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Automotive, Computer, Mobile Communications, Defense, Consumer & Health Industries

WEDNESDAY, SEPTEMBER 19th, 2007

Georgia Institue of Technology's Packaging Research Center,
Manufacturing Research Center (MaRC) Auditorium, Atlanta, Georgia U.S.A.

Visitor Travel Info | Download Agenda

Registration period has ended.
Free of charge. Open to all industry, GT faculty, staff and students.

CURRENT REGISTRANTS
Analog Devices • Atotech • Bosch • Cisco Systems • Cookson Electronics • FEI Company • Fujitsu • Harris Corp. • Ibiden • IBM Corp. • iNEMI • Infineon • Institute of Microelectronics (A*Star) • Jacket Micro Devices • Kyocera Wireless • Kyzen Corporation • LG Electronics • Maxtek • nGimat • NTK Technologies • Oak-Mitsui • Panasonic • Prismark Partners • Qualcomm • Rogers Corp. • Scientific Atlanta • Siemens • Starfire Systems • Tektronix • Texas Instruments • Univ. of South Florida • U.S. Dept. of Defense • Zeon Corp.
Attendees at Industry Forum Day March 2007

 

Dear Industry Colleagues:

We extend a warm welcome to you and to your company colleagues to join us for the second Industry Forum Day to be held at Georgia Tech on September 19th, 2007. Held in conjunction with the Packaging Research Center's extensive Industrial Membership meeting, this will be the second event of its kind and will feature industry keynote talks by industry executives, Georgia Tech’s Micro, Nano and Bio Systems Research, Supply Chain Company involvement and Student Poster Papers in RF, Optical, Thermal, Mechanical, and Bio Sensor Electronics.

We anticipate attendance by technical leaders and managers from around the world representing both academia and industry. The day’s activities will include several sessions:

  • Industry Keynote Session with Focus on Future Technology Directions in IC, Packaging and Systems for consumer, computer, mobile communication, aviation electronics, and bioelectronics
  • Student Recruiting & Internships in ECE, ME, ChE and MSE Areas
  • Student Poster Papers in all the above fields

Contacts
Prof . Rao Tummala, rao.tummala@ece.gatech.edu
Dr. Chong Yoon, cyoon@ece.gatech.edu
Barbara Park, barbara.park@ece.gatech.edu

 

 

AGENDA (Tentative)

Download Agenda

Last update:   September 19, 2007

8:15~8:30 AM: Welcome and Introduction - Prof. Rao Tummala

8:30~9:50 AM: SESSION 1: System Packaging Technology and Market Trends,
Chair, Prof. Rao Tummala

  • Brian Swiggett, Managing Partner, Prismark Partners, “Technology and Market for SIP, SOC and SOP”
  • Yuki Fukumoto, General Manager, Panasonic, “JISSO Technologies for Consumer Electronics Products”

Coffee Break: 9:50~10:15 AM

  • Gary Schuster, Provost and Chief Academic Officer at Georgia Tech, “Globalization of GT”

10:15~11:50 PM: SESSION 2: RF/Wireless Platform Technology
 Chair, Prof. Madhavan Swaminathan

  • Tom Gregorich, V.P. of Package Engineering, Qualcomm, “The IC Packaging Technologies for Hand-Held Electronic Products”
  • John Cressler, Professor at Georgia Tech, “Si-Ge Design and RF SOCs: Enabling 21st Century Mixed-Signal Circuits and Systems ”

Lunch: 12:00~1:30 PM

1:30 PM~3:30 PM:  SESSION 3: Biomedical Electronics and Interfacing Systems
Chair, Dr. Mahadevan Iyer                             

  • Peter Hesketh, Professor at Georgia Tech
  • Paul Gerrish, Director of Packaging Technology, Medtronics, "Enabling Technology Convergence"
  • Maysam Ghovanloo, Professor at Georgia Tech,  “Highly Efficient Wideband Neural Interfacing Systems” 

Coffee Break: 3:30~4:00 PM

4:00~6:00 PM: SESSION 4: Student Poster and Career Fair – Companies and Students
Chair, Dr. Chong Yoon | View Student Poster Titles

4:00~5:30 PM: Industry and Students: One-on-one and Student Posters

5:30~6:00PM: PRC Lab Tour—Substrate Lab and Assembly/Test Labs 

6:00~7:30 PM: Industry Reception

General PRC Contact Information

PHONE: 404-894-9097
FAX: 404-894-3842
E-MAIL: prcinfo@ece.gatech.edu

POSTAL ADDRESS:
Packaging Research Center
813 Ferst Street, Room 351
Atlanta, GA 30332-0560

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