Microsystems Packaging Research Center

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Education Publications

2000-2001:
"Undergraduate Microsystems Packaging Education: Needs, Status and Challenges," Rao Tummala and Leyla Conrad, Proceedings of the 51st ECTC, p.1276, Orlando, FL , 2001.

Bhattachrya, S., Hobbs, J., Varadarajan, M., Sanchez, O., Tummala, R., and May, G., "A Hands-On Multidisciplinary Product Development Course for Microelectronic Systems Packaging Education," Proc. 51st Elec. Comp. & Tech. Conf., Lake Buena Vista, FL, June, 2001.

1999-2000:
May, G. and Light, D., "The Virtual Electronics Packaging Laboratory," Proc. 50th Elec. Comp. & Tech. Conf., Las Vegas, NV, pp. 1300-1303, May, 2000.

Conrad, L., Tummala, R., and May, G., "The First Entrepreneurial and Practice-Oriented Masters Program in Microelectronics Systems Packaging," Proc. 50th Elec. Comp. & Tech. Conf., Las Vegas, pp. 1002-1007, NV, May, 2000.

1998-1999:
"Progress Towards Developing a Web-Based Virtual Packaging Laboratory," D. Leigh Light, Dena Elshazly and Gary S. May, Proceedings of the 49th Electronic Components & Technology Conference, San Diego, CA, p. 1056 (1999).

Rao Tummala, Leyla Conrad and Gary S. May, "The Needs, Evolution, Status and Challenges of Microelectronics Packaging Education in the U.S.," Proceedings of the 49th Electronic Components & Technology Conference, San Diego, CA, p. 885, June 1999.

Rao Tummala, Leyla Conrad and Gary May, "Next Generation of Microelectronic Packaging Education In U.S.: A Perspective on Needs, Challenges and Status," Proceedings of the InterPAK-99 Conference, Maui, Hawai, pp. 2159-2164, 1999.

Rao Tummala, Gary May, and Leyla Conrad, "Georgia Tech's Electronics Packaging Education: A Model for 21st Century," The Circuit, Vol. 2, No. 1, pp. 8-11, 1999

1997-1998:
Realff, M.J., Hubscher-Younger, T., Catrambone, R., Guzdial, M., McCrickard, S., Ram, A., and Stakso, J., "Multimedia Support for Learning Advanced Packaging Manufacturing Practices," Proceedings of the 48th Electronic Components & Technology Conference, Seattle, WA, pp. May 1998.

May, G., " Teaching Electronics Packaging Using Interactive Multimedia," Proc. of the 48th 1998 Elec. Comp. & Tech. Conf., Seattle, WA, pp. 532-534, May 1998.

1996-1997:
May, G., "GT-SUPREEM: The Georgia Tech Summer Packaging Research and Engineering Experience for Minorities," Proceedings of SPIE Optical Science, Engineering, and Instrumentation Symposium, vol. 2809, pp. 206-211, August 1996.

May, G., "Educating Under-Represented Minority Students in Electronics Packaging for the 21st Century," Proceedings of the 47th Electronic Components & Technology Conference, pp. 570-574, May 1997.

Higgins, R.J., "Global Education for Engineers: Beyond Science and Technology", Proceedings of the 47th Electronic Components & Technology Conference, pp. 567-569, May 1997.

R. Tummala, Proceedings of the 47th Electronic Components & Technology Conference, p. 960 (1997).