Industry-Academia
Consortium Workshop
Mixed Signal Design Tools in Advanced Packaging
The
first workshop was held on Sept. 16, 2005. Consortium
launch is planned for October 2006.
Please contact the following people for
further information:
Prof. Madhavan Swaminathan, madhavan.swaminathan@ece.gatech.edu,
404-894-3405
Dr. Ege Engin, engin@ece.gatech.edu,
404-385-7042
Georgia
Institute of Technology - Manufacturing Research Center (MaRC Building)
Auditorium
Organizers: Prof. Madhavan Swaminathan, Prof. Rao Tummala, Dr. Ege Engin (Georgia Institute of Technology)
Sept. 2005
Program Agenda | Sept.
2005 Agenda (PDF Format)
A major bottleneck in the development of next generation packaging technologies is the design tools. Due to the integration of heterogeneous functions in a package, mixed signal design tools are necessary that are part of a design flow. The Packaging Research Center (PRC) at Georgia Institute of Technology has been one of the pioneers in this area, introducing tools that address the System-on-Package (SOP) technologies. Design of such highly integrated mixed-signal systems require new tools that, for example, take into consideration the increased interaction between the IC and package leading to system miniaturization. This workshop is targeted to discuss the electrical and mechanical issues arising in mixed signal design, leading to the development of mixed-signal design tools through the formation of a consortium of companies at PRC, which can provide solutions in this area.
The morning session of the workshop will include presentations by participants from industry and the Packaging Research Center, Georgia Tech. The afternoon session will include a discussion on the formation of the consortia and consortia topics. The attendees from industry will include participants that represent EDA companies, system companies and semiconductor companies.
Topics
- Design Flow
- Electrical Chip-Package Co-Design
- Signal and Power Integrity
- Design Tools for RF Packaging
- Electromagnetic Analysis
- Circuit Analysis Methods
- Design for Manufacturing
- Physical Design
Industry Participants
- IBM
- Cisco
- LSI Logic
- Altera
- Infineon
- Panasonic
- Broadcom
- Ansoft
- Dupont
- Optimal
- NGK
- Zeland
Academia
Participants
- Georgia Tech
- University of Illinois
- North Carolina State University
- Politecnico di Torino
- Carleton University
|
Georgia Tech Faculty & Research Participants
Prof. Madhavan Swaminathan
Prof. Rao Tummala
Prof. Manos Tentzeris
Dr. Ege Engin
Contact Info
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