Bio-electronic System-On-Package (BioSOP)

Postponed until further notice.

Microsystems Packaging Research Center
Manufacturing Research Center (MaRC Building) Auditorium
813 Ferst Drive, NW , Atlanta , Georgia 30332, U.S.A.

By 2017, 20% of the U.S. GDP is spent on healthcare and about 80% of the U.S. healthcare is spent on diagnosing, monitoring and curing chronic diseases.  Implantable medical electronics provide solutions for several chronic diseases related to heart and nervous system disorders.

Current biomedical implants consist of a combination of integrated and discrete components that are assembled together on a bulky substrate leading to large and high power consuming devices with inadequate performance that are highly invasive if placed inside the human body. Bio-implantable systems, so far, have relied on conventional packaging techniques that do not take advantage of the emerging package level system integration trends.

The Microsystems Packaging Research Center at Georgia Tech (PRC) is pioneering the “System-On-Package” (SOP) paradigm to enable ultra-miniaturized, low cost and low power bioelectronic and bio-sensing systems. In the SOP concept, devices, packages and substrates are all miniaturized and integrated into a single system within the package. SOP accomplishes this design and functional optimization between IC and package, embedded thin film active and passive system components, high density bio-compatible package and electrodes with material strategies to modulate tissue and neural responses, and with thin film bonding between these devices. SOP can thus address the bioelectronic system packaging challenges leading to the low-cost, low-power, ultra-miniaturized bioelectronic systems of the future.

The PRC is organizing a pre-competitive strategic research consortium on Bioelectronic System-On-Package (BioSOP) with a focused team of academic and industry leaders. The BioSOP consortium proposes to go beyond the R&D and will include 5 major thrusts:

(1) Bioelectronic Systems and Design - Dr. Maysam Ghovanloo

• ASIC and biosensor interface design
• Power and data telemetry design
• RF package design for wireless interfaces
• Stimulators and recording

(2) Bio and Chemical Sensors - Prof. Z. L. Wang and Dr. Janagama Goud

• Nanobiosensors for health diagnoses

(3) Bio-compatible Packaging and Neurostimulators - Venky Sundaram, Profs. Ravi Bellamkonda and C. P. Wong

• High packaging density biocompatible substrates
• Hermetic packaging
• Neurostimulators with modulated tissue and neural response
• Superhydrophobic biocompatible surfaces
• Anti-inflammatory coatings

(4) Integrated Power Sources - Prof. Meilin Liu

• Thin film high energy density batteries and supercapacitors
• Nanobiotemplating high surface electrodes

(5) Embedded Thin ICs and Passives - Prof. Rao Tummala and Dr. Raj Pulugurtha

• Inductors for power and data telemetry
• Embedded thin ICs with thin film interconnections

Who Should Join?

Research directors, senior engineers and managers from semiconductor, system, energy, biotech, automotive, defense and aerospace industries are invited to attend the exploratory workshop.

Registration

Hotels & Accomodations

Visitor Travel Info

Contacts

Prof. Maysam Ghovanloo (mgh@gatech.edu)
Prof. Rao Tummala (rtummala@ece.gatech.edu)
Prof. Ravi Bellamkonda (ravi@gatech.edu)
Dr. Raj Pulugurtha (raj@ece.gatech.edu)
Venky Sundaram (vsunda@ece.gatech.edu

Tentative Agenda

Last updated: August 21, 2008

AFTERNOON

Bioelectronic Systems and Design - Dr. Maysam Ghovanloo

• ASIC and biosensor interface design
• Power and data telemetry design
• RF package design for wireless interfaces
• Stimulators and recording

Bio and Chemical Sensors - Prof. Z. L. Wang and Dr. Janagama Goud

• Nanobiosensors for health diagnosis

Bio-compatible Packaging and Neurostimulators - Venky Sundaram, Prof. Ravi Bellamkonda, Prof. C.P.  Wong

• High packaging density biocompatible substrates
• Hermetic packaging
• Neurostimulators with modulated tissue and neural response
• Superhydrophobic biocompatible surfaces

Integrated Power Sources - Prof. Meilin Liu

• Thin film high energy density batteries
• Nanobiotemplating high surface electrodes

Embedded Thin ICs and Passives - Prof. Rao Tummala and Dr. Raj Pulugurtha

• Compact high value inductors
• Nanocapacitors
• Embedded thin ICs with thin film interconnections