Sponsoring Societies

IEEE GIT2012 FINAL PROGRAM

WEDNESDAY, NOVEMBER 14, 2012

7:30 - 8:30 Breakfast and Registration
8:30 - 8:45 Welcome and Introductions
9:00 - 4:00 Plenary Keynote Session

Plenary Keynote Speakers

Session 1

Session 2

Iyer
Chen
Yu
Ramaswami
Subramanian Iyer
IBM
Co-Chair
William Chen
ASE
Co-Chair
Doug Yu
TSMC
Co-Chair
Sesh Remaswami
AMAT
Co-Chair
Ramlingham



Suresh Ramalingham

XILINX
"Recent Advances in 2.5 D and 3D"
J Kim
Joungho Kim

KAIST
"Silicon vs. Glass Interposer: A comparative study - bandwidth, I/O, power and noise"
Nowak

Matt Nowak

QUALCOMM
"2.5D Interposers and 3D TSV DRAM stacking – what's next?"
Garrou

Phil Garrou
YOLE DEVELOPPEMENT
"The interposers market: A 2012 update"
Tummala
Rao Tummala

GEORGIA TECH
"Glass and silicon interposers and packages, 1st step in system scaling for Smart consumer systems"
Arkalgud

Sitaram Arkalgud

SEMATECH
"Scaling 2.5/3D -- the next R&D Challenge"
Greenwood

Jon Greenwood

GLOBAL FOUNDRIES "Collaborative R&D for enabling advanced packaging and supply chain solutions"
Bocko
Peter Bocko

CORNING
"Glass as an enabling semiconductor packaging material: myths, potential and challenges"
Vodrahalli

Nagesh Vodharalli

ALTERA
"Needs, challenges and status in low-cost silicon interposers"
 
4:15 - 5:45 Plenary Panel Discussion: Silicon vs. Glass and Wafer vs. Panel

Plenary Panel Discussion Participants

Tummala
Iyer
Yu
Ramlingham
Rao Tummala
GEORGIA TECH
Moderator
Subramanian Iyer
IBM
Doug Yu
TSMC
Suresh Ramalingham
XILINX
Nowak
Greenwood
Vordrahalli
J Kim
Matt Nowak
QUALCOMM
Jon Greenwood
GLOBAL FOUNDRIES
Nagesh Vodharalli
ALTERA
Joungho Kim
KAIST
Ramaswami
Garrou
Arkalgud
Bocko
Sesh Ramaswami
APPLIED MATERIALS
Phil Garrou
YOLE DEVELOPPEMENT
Sitaram Arkalgud
SEMATECH
Peter Bocko
CORNING

THURSDAY, NOVEMBER 15, 2012

7:30 - 8:30 Breakfast and Registration
8:30 - 8:45 Welcome and Announcements
8:45 - 10:05 Electrical Modeling and Design Session
Co-Chairs: Suresh Ramalingham, Xilinx; Madhavan Swaminathan, Georgia Tech

Electrical Modeling and Design Session Speakers

Swaminathan
Kostka
S  Kim
Honda
Session Keynote: Madhavan Swaminathan GEORGIA TECH
"Power distribution methods for 3D I/O signaling"
Darryl Kostka
CST
"TSV and Silicon Interposer - 3D Numerical Modeling and Characterization"
Sooyong Kim
APACHE DESIGN
"Extraction and silumation of complex silicon interposer structures with measurement correlation"
Hiroyuki Honda
STARC
"Electrical modeling technique of silicon interposer for chip-package-board co-design"
10:35 - 12:00 Mechancial Modeling and Design Session
Co-Chairs: Rajiv Dunne, TI; Suresh Sitaraman, Georgia Tech

Mechanical Modeling and Design Speakers

Webb
Syed
Ryu
Sitaraman
Session Keynote: Bucknell C. Webb
IBM
"Mechanical modeling and analysis for 3D design, handling and assembly"
Abstract
Ahmer Syed
AMKOR
"Electromigration reliability of multi-scale 3D interconnects: from micro-bumps to BGA solder joints"
Suk-Kyu Ryu
UNIVERSITY OF TEXAS
"Thermomechanical characterization of TSV structures for 3D integration"
Suresh Sitaraman GEORGIA TECH
"Reliability of 3D interconnects"
1:25 - 2:50 Silicon Interposes and Packages Session
Co-Chairs: Nagesh Vodrahalli, Altera; Alan Huffman, RTI

