
| Carnegie Mellon | KAIST | University of Arkansas | University of Texas-Austin |
| Chalmers University | KETI | University of Denver | University of Washington |
PRC Professional Organization Membership
| IEEE | IMAPS | iNEMI | MARCO |