PRC INDUSTRY WEEK AT-A-GLANCE

September 15, 19, 2008 • Georgia Tech Campus, Atlanta, GA
Last update: September 18, 2008

Download At-A-Glance (PDF). Please return for frequently updated information.

 
 
MONDAY
September 15
TUESDAY
September 16
WEDNESDAY
September 17
THURSDAY
September 18
FRIDAY
September 19

M

O

R

N

I

N

G

Base SOP Consortium
EMAP Consortium
EMAP Consortium
NGFC Consortium
MSDT Consortium
MaRC Auditorium | INFO | Agenda
MaRC Auditorium | INFO | Agenda
MaRC Auditorium | INFO | Agenda
MaRC Room 114 | INFO | Agenda
MaRC Room 114 | INFO | Agenda

9:30~10:00 AM - Get together at Morning Coffee and Beverages, MaRC Atrium

10:00 AM~12:00 Noon: One-on-One Meetings on Company Projects

Member Companies - PRC Faculty, Project Leaders and Students/Engineers

ATOTECH - Prof. Tummala, Venky Sundaram and Hunter Chan

Intel - Profs. Chang and Tummala and Fuhan Liu

NTK - Prof. Tummala, Raj Pulugurtha and

IBM - Prof. Sitaraman and Prof. Swaminathan

STW - Profs. Wong and Sitaraman, and Jack Moon

Rogers - Prof. Tummala, and Fuhan Liu

SAMMEER - Profs. Tummala and Swaminathan, and Venky Sundaram

SONY - Prof. Swaminathan       

Indium - Prof. Wong and Jack Moon

Lunch: 12:00~1:00 PM, MaRC Atrium

(See afternoon schedule for remaining activities.)

 

8:00 – 8:30 AM - Continental Breakfast

8:30 – 8:45 AM - Welcome and Objectives – Prof. Rao Tummala

8:45 – 9:15 AM - EMAP Program Year 2 Integration Summary, Timeline, Accomplishments, and Challenges – Venky Sundaram

SESSION 1 Year 2 Integration Test Vehicles Accomplishments and Status – Venky Sundaram and Prof. Rao Tummala

TASK 1: Electrical Design, Characterization and Embedded RF Passives

9:15 – 9:45 AM

Power/Ground and Transmission Line Design - Prof. Swaminathan, Nithya Sankaran

9:45 – 10:30 AM

Materials Characterization & Embedded Passives Test Vehicle Design - Prof. Swaminathan, Eddy Hwang

Coffee Break 10:30 – 10:45 AM

TASK 7: EMBEDDED ACTIVE TV Fabrication and Assembly

10:45 – 11:45 AM

Ultra-Thin Substrate Overview – Fuhan Liu

Thin Core Substrate – Hunter Chan

Build-up Dielectric Materials and Processes – Fuhan Liu

Lunch 12:00 – 1:00 PM

 

 

 

8:00 – 8:30 AM - Continental Breakfast

SESSION 2 – Industry Feedback Session - Venky Sundaram and Prof. Rao Tummala (FULL MEMBERS ONLY)

8:30 – 8:55 AM - 3.2: Thin Silicon Handling – Zhang Xiao Wu, Kripesh Vaidyanathan IME Singapore (Call-in)

9:00 – 10:00 AM - Industry Feedback on Phase 1, Year 2 Research Program IAB Chair (Mario Bolanos, TI) and Vice Chairs (Gerd Riha, Epcos & Bernd Roemer, Infineon)

10:00 – 11:00 AM - Proposal for EMAP Phase 2 (2009-2011)

11:00 – 11:30 AM - Finalization of Draft Technical Scope for Phase 2 Program - IAB Chair and Co-Chair, Venky Sundaram, Prof. Rao Tummala

