PRC INDUSTRY WEEK & CONSORTIA DEVELOPMENT - March 13-16, 2007

Industry Forum Day, March 14, 2007

SCHEDULED INDUSTRY KEYNOTE SPEAKERS • Packaging Technologies for Future Integrated Systems – Hans Stork, CTO , Texas Instruments • Aviation Electronics: Today and Tomorrow – Nan Mattai, Sr. VP, Rockwell-Collins • Implantable Neurostimulation Devices and Packaging for Chronic Implant – Todd Whitehurst, VP, Advanced Bionics • The Key Issues in Developing the Future SIP for Consumer Electronics – Kenshi Manabe, Executive VP, Sony

Georgia Tech Packaging Research Center (PRC) has announced the first Industry Forum Day on March 14th (Wed), 2007, which will be held at Georgia Tech campus. The Industry Forum Day features keynotes from industry visionaries from major global players in semiconductor, consumer electronics, avionics, bioelectronics, and Georgia Tech research leaders in IC design, NEMS and sensors, nanotechnology and system integration by SOP technology. Furthermore, the Industry Forum Day also provides a session specially designed to enhance interaction between companies and students, through student posters, company-student one-on-one, industry presentations and table-top exhibit. For further information, please contact cyoon@ece.gatech.edu or go to www.prc.gatech.edu/events/indforum07.

IAB Meeting for PRC Project Member Companies, March 13, 2007
On March 13th (Tue), 2007, an IAB meeting for PRC project member companies will be held at GT-PRC. The IAB will start with one-on-one meeting where individual research project will be discussed with PRC faculty and staff, followed by sessions of alliance research projects review, PRC seed funded research review, and membership and IP management. For further information, please contact cyoon@ece.gatech.edu or go to www.prc.gatech.edu/events/iab.

IAB Meetings for EMAP and MSDT Program Member Companies, March 15 & 16, 2007
GT-PRC has launched two consortia programs, Embedded Actives and Passives (EMAP) and Mixed Signal Design and Tools (MSDT) on January 8th, 2007. The first IAB meetings for the two consortia programs will be held on March 15th (Thu), 2007 for EMAP and on March 16th (Fri) for MSDT at GT-PRC. The IAB meetings are designed for review of research projects, industry feedback and IP management. In addition to this, student posters and demonstrations of research outcomes are also included in the day-long meetings. For further information, please contact vsunda@ece.gatech.edu for EMAP consortium and engin@ece.gatech.edu for MSDT consortium, or go to www.prc.gatech.edu/evehttp://nts/emap and www.prc.gatech.edu/events/msdt

NanoPack Consortium Workshop, March 16, 2007
A NanoPack consortium workshop will be held on March 16th (Fri.) at GT-PRC as part of the March Industry Week. The consortium workshop is the fifth of such consortia programs PRC has planned and implemented thus far. The NanoPack consortium program focuses on nano packaging, nano components, nano systems, and nano materials and processes for ultra miniaturized systems integration. In the workshop, keynotes from industry experts will address their needs and challenges, and Georgia Tech faculty will outline and propose number of projects relevant to the theme of NanoPack consortium. In the final session, a number of essential project topics will be selected with industry feedback and further modified in the later stages. For further information, please contact ks.moon@mse.gatech.edu, or download the latest flyer at www.prc.gatech.edu/events/nanopack/nanopack_flyer.pdf. For all consortia program activities at GT-PRC, please contact cyoon@ece.gatech.edu or go to www.prc.gatech.edu/events/consortia

RESEARCH INNOVATIONS

Thermal Management Initiatives
Recent PRC thermal management activities have been in two areas. The PRC is currently in the process of launching a two-university research consortium on thermal interface materials (TIM). This consortium will include university researchers from Georgia Institute of Technology and Binghamton University, with a target launch date of June 2007. The objective of the consortium is to achieve a 10x reduction in the overall TIM thermal resistance, by focusing on the fundamental technical barriers. The thermal management group also participates in the recently launched Embedded Actives and Passives (EMAP) consortium. Modeling of the thermal performance of embedded active components has begun, as part of this involvement. A variety of simplified geometries of chips embedded in low conductivity polymer have been simulated using a heat conduction code. In order to investigate the effect of internal air circulation within handheld systems, research and benchmarking on the internal geometries of handhelds is being performed. This includes both literature review and disassembly of representative devices. This information will be used to simulate the resistance from the surface of the embedded active module to the ambient environment. For further information, contact Prof. Yogendra, yogendra.joshi@me.gatech.edu.

