TechSearch International, Inc.
Packaging challenges for ADAS sensors
New automotive safety features include improved self-diagnostics, crash avoidance technology, and advanced driver assistance. This translates into increase use of image sensors, LiDAR, and radar. Multiple combinations of sensors are anticipated. What types of semiconductor packages are used in these new automotive electronics and what are the future challenges as new package types are adopted? This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications.
About the Speaker
Linda Bal, senior analyst, has more than 25 years experience in the design, test, and manufacturing of electronic packaging for semiconductors and systems from positions with Freescale, Motorola, Microelectronics and Computer Technology Corportation (MCC) and Eastman Kodak authoring/co-authoring numerous publications. She is a member of IEEE, JEDEC, and IMAPS. A member of the IMAPS technical committee since 2007, her contributions include chairing the Flip Chip and Wafer Level Package Tracks and moderating Technical Panel Discussions. Linda received her BSEE degree from Purdue University in 1985.