11:30 AM – 12:00 PM - Wrap-up and Action Items Review

Lunch 12:00 – 1:00 PM

1:00 PM - Program Review Complete

Registration and Coffee: 08:00 AM~08:30 AM, MaRC Atrium

08:30 AM~09:00 AM - Welcome and Objectives

Consortium and Program Objectives – Prof. Suresh Sitaraman
Introduction to PRC and its programs – Prof. Rao Tummala     

09:00 AM~09:40 AM - Current and Proposed Research

Novel UBM and Interconnects – Dr. Raj Pulugurtha
Next Generation Organic Substrates – Venky Sundaram

Coffee Break: 09:40 AM~10:00 AM

10:00 AM~11:00 AM - Current and Proposed Research

Design and Simulation of Module Warpage and Reduction Targets – Prof. Suresh Sitaraman
ECAD to MCAE Integration for Automated Warpage Simulation – Dr. Russell Peak
Novel Underfills – Prof. C. P. Wong

11:00 AM~11:45 AM - Consortium Development, Feedback and Wrap-up

IP Management and Membership Fee – Dean Sutter
Industry Feedback and Wrap-up – Prof. Suresh Sitaraman & Prof. Rao Tummala

Lunch: 11:45AM, MaRC Atrium

SESSION 2: EDA for RF

8:00am – 8:30am Continental Breakfast

8:30am – 8:40am Overview – Prof. Madhavan Swaminathan

8:40am – 9:30am MSDT 3: Automated methods for the design of EP

3.1: Technical Presentation – Narayanan T V (20 min)
Q&A (5 min)
3.2: Technical Presentation – Mohit Pathak and Prof. SungKyu Lim (20 min)
Q&A (5 min)

9:30am – 9:55am MSDT 7: Parametric models of Linear 3D Electrical Interconnects and Packages (EIP)

Technical Presentation – Prof. Stefano Grivet, U. of Torino (20 min)
Q&A (5 min)

9:55am – 10:10am  Break

10:10am – 11:40am Demo (MSDT 3 and 7)

SESSION 3: EDA for 3D Multiscale Integration

11:40am – 11:50am Overview – Prof. Madhavan Swaminathan

11:50am – 12:15pm MSDT 4: EM Simulator for Chip-Package Co-Design

Technical Presentation – Myunghyun Ha (20 min)
Q&A (5 min)

12:15pm – 12:40pm MSDT 6: Modeling of Coupling in 3D Integration

Student Presentation – KiJin Han (20 min)
Q&A (5 min)

Lunch 12:40 pm to 1:30pm

 
LUNCH
LUNCH
LUNCH
LUNCH
LUNCH

A

F

T

E

R

N

O

O

N

TIM Consortium

1:00 – 1:45 PM - Embedded Actives in Substrate Cavity – Baikwoo Lee, Nithya Sankaran

1:45 – 2:30 PM - Chip-last Cu Bump Interconnections

Test Die Design & Fabrication – Pradeep Dixit, Raj Pulugurtha, Ritwik Chatterjee

Assembly and Reliability – Nitesh Kumbhat, Raj Pulugurtha

2:30 – 3:00 PM - Summary of Test Vehicle Integration Research and IAB and Supply Chain Q&A

OTHER PROJECTS in YEAR 2

3:00– 3:25 PM - 4.1: Advanced Passive Cooling Technology – Prof. Yogendra Joshi

Coffee Break and Student Poster Session 3:25 – 4:00 PM

4:00– 4:25 PM - 5.1: Embedded RF MEMS Switch – Prof. John Papapolymerou, Swapan Bhattacharya, Negar

4:25– 4:50 PM - 6.1: n-ACF/NCF Materials – Prof. C. P. Wong, Jack Moon, Rongwei Zhang

4:50 – 6:15 PM - Supply Chain Participation in Integration TVs

6:30 – 8:00 PM - EMAP Social & Buffet Dinner at Georgia Tech Hotel

 
MSDT Consortium

1:30pm – 2:30pm Demo (MSDT 4 and 6)

