Monday, March 10, 2008

Georgia Institute of Technology's Packaging Research Center,
Manufacturing Research Center (MaRC) Building, Room 114, Atlanta, Georgia U.S.A.

Visitor Travel Info | Download Final Agenda

The Microsystems Packaging Research Center at the Georgia Institute of Technology (PRC-GT) proposes to create an Industry-Academia collaborative consortium to address the R&D of next generation Thermal Interface Materials (TIM) with thermal resistance below 0.005 °C-cm 2/W), including materials, processes, structures and reliability characterization.

While considerable improvements in TIM performance have been achieved in the past five years with the development of gels and phase change metallic alloys, further enhancements may require a systematic approach toward material selection/development, interface characterization, assembly and reliability assessment.

The Georgia Tech PRC is a global academic leader working on several innovative “total system” approaches that include IC-package electrical, mechanical, and thermal co-design methodologies, thermal management and characterization techniques, new and advanced chip-to-substrate interconnects, embedded passives and actives, new substrate materials and interfaces, advanced assembly processes, and reliability assessment techniques.

Contacts

Prof. Rao Tummala
rao.tummala@ee.gatech.edu, 404-894-9097

Dr. Chong Yoon
cyoon@ece.gatech.edu, 404-385-6231

Prof. Yogendra Joshi
yogendra.joshi@me.gatech.edu, 404-385-2810

Agenda

March 10 (Monday), 2008

Registration: 11:30 AM~12 Noon, MaRC Atrium

Lunch: 12:00~1:00 PM, MaRC Atrium

1. 1:00~1:30 PM: Welcome and Introduction—Prof. Yogendra Joshi

1:30~5:05 PM

Session 1: TIM Research Projects Review—Chair, Profs. Bahgat Sammakia and Jianmin Qu

• Task 1: TIM Materials and Interfaces
• Project 1.1: The Development of Aligned Carbon Nanotube Films For Thermal Interface Material Applications—Profs. C. P. Wong and Samuel Graham (50 min)

2) Task 2 and 3: TIM Assembly and Bonding, and Characterization of TIM

• Project 2.1: Assembly and Testbed Research with Metal and Metal Composite TIM—Dr. Raj Pulugurtha, Gopal Jha, Janagama Goud and Prof. Rao Tummala (30 min)

Coffee Break: 2:50~3:20 PM

• Project 3.1: Thermal and Thermomechanical Modeling and Characterization of TIMs and Their Interfaces—Profs. Yogendra Joshi, Bahgat Sammakia and Jianmin Qu (75 min)

3) Task 4: TIM Reliability:

• Project 4.1: Design for Reliability of Thermal Interface Materials - Prof. Suresh Sitaraman (30 min)

5:05~5:35 PM:

Session 2: Wrap-up Discussion-- Chair, Prof. Yogendra Joshi

Industry Dinner: 6:30PM~8:30 PM, Georgia Tech Hotel