Novel RF Thin Film Capacitor Technology Demonstrated
PRC, in collaboration with SouthWest Research Institute (SWRI), invented a new method of manufacturing embedded thin film capacitors directly on organic substrates with a capacitance density of 200 nF/cm2. By a combination of wet chemical treatment followed by plasma irradiation, it showed the feasibility of depositing a low TCC (<100 ppm/C), low loss (<0.005) and high capacitance density film (200 nF/cm2) directly on plastic substrates at temperatures less than 100 C, with adequate BreakDown Voltages and leakage current behavior. Current RF thin film capacitors are either polymer-based with low capacitance density, or high temperature vacuum-deposited (MOCVD thin film, thick film LTCC based composites) which cause serious limitations for RF integration. This new process is expected to enable complete RF integration for various applications such as matching networks, filters and even tunable components such as phase shifters. For details, please contact Raj Pulugurtha, raj@ece.gatech.edu.

Embedded Electrochemical Sensors with Microfluidics Demonstrated
Emergence digital convergence - combining computing, communication, consumer functions in a single portable system — when coupled with the advances in medicine lead to a new class of sophisticated implantable bioelectronic systems that can sense, digitize, diagnose, monitor and even dispense medicine to the regions of the body that needs it. The information can then be sent wirelessly to doctors in remote locations for instant advice and correction. PRC is pursuing biosystem integration on a organic platform to bring about the synergy between IC, package and system and, utilize high-performance low-cost polymer compatible processes for biosensing, microfluidic and micropump integration, while doing so, enable ultra-miniaturization of systems with multiple functions. Low-cost, disposable biofouling-resistant biosensors are in great clinical demand to enable continuous monitoring of helath conditions (for ex. blood sugar in a diabetic individual). Integrated planar electrochemical sensor with new sensing concepts such as zirconia-nafion enzyme encapsulants and embedded CNTs for high sensitivity are explored and demonstrated at PRC recently. Pt, chloridized silver and glassy carbon electrodes were integrated at low temperatures to enable organic compatible processes. The sensitivity towards glucose at millimolar concentrations was shown to demonstrate the concepts. The electrochemical sensors were also integrated with SU8 microfluidic channels and microneedles. Microneedle integration technology based on two-photon polymerization of ORMOCERs is being explored (in collaboration with Prof. Roger Narayan UNC Chapel Hill) to show complete BioSOP integration strategy. For details about BioSOP work at PRC, please contract Dr. Raj Pulugurtha, raj@ece.gatech.edu, Dr. Janagama Goud, jgoud@ece.gatech.edu and Dr. Mahadevan Iyer, iyer@ece.gatech.edu.

CONFERENCES & WORKSHOPS

PARTNERSHIPS & CONTRACTS

First Large Collaboration between India's Sameer and Georgia Tech's Packaging Research Center

The Packaging Research Center announces the first large collaboration in India with Sameer, an Indian government laboratory responsible for electronic design and prototyping.

Sameer will be investing in System-On-Package (SOP) technology by collaborating with the PRC through a large contractual program as well as setting up a new electronic design center in India for this technology.

Sameer's focus is on mixed signal applications using the technologies being developed at the PRC. Total funding for this work over the next three years is $5M. For further information, please contact Prof. Madhavan Swaminathan (madhavan.swaminathan@ece.gatech.edu).

Sameer corporate representatives Shri Karunakaran, Program Director and Shri Sridhar, Head of Communication Systems Division, pose with Georgia Tech provost, Dr. Gary Shuster, COE dean, Don Giddens, ECE chair, Dr. Gary May, PRC directors Rao Tummala and Madhavan Swaminathan, and Associate Director of Operations, Dean Sutter.

