Nano Biomedical Packaging
Jorma Kivilathi - Helsinki
University of Technology
Roger Narayan - Georgia Institute of Technology
Nano Photonics
Avi Bar-Cohen - University
of Maryland
Ali Adibi - Georgia Institute of Technology
Nano Packaging Materials
Goran Matijasevic – University
of California
C. P. Wong - Georgia Institute
of Technology
MEMS, NEMS & Sensors
Farrokh Ayazi - Georgia
Institute of Technology
Ajay Malshe - University of Arkansas
Nano Interconnections
Andrew Tay - National
University of Singapore
Nano Thermal Interfacing Materials
William Chen – ASE
Inc.
Srinivas Rao – Solectron
Packaging of Nano Cu-Low K
G.Q. (Kouchi) Zhang – Philips
Semiconductors
International
Planning Committee
Avi Bar-Cohen (abc@eng.umd.edu), University
of Maryland
Karl Becker (becker@izm.fhg.de), Fraunhofer
Institute of Technology
Bill W. Brown (wdb@engr.uark.edu), Univ.
of Arkansas
Moises Cases (cases@us.ibm.com), IBM
Kuo-ning Chiang (knchiang@pme.nthu.edu.tw), National
Tsing Hua University , Taiwan
Thom Fischer (tafi sch@sandia.gov), Sandia National Laboratory
Shen-Li Fu (slfu@isu.edu.tw), I-Shou University , Taiwan
Lih-Tyng Hwang (L-hwang@motorola.com), Motorola
Jorma Kivilahti (jorma.kivilahti@hut.fi ), Helsinki University
of Technology
Sue Law (s.law@oftc.usyd.edu.au), Australian Photonics
Charles Lee (charles.lee@infineon.com), Infineon
Yeong J. Lee (Yeong.lee@dowcorning.com), Dow Corning
James Libous (libousjp@us.ibm.com), IBM
Ajay Malshe (apm2@engr.uark.edu), University of Arkansas
Goran Matijasevic (goran@uci.edu), University of California
, Irvine
Jim Morris (j.e.morris@ieee.org), Portland State University
Randy Rannow (randy.rannow@hp.com), Hewlett-Packard
Srinivas Rao (srinivasrao@ca.slr.com), Solectron
Andrew Tay (mpetayao@nus.edu.sg), National University
of Singapore
Michael Wahl (michael@rs.uni-siegen.de), Universitat
Siegen
Sponsors
IEEE
IEEE-CPMT
Society (www.cpmt.org)
iNEMI (www.nemi.org)
Packaging Research Center (PRC) - Georgia Institute of Technology (www.prc.gatech.edu)
