Sponsoring Socieites

THE EVENT

GT Atlanta

The Global Interposer Technology 2013 Workshop (GIT 2013), sponsored by IEEE, is intended to stimulate development of most advanced semiconductor and systems packaging  technologies, comparing and contrasting a wide variety of interposer technologies such as silicon, organic, and glass.

GIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. Such interposer technologies have many applications including packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive, and high performance systems.

GIT 2013 will focus on Interposer Technology with an expanded 2 1/2-day agenda including:

* Plenary Talks from Industry and Academic Experts
* Technical Sessions
* Interactive Poster Session
* Networking Reception

GIT 2013 GENERAL CO-CHAIRS

Rao Tummala Georgia Tech

Prof. Rao R. Tummala
Director, 3D Systems Packaging Research Center

GEORGIA INSTITUTE

OF TECHNOLOGY

Matt Nowak Qualcomm


Matt Nowak

Senior Director,
Advanced Technology

QUALCOMM

KEYNOTE AND INVITED SPEAKERS

High Performance & Mobil Sys.
Silicon Interposers: Foundry, OSAT and Research
Jeffrey Burns IBM Urmi Ray Qualcomm David McCann Global Foundries Yann Lamy CEA LETI CP Hung ASE Group Ron Huemoeller AMKOR


Jeffrey Burns

IBM


Urmi Ray

QUALCOMM

David McCann

GLOBAL FOUNDRIES


Yann Lamy
CEA LETI


CP Hung

ASE GROUP


Ron Huemoeller

AMKOR

Organic Interposers and Packages: User, Manufacturer, Research and Supply Chain Perspectives
Bob Sankman Intel Dyi Chen Hu Unimicron John Xie Altera Sung Jin Kim Georgia Tech Taku Torii NGK NTK

 

Bob Sankman

INTEL

 

Dyi Chung Hu

UNIMICRON

 

John Xie

ALTERA

 

Sung Jin Kim
GEORGIA TECH

 

Takuya Torii

NGK

Mitsuo Sugino

SUMITOMO BAKELITE CO., LTD.

Glass Interposers and Interconnections: Research, Application, Manufacturing Perspective
Venky Sundaram Georgia Tech Zouhair Sbiaa Nemotek Toshi Seki NGK NTK Naoyuki Koizumi Shinko Terry Bowen TE Connectivity Michael topper Fraunhofer IZM

Venky Sundaram
GEORGIA TECH

Zouhair Sbiaa
NEMOTEK

Toshi Seki
NGK NTK

Naoyuki Koizumi
SHINKO

Terry Bowen
TE

Michael Töpper
FRAUNHOFER

Glass Panel Manufacturing and Glass Interposer Manufacturing Instructure
Nobu Imajyo Asahi Glass Windsor Thomas Corning Uwe Wilkins SCHOTT Tomonaga Ushio Yuya Suzuki ZEON Robin Taylor Atotech

Nobuhiko Imajyo

ASAHI GLASS

Windsor Thomas

CORNING

Uwe Wilkens

SCHOTT

T Tomonaga
USHIO

Yuya Suzuki
ZEON

Robin Taylor
ATOTECH

Analog and Embeddded Packaging Design: Thermal and Mechanical
Matthew Romig Texas Instruments Sonja Knies Bosch Sonja Knies Bosch Jounghyun Cho  KAIST Yogendra Joshi Georgia Tech Suresh Sitaraman Georgia Tech

Matthew Romig

TI

Sonja Knies
BOSCH

Steffen Kröhnert
NANIUM

Jounghyun Cho
KAIST

Yogendra Joshi
GEORGIA TECH

S Sitaraman
GEORGIA TECH

Markets and Applications        
Phil Garrou Yole          

Phil Garrou
YOLE

         

 

Sponsoring Socieities

Admin & Organizing Committee

GIT 2013 Coordinator: karen.may@prc.gatech.edu

On-site Event Logistics: patricia.allen@prc.gatech.edu

Questions?

Contact Karen May at +1 404 385-1220