GIT2012

THE EVENT

The Global Interposer Technology (GIT) 2012 Workshop is intended to stimulate and disseminate the development of a wide variety of interposers such as silicon, glass and others.

GIT 2012 brings together academic and industry researchers as well as technology developers, users and manufacturers from around the globe. Such a technology is seen as, not only for packaging of ICs and 3D ICs, but also as a future ultra-miniaturized platform for entire smart mobile and high performance systems.

GIT 2012 will focus on Interposer Technology with an expanded 3-day agenda including:

* Plenary talks from Industry and Academic experts
* Technical Sessions
* Interactive Poster Session
* Networking Reception

PLENARY KEYNOTE SPEAKERS

	Suresh Ramalingam, XILINX “Recent Advances in 2.5 D and 3D”		Matt Nowak, QUALCOMM “2.5D Interposers & 3D TSV DRAM Stacking – What’s Next?”
	Nagesh Vodharalli, ALTERA “Needs, Challenges and Status in Low-cost Si Interposers”		Sitaram Arkalgud, SEMATECH “Scaling 2.5 and 3D - The Next R&D Challenge”
	Rao Tummala, GEORGIA TECH "Strategy and Progress in Low cost Si and Glass Interposers and Packages"		Phil Garrou, YOLE “The Interposers Market: A 2012 Update”
	Jon Greenwood, GLOBAL FOUNDRIES “Collaborative R&D for Enabling Advanced Packaging and Supply Chain Solutions”		Peter Bocko, CORNING “Glass as an Enabling Semiconductor Packaging Material: Myths, Potential and Challenges"”
	Joungho Kim, KAIST "Si Vs Glass Interposer: A Comparative Study - Bandwidth, I/O, Power and Noise"

PLENARY KEYNOTE DISCUSSION
"Interposer Platforms: Silicon vs. Glass -- Wafer vs. Panel"

	Sesh Ramaswami, AMAT		Doug Yu, TSMC
	Subramanian Iyer, IBM

REGISTER TODAY

EARLY REGISTRATION RATES Expire, October 15, 2012

Register early to ensure that you can participate in this one-of-its-kind Global workshop on Interposer Technology.