Embedded Actives & Passives (EMAP)

Microsystems Packaging Research Center
Manufacturing Research Center (MaRC) Building Auditorium
813 Ferst Drive, NW , Atlanta , Georgia 30332, U.S.A.

Visitor Travel Info

Intended for Industry Only.

Endless demands for digital convergence by miniaturization, increased functionality, better performance and low cost in both mobile and desktop systems are driving the need for new and unique solutions in system integration. The primary approach, so far, has been the stacking of bare and packaged ICs in SIP technology. SIP technology is a module technology and, thus, a small part of the end product systems. True miniaturization of products requires, not only at-IC and at-module levels, but also at-system level—the latter to be accomplished by embedded actives and passives in package-sized boards. While some of this research and development has been in process, its ultimate potential has not been exploited.

GT PRC proposes a global industry-academia consortium in new and advanced embedded actives and passives in its SOP technology platform to serve the emerging digital convergence needs of mobile and desktop applications.

Topics

• Industry needs for EMAP
• EMAP technologies to date
• PRC’s capabilities in EMAP
• Electrical design
• Embedded thin film components
• Thermal management
• System integration
• Quality and reliability
• New approaches for embedded actives and passives for mobile and digital applications
• Proposed EMAP strategy

Who Should Join?

Senior engineers and managers from companies that are involved in these areas are encouraged to join the EMAP consortium:

• Cell Phone and Mobile Products
• Semiconductors
• IC Packaging
• SIP
• LTCC
• Boards
• Passive Components
• Packaging Materials and Tools
• Package Assembly
• Design Tools

Registration

Hotels & Accommodations

Contacts

Prof. Rao Tummala (rao.tummala@ee.gatech.edu)
Venky Sundaram (vsunda@ece.gatech.edu)

Agenda

September 16 2008 (TUESDAY)

8:00 – 8:30 AM - Continental Breakfast

8:30 – 8:45 AM - Welcome and Objectives – Prof. Rao Tummala

8:45 – 9:15 AM - EMAP Program Year 2 Integration Summary, Timeline, Accomplishments, and Challenges – Venky Sundaram

SESSION 1 Year 2 Integration Test Vehicles Accomplishments and Status – Venky Sundaram and Prof. Rao Tummala

TASK 7: EMBEDDED ACTIVE TV

9:15 – 10:00 AM - Electrical Design

Power/Ground and Transmission Line Design - Prof. Swaminathan, Nithya Sankaran

Materials Characterization - Prof. Swaminathan, Eddy Hwang

Coffee Break 10:00 – 10:15 AM

10:15 – 11:15 AM - Ultra-Thin Substrate

Thin Core Substrate – Hunter Chan

Build-up Dielectric Materials and Processes – Fuhan Liu

11:15 – 12:00 PM - Embedded Actives in Substrate Cavity – Baikwoo Lee, Nithya Sankaran

Lunch 12:00 – 1:00 PM

1:00 – 1:45 PM - Chip-last Cu Bump Interconnections

Test Die Design & Fabrication – Pradeep Dixit, Ritwik Chatterjee

Assembly and Reliability – Nitesh Kumbhat

1:45 – 2:15 PM - Summary of Embedded Active TV and IAB Feedback

TASK 1.2: EMBEDDED PASSIVE TV         

2:15 – 3:00 PM - Design, Fabrication and Characterization – Prof. Swaminathan, Eddy Hwang

Coffee Break 3:00 – 3:15 PM

OTHER PROJECTS in YEAR 2

3:15 – 3:40 PM - 3.2: Thin Silicon Handling – Zhang Xiao Wu, Kripesh Vaidyanathan IME Singapore

3:40 – 4:05 PM - 4.1: Advanced Passive Cooling Technology – Prof. Yogendra Joshi

4:05 – 4:30 PM - 5.1: Embedded RF MEMS Switch – Prof. John Papapolymerou, Swapan Bhattacharya, Negar

4:30 – 4:55 PM - 6.1: n-ACF/NCF Materials – Prof. C. P. Wong, Jack Moon, Rongwei Zhang

4:55 – 6:15 PM - Supply Chain Participation in Integration TVs (Details to be finalized)

6:15 – 8:00 PM - Student Poster Session and Buffet Dinner (MaRC Atrium)

September 17, 2008 (WEDNESDAY)

8:00 – 8:30 AM - Continental Breakfast

SESSION 2 – Industry Feedback Session - Venky Sundaram and Prof. Rao Tummala

(FULL MEMBERS ONLY)
           

8:30 – 9:30 AM - Industry Feedback on Phase 1, Year 2 Research Program
IAB Chair (Mario Bolanos, TI) and Vice Chairs (Gerd Riha, Epcos & Bernd Roemer, Infineon)

9:30 – 10:30 AM - Proposal for EMAP Phase 2 (2009-2011)

10:30 – 11:30 AM - Finalization of Draft Technical Scope for Phase 2 Program - IAB Chair and Co-Chair, Venky Sundaram, Prof. Rao Tummala

11:30 AM – 12:00 PM - Wrap-up and Action Items Review

12:00 PM - Program Review Complete

Lunch 12:00 – 1:00 PM