INFRASTRUCTURE

PRC Announces Web-based Lab Equipment Reservation System

The PRC Infrastructure staff announces the online implementation of Phase 1 of the Web-based Lab Equipment Reservation System for PRC Laboratory Users. The system will enable laboratory users to view equipment availability from the PRC Website Home Page, from any internet accessible computer around the world.

The Phase 1 key system attributes include:

• Extended calendar view of schedule for selected instruments
• Automatic emailing of instrument administrators for equipment issues
• Online booking and cancellations
• Use tracking of consumable resources
• Generation of cost billings and user usage reports

The planned Phase 2 system upgrades include:

• Improved granularity in tool permission configurations
• Anonymous browsing of instruments
• Improved access speed performance

Current PRC Lab users are encouraged to go to the PRC Website and browse the system by clicking on the "LAB USER SYSTEM" button. User names and permissions are currently being assigned for existing lab users.

For further information please contact Dean Sutter, dean.sutter@ece.gatech.edu

RECENT PUBLICATIONS

Power Integrity Modeling Book
"Power Integrity Modeling", the first book on Modeling of Power Delivery Networks in Semiconductor Systems will be published by Prentice Hall by the end of 2007. Written by Prof. Madhavan Swaminathan and Dr. Ege Engin, this book provides a collection of data from 10 years of research at the Packaging Research Center.

This book starts with the basic concepts of power delivery design and delves into the modeling of planes, simultaneous switching noise, time domain simulation methods and several applications. Using several examples, the various modeling techniques are illustrated. This book also provides a software package for modeling power integrity. For further information, please contact Prof. Madhavan Swaminathan , madhavan.swaminathan@ece.gatech.edu

Moving Next-Generation Electronics beyond Moore’s Law
Georgia Tech research publication, Research Horizons, recently featured an article written by Professor Rao Tummala (excerpted from his previous article on SOP in IEEE Spectrum). The article will be published in the Winter 2007 issue of Research Horizions, Faculty Column, pg. 24. The article will also be published on the web at gtresearchnews.gatech.edu/reshor/rh-f06/SOP.html

FAREWELL

Dr. Dimitrios E. Anagnostou
Dr. Anagnostou collaborated with PRC from 2005 until the end of 2006 as a Post-Doctoral Fellow. During his stay he worked as a project leader focusing on the design and development of novel antenna designs, embedded antennas and RF-MEMS switches on organic polymer substrates. His research resulted in a provisional patent application, three conference papers, and two journal paper submissions with more are under preparation.

During his 18-month stay he teamed-up with PRC research engineers and Ph.D. Candidates from the MiRCTECH and ATHENA-EM research groups. He actively participated in IABs, meetings, presentations and poster sessions as well as in the EMAP consortium’s RF-MEMS related projects. Dimitris learned a lot during his time at the PRC and remembers numerous pleasant moments. The friendliness of all PRC personnel and talented researchers will follow him everywhere, while PRC’s organization and state-of-the-art work environment and technology will always be a prototype to be followed by many. What makes PRC special is the combination of its people and their dedication to research.

Dr. Anagnostou was recently appointed Assistant Professor at the ECE Dept. of the School of Mines & Technology in South Dakota. There, he co-directs the “Flexible Antennas and Circuits Laboratory” and researches conductive inks development and direct printing of mesoscale and nanoscale electronics in collaboration with researchers of the “Maskless Mesoscale Material Deposition” (M3D) laboratory and the “Center for Accelerated Applications at the Nanoscale” (CAAN). He also teaches a senior level course, “Antennas for Wireless Communications”. He loves teaching as much as he enjoys research and advising graduate students.

Dimitris wishes everyone at PRC all the best and hopes their paths will cross again in the future.

