Head RF Package Simulation & Characterization
INFINEON TECHNOLOGIES AG
Advances in packaging for RF and millimeter-wave system integration
Today’s car is a complex heterogeneous electronic system combining power semiconductor devices, high-speed wireless communication systems, microcontrollers, cameras, lidar and radar sensors. To make autonomous driving possible, a future car will require more and more high-performance and highly-integrated microelectronic systems. In this talk we present developments that emerged in assembly and interconnect technologies for RF and millimeter-wave system integration. We demonstrate the system integration capabilities of the embedded wafer level ball grid array (eWLB) technology for future RF and millimeter-wave automotive applications. After introduction of low loss transmission lines and high-quality (high-Q) planar inductors in thin-film redistribution layers (RDL) we present chip-package-board transitions without external matching networks optimized for use in the 60/70/80 GHz bands. We present the concepts of antenna integration in eWLB and show examples of different antenna structures. To demonstrate the system-in-package integration capabilities of eWLB, we show 60 GHz and 77 GHz eWLB transceiver modules with integrated antennas. The use of vertical interconnections and double-sided RDL extend the integration capabilities to the third dimension. We present ways of realizing vertical interconnections in eWLB using through encapsulate vias (TEV) and novel embedded Z lines (EZL) technology. We show examples of vertical interconnections, embedded passives, RF transitions and 3D antennas realized using the TEV and EZL technology. Finally we present the concept of substrate integrated waveguide (SIW) for eWLB. To combine advantages of planar circuits with rectangular waveguides we present a novel, compact and low-loss transition from chip to SIW in eWLB and to standard WR10 rectangular waveguide.
About the Speaker
Dr. Maciej Wojnowski is the Principal Engineer and the Head of Electromagnetic Simulation and Characterization in the central development department at Infineon Technologies AG. He has been with Infineon Technologies AG, Munich, Germany, since 2005. He has been working in development of RF and millimeter-wave passives and antennas for system-in-package applications. He was responsible for electrical characterization of the embedded Wafer Level Ball Grid Array (eWLB) technology. He is the author or co-author of more than 50 papers and 15 patents in the areas of RF and millimeter-wave packaging and passive device characterization. His research interests include package characterization and modeling, antenna and passive device integration for system-in-package, calibration and de-embedding techniques, and computational electromagnetics.