SESSION 4: MSDT Phase 2

2:30pm – 3:30pm Phase 2 Discussions

3:30pm – 3:45pm Break

SESSION 5: IAB Feedback

3:45pm – 4:00pm Industry feedback on MSDT tools (Panasonic, SAMEER, EPCOS, Infineon)
4:00pm – 4:45pm Closed door IAB – Lead: Dr. Jochen Reisinger (Infineon) and Dr. Karl Wagner (EPCOS)

4:45pm – 5:30pm Industry Feedback

5:30pm – 6:00pm Wrap – Up

6:30pm Dinner (Georgia Tech Hotel or elsewhere – TBD)

Demos:

MSDT 1 (Krishna Bharath)
MSDT 2 (Ranjeeth Doppalapudi)
MSDT 3.1 (Narayanan T V)
MSDT 3.2 (Mohit Pathak)
MSDT 4 (Myunghyun Ha)
MSDT 5 (Bernie Jord Yang)
MSDT 6 (KiJin Han)
MSDT 7 (Prof. Stefano Grivet Talocia)

Demos will provide details on Input/Output/Interface Formats and will apply the tool to several examples discussed in the presentation

MSDT Posters:

MSDT 1 (Krishna Bharath)
MSDT 2 (Ranjeeth Doppalapudi)
MSDT 3.1 (Narayanan T V)
MSDT 3.2 (Mohit Pathak)
MSDT 4 (Myunghyun Ha)
MSDT 5 (Bernie Jord Yang)
MSDT 6 (KiJin Han)
MSDT 7 (Prof. Stefano Grivet)

Whole program (Prof. Madhavan Swaminathan and Dr. Daehyun Chung)

Non-MSDT Posters:

RF / Mixed-Signal (Nevin Altunyurt, Abhilash Goyal, Eddy SeungHyun Hwang, Suzanna Huh, Dr. Daehyun Chung)

3 posters

Digital Integration (Aswani Kurra, Vishal Laddha, Nithya Sankaran, Tapobrata Bandyopadhyay, Rishiraj Bheda, Jianyong Xie, Sukruth Pattanagiri, Dr. Daehyun Chung)

3 posters

MaRC Room 114 | INFO & REGISTRATION | Agenda
 
MaRC Room 114 | INFO & REGISTRATION | Agenda

Registration: 11:30 AM~12 Noon, MaRC Atrium

Lunch: 12:00~1:00 PM, MaRC Atrium

1:00~1:20 PM: Welcome and Introduction—Prof. Yogendra Joshi

1:20~4:45 PM - Session 1: TIM Research Projects Review—Chair, Profs. Bahgat Sammakia and Jianmin Qu

  • Task 1: TIM Materials and Interfaces
    • Project 1.1: The Development of Aligned Carbon Nanotube Films For                                              Thermal Interface Material Applications—Profs. C. P. Wong and Samuel Graham (50 min)
  • Task 4: TIM Reliability:
    • Project 4.1: Design for Reliability of Thermal Interface Materials—Prof. Suresh Sitaraman (25 min)

Coffee Break: 2:35~3:05 PM

  • Task 2 and 3: TIM Assembly and Bonding, and Characterization of TIM
    • Project 2.1: Assembly and Testbed Research with Metal and Metal Composite TIM—Dr. Raj Pulugurtha, Gopal Jha, Janagama Goud and Prof. Rao Tummala (25 min)
    • Project 3.1: Thermal and Thermomechanical Modeling and Characterization of TIMs and Their Interfaces—Profs. Yogendra Joshi, Bahgat Sammakia and Jianmin Qu (75 min)
  • 4:45~5:30 PM:

Session 2: Year 2 plans and Wrap-up Discussion-- Chair, Prof. Yogendra Joshi

Industry Dinner: 6:15PM, Gordon Bierch Restaurant

 

1:30pm – 2:00pm Welcome and Overview – Prof. Madhavan Swaminathan

SESSION 1: EDA for Digital and Mixed Signal

2:00pm – 2:15pm Overview – Prof. Madhavan Swaminathan

2:15pm – 2:40pm MSDT 1: Power Ground Network Simulator and Optimizer
Technical Presentation – Krishna Bharath (20 min)
Q&A (5 min) 