Silicon Interposers and Packages Speakers

Li
Lamy
Boettcher
Vick
Session Keynote:
Ming Li

RAMBUS
"Design and Manufacturing challenges for a 2.5D Silicon interposer with double side active die attachments"
Session Keynote:
Yann Lamy
CEA LETI
"More-wires vs. more-than-wires"
Mathias Boettcher FRAUNHOFER, IZM
"2.5D Interposer – An integral element of multi-functional 3D-systems"
Erik Vick
RTI
"Electrical demonstration of TSV and multi-level metallization technology for Silicon interposers"
3:20 - 4:50 Glass Interposers and Packages Session
Co-Chairs: Venky Sundaram, Georgia Tech; Shintarou Takahashi, Asahi Glass

Glass Interposers and Packages Speakers

Sundaram
Imayo
Shorey
Katsura
Session Keynote:
Venky Sundaram

GEORGIA TECH
"Low-cost double-side ultra-Thin glass interposer and package"

Session Keynote:
Nobuhiko Imajo
ASAHI GLASS
"Through Glass Vias (TGV) technology for larger interposer substrate"
Aric Shorey
CORNING
"Development of Through Glass Via (TGV) substrates for 3D-IC integration"
Tomotaka Katsura
MITSUBISHI ELECTRIC
"High-speed drilling through-holes in Borosilicate glass substrates by high-peak-power CO2 laser"
5:00 - 7:00 Academic Students and Industry Poster Session

Academic Session Poster Awards Committee

Arkalgud
Chen
Greenwood
Iyer
J Kim
Nowak
Sitaram Arkalgud William
Chen
Jon
Greenwood
Subramanian
Iyer
Joungho
Kim
Matt
Nowak
Ramaswami
Ramlingham
Sitaraman
Swaminathan
Vordrahalli
Yu
Sesh Ramaswami Suresh
Ramalingham
Suresh Sitaraman Madhavan Swaminathan Nagesh Vodharalli Doug
Yu
Tummala
Iyer
Gandhi
Industry Participants
Atotech
Bridge Semi
IMEC
IZM Fraunhofer
National Key Lab
Tamar Technology

University Participants
Univ. of Alabama
Georgia Tech
Univ. of Maryland
No. Carolina State U
Peking University
Univ. of Rabat
TU Dresden
Rao Tummala
GEORGIA TECH
Co-Chair
Subramanian Iyer
IBM
Co-Chair
Saumya Gandhi
GEORGIA TECH
Co-Chair

FRIDAY, NOVEMBER 16, 2012

7:30 - 8:30 Breakfast and Registration
8:30 - 8:50 Welcome and Announcements
8:50 - 10:00 Chip and Board Level Interconnections Sessions
Co-Chairs: Ron Huemoeller, Amkor; Sung Jin Kim, Georgia Tech

Chip and Board Level Interconnections Speakers

Gerber
Kim
Choi
Session Keynote:
Mark Gerber

TEXAS INSTRUMENTS
"Chip level interconnect enabling next generation devices"
Session Keynote:
Sung Jin Kim

GEORGIA TECH
"Next generation PoP for bandwidth of  next generation Smart phones"
KS Choi
ETRI
"Novel Solder-on-Pad (SoP) material and process for low-cost interposers"
 
10:00 - 10:30 Student Poster Session Awards
10:30 - 12:00 MEMS and Passives Session
Chair: Raj Pulugurtha, Georgia Tech and Farrokh Ayazi, Georgia Tech

MEMS and Passives Speakers

Ayazi
Pulugurtha
Sullivan
Xiao
Session Keynote:
Farrokh Ayazi

GEORGIA TECH
"Next gen MEMS challenges and MEMS packaging consortia to address these challenges"
Session Keynote:
P.M. Raj
GEORGIA TECH
"3D IPAC: A new actives and passives concept for ultra-miniaturized functional modules"
Charles Sullivan
DARTMOUTH
"Nanogranular nagnetic materials for enhanced low-profile inductors"
Danny Xiao
INFRAMAT
"Fabrication of nanostructured magnetic thick films for microelectronic applications"
12:00 - 1:30 Lunch and Closing Remarks by Rao Tummala
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Admin & Organizing Committee

GIT 2012 Coordinator: karen.may@ece.gatech.edu

On-site Event Logistics: patricia.allen@ece.gatech.edu

Questions?

Contact Karen May at 404 385-1220