RESEARCH STAFF

PRC’s "Capacitor Team" Continues to Lead Embedded Capacitor Technologies
The PRC was one of the pioneers of embedded decoupling and RF capacitors with thin high-k dielectrics in the organic build-up layers since the mid-1990s. It started the program with embedded ceramic polymer composites (capacitance density of 1-30 nF/cm2) and is currently migrating to embedded thin film ferroelectrics (1-5 µF/cm2). The capacitor team is also looking at novel capacitor concepts that can yield 100 microfarad/cm2 embedded both in the organic substrate and wafer (WLSOP) by 2009, for digital and bioelectronic applications. PRC is also leading the world with thin film RF capacitors that require stringent control in Temperature Coefficient of Capacitance (TCC) and dielectric loss. It recently demonstrated a low-temperature thin film technology with capacitance density of 200 nF/cm2, loss of 0.004 and TCC less than 50 ppm/C that can integrated both on organics and WLP compatible technologies for miniaturized RF components in matching networks, filters and oscillator circuits. Over the past few years, PRC partnered with several partners across the world (leading electronic industries in US, Korea, Japan) in demonstrating and enhancing capacitor technologies.

Current capacitor research includes:

Fabrication of ultra thin film embedded capacitor in organic packaging: Formerly, initiated with NSF funding, this project is now pioneering in manipulating the chemistry of the precursors with various dopants, additives and demonstrated high capacitance density of 2 µF/cm2, lowest leakage current (10-7 Amps/cm2) and highest BDV (>30 V) on bare copper foils. We further demonstrated the full integration of these films on PWB with successful HALT and HAST reliability tests.

• “Reactively formed integrated ceramic capacitors on organic substrates and fabrication methods”, Devarajan Balaraman, P. Markondeya Raj, Isaac Robin Abothu and Rao Tummala, US patent pending (Serial No: 11/363,334).

3D capacitors: PRC has demonstrated processes for ultrahigh capacitance densities by combining the high-k thin film technology with novel nano and high surface area electrodes.

• “High-k 3D capacitors”, P. Markondeya Raj, Isaac Robin Abothu and Rao Tummala, US patent application, filed 08/17/2006 in the USPTO.

Development of low TCC (<50 ppm/C) and high Q (loss < 0.005) thin film high k RF capacitors: In the RF polymer composite capacitor research, PRC has been focusing to overcome the fundamental material limitation of +ve and –ve TCC high-k materials by synthesizing new core-shell fillers with negative and positive TCC thus making net TCC of the composite close to zero. In this research, we developed new nano fillers with core-shell structure and demonstrated net TCC almost close to zero.

• “Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materials, Baik-Woo Lee, P. Markondeya Raj, Issac Robin Abothu, Swapan Bhattacharya and Rao Tummala (US patent pending Serial No: 11/429780)

PRC Capacitor Team’s Recent Publications

1. “Integrating high k thin film capacitors into organic substrates via low cost solution processing", Devarajan Balaraman, P. Markondeya Raj, Isaac Robin Abothu and Rao Tummala, Accepted for publication in IEEE CPMT Transactions on Components and Packaging Technologies.
2. “Electrical reliability of embedded ultra thin film ceramic capacitors in organic packages fabricated Via chemical solution processing on bare copper foils", Isaac Robin Abothu, P. Markondeya Raj, Jin Hyun Hwang, Manish Kumar, Mahadevan Iyer, Hiroshi Yamamoto and Rao Tummala, Accepted for Electronic Components and Technology Conference(ECTC) 2007, to be held at Reno,  Nevada, May 29-June 1, 2007.
3. “Tailoring of Temperature Coefficient of Capacitance (TCC) in Nanocomposite Capacitors", Baik-Woo Lee, Isaac Robin Abothu, P. Markondeya Raj, Chong K Yoon and Rao R Tummala, Scripta Materiallia 56, 1231-1234 (2006).
4. “Polymer Composite Based High-Performance RF Components", Jin Hyun. Hwang, P. Markondeya Raj, Isaac Robin Abothu, Chong Yoon, Mahadevan Iyer, Hyung Mi Jung, Jong-Kuk Hong, Rao. Tummala, Communicated to Microelectronics Engineering journal.
5. “Achieving LTCC-like RF Capacitor Performance with Polymer based Materials- Challenges and Solutions", Jin Hyun Hwang, P. Markondeya Raj, Isaac Robin Abothu, Chong Yoon, Mahadevan Iyer, Hyung Mi. Jung, Jong Kuk Hong and Rao Tummala, Accepted for Electronic Components and Technology Conference (ECTC) 2007, to be held at Reno,  Nevada, May 29-June 1, 2007.