2:40pm – 3:05pm MSDT 2: Design for Manufacturing Methods for SiP
Technical Presentation – Ranjeeth Doppalapudi (20 min)
Q&A (5 min)

3:05pm – 3:30pm MSDT 5: EBG Modeling and Synthesis
Technical Presentation – Bernie Jord Yang (20 min)
Q&A (5 min)

3:30pm – 3:45pm Break

3:45pm – 5:15pm Demo (MSDT 1, 2 and 5)
5:15pm – 6:15pm Poster Session
6:30pm Dinner (Georgia Tech Hotel or elsewhere - TBD)

IAB Conference
MaRC Auditorium | INFO & REGISTRATION Agenda

1:00~4:45PM – Research Programs Review and Business Meeting
Chair, Frank Pompeo, IBM

1:00~1:30 PM SESSION 1 - Welcome, PRC Programs, PRC Team and Research Highlights - Prof. Rao Tummala

1:30~4:45 PM SESSION 2 - Review of Base SOP Company Projects

Session A  1:30~2:15 PM, SOP Design: Chair, Dr. M. Swaminathan

  • Paper 1 - “Correlation of PDN Impedance with Jitter and Voltage Margin-SONY”, Prof. Swaminathan (15 min)
  • Paper 2 - “High Density Packaging and SOP Test Vehicle and Technology Test Vehicles-SAMEER”, Venky Sundaram and Profs. Swaminathan and Tummala (15 min)
  • Paper 3 - New Project: “DC Modeling and Tool Development for 3D Silicon Packaging” –IBM, Prof. Swaminathan (15 min)

Session B  2:15~3:00 PM, SOP Substrate Integration: Chair, Venky Sundaram

  • Paper 4: “Micro-vias and Fine Lines on ATOTECH RCF and RRCF-ATOTECH”, Hunter Chan, Venky Sundaram and Prof. Tummala (15min)
  • Paper 5 “Low Loss Thin Film Build-up Dielectrics for Next Generation Package Substrates-Rogers”, Fuhan Liu, Venky Sundaram and Prof. Tummala (15 min)
  • Paper 6 “High Density Optical Interconnects-Intel”, Prof. Chang (15 min)

Coffee and Break: 3:00~3:15 AM

Session  C: 3:15~3:45 PM, Interconnection and Assembly, Chair, Raj Pulugurtha

  • Paper 7 - “Electrical Reliability of Sol-gel BT Capacitor on Copper Foil-NTK/NGK”, Raj Pulugurtha, and Prof. Tummala (15 min)
  • Paper 8 - “Fine Pitch Flip Chip Packaging with Cu-based Interconnections, Raj Pulugurtha, Janagama Goud and Prof. Tummala (15 min)

Session D  3:45~4:45 PM, Materials and Reliability, Chair, Jack Moon

  • Paper 9 - “Warpage Prediction and Analysis – STW", Jack Moon and Prof. Wong (15 min)
  • Paper 10 - “ECA-Indium”, Jack Moon and Prof. Wong (15 min)
  • Paper 11 - New Project: "Coupled Moisture and Thermal Modeling" – IBM Prof. Sitaraman (15 min)

4:45~5:35 PM SESSION 3  PRC Membership Administration
Chair, Prof. Rao Tummala

  • New Graduated Scale Membership Structure – Mr. Dean Sutter – 20 Minutes

5:35~6:00 PM SESSION 4: Discussion & Wrap UP
Chair, Frank Pompeo, IBM

Q&A: Profs. Tummala and Swaminathan, and Dean Sutter

6:15-7:00PM   Industry Social and Dinner:

Gordon Biersch Restaurant
848 Peachtree Street, NE
Atlanta, GA 30308

Gordon Bierch Restaurant

(Transportation Provided as Needed)