Nano Packaging, Materials, Components & Systems (NanoPack)
Tuesday, April 15, 2008

Manufacturing Research Center (MaRC) Building, Room #114
813 Ferst Drive, NW, Atlanta, Georgia 30332, U.S.A.

Map, Directions & Parking | Final Agenda (PDF) | Visitor Travel Info

Nanoscience and nanotechnology have been buzzwords for more than a decade. Most of the research to date in this area, however, has been focused on materials and devices. Technologies such as carbon nano tubes (CNTs), molecular self assembly, nano imprints, and sensors, etc., are being explored and studied for mechanical, physical, chemical, photonic, electronic and biological properties.

The Microsystems Packaging Research Center proposes going beyond nano materials and devices to form system level components (chip-to-package interconnections, thin film components conductors, dielectrics, capacitors, resistors, inductors, encapsulants, coatings, power sources, batteries) leading to nano modules. This emphasis is expected to lead to a number of commercial applications during the next decade.

To accomplish these goals, the Packaging Research Center announces a global Industry-Academia consortium on "Nano Packaging, Materials, Components & Systems (NanoPack)" to explore a variety of new opportunities and applications.

Who Should Join?
Scientists, engineers and managers from semiconductors, electronic systems, energy, biotech, pharmaceuticals, defense and aerospace industries are invited to attend  the exploratory workshop.

Topics
Topics to be covered include the long term strategic industry needs by Industry experts, as well as a review of ongoing and proposed new research to be included in the consortium.

• Chip-to-Package Nano Interconnections
• Nano-coatings
• Nano Embedded Thin Film Passive Components
• Nano Materials for High Performance Batteries

Contacts

Prof. C. P. Wong
cp.wong@mse.gatech.edu

Prof. Rao Tummala
rao.tummala@ee.gatech.edu

Dr. Jack Moon
Jack.moon@gatech.edu

Final Agenda

7:45 AM: Registration and Coffee (Atrium)

8:15 AM: Welcome and Introductions - Prof. Tummala

SESSION 1 (8:45 - 10:45 AM) - Industry Keynotes: Industry Views and Needs Nano Technology - Chair - Prof. C. P. Wong

8:45 AM: Nano Materials in Microelectronics Packaging - Dr. Vijay Wakharkar, Intel Corp.
9:25 AM: Nano Technology in Energy Storage Systems - Dr. Hossein Maleki, Motorola
10:05 AM: Nano Technology Needs for Future Mobile Devices and Systems - Mr. Jimmy Wu, Research In Motion
10:25 AM: Current and Future Needs for Nanotechnology - Dr. Matthew Holloway, Henkel Corp.

10:45 AM: Break

SESSION 2 (11:00 - 12:00 PM) - Proposed Programs I – Chair, Prof. C. P. Wong

11:00 AM: Carbon Nanotubes for Electrical Interconnects – Prof. C. P. Wong (Georgia Tech)
11:30 AM: Embedded Nano Battery - Dr. Raj Pulugurtha and Prof. Meilin Liu (PRC, Georgia Tech)

12:00 PM: Lunch (Atrium)

SESSION 2 cont. (1:00 - 2:00 PM) - Proposed Programs II – Chair, Prof. C. P. Wong

1:00 PM: Nano Materials for High Performance Energy Storage Systems - Profs. Meilin Liu and Ken Sandhage (Georgia Tech)
1:30 PM: Bio Mimicking Lotus Nano Surfaces for Hermetic Packaging - Prof. CP Wong (Georgia Tech)

SESSION 3 (2:00~3:30 PM) - Discussions on Consortium Development and Proposals – Chair, Prof. C. P. Wong

2:00 PM: Project List and Industry Feedback – Prof. C.P. Wong
2:45 PM: Membership Bylaws and Costs - Dean Sutter
3:15 PM: Timeline for Consortium Development - Jack Moon

3:25 PM: Break

SESSION 4 (3:35~4:45 PM), Lab Tour

3:35 PM: Facilities at Georgia Tech - Dr. Jack Moon

4:45 PM: Adjourn