STUDENT'S CORNER

The PRC student body is anxious to announce the founding of the Georgia Tech chapter of the IEEE Components, Packaging, and Manufacturing Technology Society (IEEE-CPMT). The organization of this new IEEE-CPMT chapter will facilitate continued interactions of students with industry as well as providing a professional affiliation which fits naturally with the mission with the PRC.

IEEE-CPMT is sponsors or co-sponsors many peer-reviewed journals where faculty and students of the PRC regularly publish their work. These journals include the IEEE Transactions on: Components and Packaging Technologies, Semiconductor Manufacturing, Advanced Packaging, and Electronics Packaging Manufacturing.

The inaugural officers of the GT IEEE-CPMT society are Grace Li (president), Todd Spencer (vice president), and Jin Liu (secretary). Grace and Jin, both Ph.D. students in materials science engineering, and Todd, a Ph.D. student in chemical and biomolecular engineering, all bring experience as past members of the PRC student council. Their diverse backgrounds and research areas also help to illustrate the multidisciplinary aspects of electronics packaging and the diversity of the PRC student body.

ADMINISTRATIVE STAFF

Barbara Park, Administrative Coordinator
Barbara Park joined the PRC in September 2005 after two years at Georgia Tech’s Distance Learning and Professional Education (DLPE) center.  She earned a Bachelor of Arts degree from Georgia State University majoring in Art History.  For 17 years she owned her own company—a production-based company for the film and television industry.  Her main focus there was location, wardrobe and properties.  She met and worked with lots of stars and sports figures, but after 17 years, and with changes in the industry, she decided to use her communication and marketing skills in other ways.

Barbara makes her home in northeast Atlanta where she lives with Isabella Lucy Love (a Gateway cat).  One of her several part-time endeavors is teaching Defensive Driving and Basic Sewing.  “I am elated to see the promise of defensive driving coming back to public high schools.” she says.  Barbara’s other volunteer loves include the Atlanta Opera and Habitat for Humanity

Christine Baker Wins Award for 5K Run for Diabetes
Christine Baker, PRC accounting office, won 2nd Place and received a trophy for her participation in the 5K Walk for Life for Diabetes. The race took place at Grant Park in Atlanta, Georgia on November 18, 2006.

Congratulations Christine!

AWARDS & RECOGNITION

New Joseph M. Pettit Chair Appointment
Prof. Madhavan Swaminathan has been appointed as the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering, Georgia Tech.

Prof. Swaminathan has been with the Microsystems Packaging Research Center since its inception in 1994 and has served as the deputy director of the Center since 2004. Advisor to 15 graduate level students and several researchers, Dr. Swaminathan has written 250 publications in refereed journals and conferences, has 12 issued patents and 10 patents pending.

In 2002, he co-founded and became chief scientist of Jacket Micro Devices, a company specializing in interated wireless mdoules for WLAN and WiMAX applications. Dr. Swaminathan was elected as an IEEE Fellow in 2006 for his contributions to Mixed Signal Tools for Power Delivery in Packaging.

Eta Kappa Nu Honor Society Wins Award
On Jan. 1, 2007 it was announced that the Georgia Tech chapter of Eta Kappa Nu, electrical and computer engineering honor society, was selected to receive the Outstanding Chapter Award for 2005-06. According to the National Office of Eta Kappa Nu, "This coveted award is a mark of distinction for a college chapter. Chapters are judged on activities of service to their fellow students, their department, their school and their surrounding community. Metrics are geared to the size of the chapter, so that small and large chapters with exemplary programs have the same chance to win."

The faculty advisor for the Georgia Tech chapter of Eta Kappa Nu is PRC faculty member Tom Gaylord. He indicated that this is the second year in a row that the Georgia Tech chapter has garnered this distinction. The award will be presented to ECE department chair, Gary May at the ECE Department Head’s Association meeting on March 19, 2007 in St. Augustine, Florida.

