Team Lead, Power Electronics and Electric Machines
Oak Ridge National Laboratories
Additive manufacturing technology for power electronics applications
In recent years, some high power density air-cooled power modules / inverters using WBG devices have been demonstrated for several power electronics applications. In addition to module packaging structure, power electronics converter packaging introduces another level of complexity to design a high density inverter/converters. 3D power electronics converter packaging with integrated interconnects and heat exchangers can reduce the required assembly steps and increase the power density of the whole system. Recent advancements in additive manufacturing (AM) promise an exciting future trend for more advanced power module / converter packaging technology to make inroads into the power electronics industry. AM techniques enable the development of complex 3D geometries that will result in size, volume, and material reductions at both component and system levels.
About the Speaker
Dr. Madhu Chinthavali (ORNL Team Lead and PI, Power Electronics and Electric Machines). Ph.D. University of Tennessee, 2015. Dr. Chinthavali serves as the Team Lead for the Power Electronics and Electric Machinery Group at ORNL. He has over 15 years experience in wide bandgap semiconductor (WBG) devices and its applications. His research areas include: device- and system- level models, WBG-based converters and inverters for high frequency and high power systems for vehicle and grid-renewable energy applications and additive manufacturing of Power electronics components. Dr. Chinthavali is the Principle Investigator of the WBG Power Electronics at ORNL as well. Dr. Chinthavali is a senior Member of the Institute of Electrical and Electronics Engineers (IEEE) and has published over twenty papers for various conferences and journals.