What's New in Packaging @ Georgia Tech? New Innovations in Thermal Management of 2.5D and 3D Packages.
The Georgia Tech Packaging Research Center is pioneering power input and thermal outputs are two of the biggest challenges in all electronics. The need for thermal management arises because of the power supplied to the small ICs with highest electrical resistance in any system, according to the well-known Joule’s Law.
Georgia Tech Develops Via-in-Trench with up to 10x Improvement in I/O density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/layer
Georgia Tech develops industry’s first panel level packaging to the same characteristics as wafer- based BEOL with a novel damascene- like via-in-trench (ViT) interconnect redistribution layer (RDL) technology.
ESI places its CornerStone™ ICP UV Laser Drilling System at Georgia Tech to Enable Innovations in RDL for 2.5D Interposers, 5G packaging, Next Generation of embedded and Fan-out Packaging and many more
Electro Scientific Industries, Inc. (ESI), installed its CornerStone™ ICP UV laser drilling system at Georgia Tech-PRC to enable development of industry’s most leading-edge redistribution layers (RDL) with smallest through vias in 2.5D, 3D and fanout packages.
The Georgia Tech Packaging Research Center is pioneering the Georgia Tech Developing Ultra-thin Glass Panel Embedding (GPE) for a combination of highest I/O density, lowest RC delay, thinnest size and lowest cost.
The Georgia Tech Packaging Research Center is pioneering the Introductory and Undergrad Textbook with all the Latest Device and Systems Packaging and Package Integration Technologies “Fundamentals of Electronic Device and Systems Packaging Technologies”.
The Georgia Tech Packaging Research Center is pioneering most advanced ultra-thin, High-Performance and Low-Cost 5G modules with Integrated and High-Gain Antennas in 3D.
What's New @ GT in Packaging? Si Interposers are here and they work. What’s next? Only interposer better than Si is Glass for four reasons
The Georgia Tech Packaging Research Center is pioneering ultra-high I/O density glass BGA packages as the next generation, beyond Si interposers that are used in all high-end applications, for four reasons.
Georgia Tech and its industry partners have developed the most advanced package-level electromagnetic interference (EMI) shielding structures for emerging highly-miniaturized system packages.
What's New @ GT in Packaging? Ultra-thin Dry Film Polymer Materials and Processes for High-density 2.5D and Fan-out Packages
Georgia Tech and its industry partners are developing the next generation of ultra-thin polymers to form 20-40µm pitch RDL for 2.5D and Fan-out packages.
What's New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics
Georgia Tech and its industry partners are developing a new class of molding compounds with superior thermal stability and reliability up to 250°C for a variety of applications, including high-power automotive electronics, and wafer and panel fan-out packages.
Georgia Tech and its industry partners are developing 5G and mm-wave packaging using ultra-thin Glass panel Fan-out technology with 10-100X improvement in bandwidth for consumer, computer, communication and automotive applications.
Georgia Tech and its industry partners develop next generation of ultra-thin and ultra-high I/O density panel and wafer fan-out packaging to close the interconnect gap for digital applications, thickness or miniaturization gap for analog, power, RF and mm-wave applications, and power and thermal gap for high-power applications.
Georgia Tech and its industry partners demonstrate 3D Glass Photonics for ultra-high bandwidth, low cost and low power.
Georgia Tech and its industry partners have demonstrated major advances in glass-based High-Q inductors in thickness and Quality Factor.
Georgia Tech and its industry partners demonstrate pioneering advances in 3D Glass-based RF modules and Integrated Passive Devices (3D IPDs) as the next stage of evolution.
Georgia Tech and its industry partners have developed 2.5D glass interposer technology as a superior alternative to organic interposers in interconnect density, and silicon interposers in electrical performance, power consumption, and cost.
High throughput small through-package-vias (TPV) holes and metallization processes are developed, as well as low cost RDLs with 2-5 micron wiring leading to 20-40 micron I/O pitch on both sides of thin glass.