Outstanding Poster Paper for the 56th ECTC in 2006
Dr. Tae Hong Kim’s paper, "Novel Synthesis Method for Designing Electromagnetic Band Gap (EBG) Structures in Packaged Mixed Signal Systems," was chosen as the Outstanding Poster Paper at the 56th ECTC in 2006. Authors are Tae Hong Kim, Daehyun Chung, Ege Engin, Wansuk Yun, Yoshitaka Toyota, and Prof. Madhavan Swaminathan. Winning authors will receive a personalized certificate commemorating their achievement and will share a check for US $1,000. The award will be formally presented at the 57th ECTC in Reno, Nevada from May 29 - June 1, 2007. Please send correspondences to gtg732p@mail.gatech.edu or madhavan.swaminathan@ece.gatech.edu.

Design Paper Award
Abdemanaf Tambawala, Dr. Ege Engin and Dr. Swaminathan Madhavan, - (Georgia Tech), Pranabes Pramanik, Kazuhiro Yamazaki, John Andreasakis (Oak-Mitsui), "Compact Electromagnetic Bandgap Structures for Power Plane Isolation Using High-K Dielectrics, "International Engineering Consortium (DesignCon 2007) - Finalist for DesignCon Paper Award in the Category of Board-Level Design.

FACULTY

Professor John Papapolymerou
Associate Professor, Electromagnetics, and Electronic Design and Applications

Microwave Circuit Technology Group: www.ece.gatech.edu/research/MIRCTECH

John Papapolymerou received the B.S.E.E. degree from the National Technical University of Athens, Athens, Greece, in 1993, the M.S.E.E. and Ph.D. degrees from the University of Michigan, Ann Arbor, in 1994 and 1999, respectively.

From 1999-2001 he was a faculty member at the Department of Electrical and Computer Engineering of the University of Arizona, Tucson and during the summers of 2000 and 2003 he was a visiting professor at The University of Limoges, France. From 2001-2005 he was an Assistant Professor at the School of Electrical and Computer Engineering of the Georgia Institute of Technology, where he is currently an Associate Professor.

Dr. Papapolymerou received the 2004 Army Research Office (ARO) Young Investigator Award, the 2002 National Science Foundation (NSF) CAREER award, the best paper award at the 3rd IEEE International Conference on Microwave and Millimeter-Wave Technology (ICMMT2002), Beijing, China and the 1997 Outstanding Graduate Student Instructional Assistant Award presented by the American Society for Engineering Education (ASEE), The University of Michigan Chapter. His student also received the best student paper award at the 2004 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Atlanta, GA. He has authored or co-authored over 130 publications in peer reviewed journals and conferences. He currently serves as the Vice-Chair for Commission D of the US National Committee of URSI and as an Associate Editor for IEEE Transactions on Antennas and Propagation and IEEE Microwave and Wireless Component Letters. During 2004 he was the Chair of the IEEE MTT/AP Atlanta Chapter.

Professor Papapolymerou’s research interests focus on the development of novel, low cost RF/microwave circuits for future wireless communication, radar and sensor systems. More specifically, his group develops high performance, planar RF/microwave circuits that will constitute the RF front-end of next generation system-on-a-chip (SOC) and system-on-a-package (SOP) based wireless systems. A major component of Prof. Papapolymerou’s research activities deals with implementing micromachining techniques and RF micro-electro-mechanical-system (MEMS) devices for the development of reconfigurable, multiband and "smart" wireless radios, such as a cognitive radio. As an example, his group has developed eletrostatically activated RF MEMS switches on organic substrates with superior performance up to 50 GHz (loss<0.3 dB). These switches have been utilized to develop highly integrated multiband phased array systems on multilayer organic substrates with low loss phase shifters in Ka-band. This highly integrated 3-dimensional RF front end includes a variety of passive components (e.g. filters, power dividers), as well as embedded active circuits (e.g. amplifiers). Other research efforts include the development of conformal antennas for UWB applications, as well as investigation of fundamental physical effects for RF MEMS switches.

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