Events

2017 Events

IAB Spring 2017 - May 24-26, 2017

Semi-annual meeting for Full and supply-chain members of the Packaging Research Center Industry-Academic Consortium. Event is free to PRC Consortium Members. Registration is required.​​

 

 

 

FUTURECAR November 8-10, 2017

Georgia Tech and SEMI Hot FUTURECAR 2017: Next Generation of Automotive Electronics Workshop (in partnership with iNEMI, IMAPS and IEEE).

 

 

 

2016 Events

Georgia Tech experts will present on critical packaging needs for automotive electronics driven by autonomous driving and (H)Evs; and GT;s unique, low-cost and manufacturable solutions for ultra-miniaturized power module and high temperature electronics with advanced GaN devices, integrated functional components, novel high-temp materials and interconnections.

 

 

5G Communications Module Webinar - September 28, 2016

In contrast to current laminate or ceramic packages and board-level integration, Georgia Tech’s  approach integrates active and passive components and antennas in ultra-miniaturized 3D packages for highest performance in mm-wave bands, smallest form factor and large panel processing for low cost, and high reliability for consumer as well as automotive and harsh environment applications.  This webinar covers Georgia Tech's approach to 5G Communication Modules.

 

 

IAB Fall 2016 - November 7-9, 2016

Semi-annual meeting for Full and supply-chain members of the Packaging Research Center Industry-Academic Consortium. Event is free to PRC Consortium Members. Registration is required.​​

 

 

 

FUTURECAR - November 9-10, 2016

Georgia Tech and SEMI to Launch FUTURECAR: Next Generation of Automotive Electronics Workshop (in partnership with iNEMI, IMAPS and IEEE).

 

 

 

New era of Automotive Electronics (NAE) Workshop - May 24, 2016

Georgia Tech and its industry partners to launch large-scale, comprehensive R&D and supply chain program focusing on the New era of Automotive Electronics (NAE). May 24 workshop will focus on: 1) package and system integration, 2) Tier 1 and Tier 2 partnerships, and 3) educating cross-disciplinary engineering students prepared for NAE industry.  Event is free. Registration is required.​

 

 

IMAPS SE Regional Student Meeting - May 24, 2016

Georgia Tech Hosts First IMAPS Student Chapter Meeting for graduate students engaged in micro- and nano-electronics and packaging research.  Guest speakers include Dr. Urmi Ray of Qualcomm and Robin Taylor of Atotech. Student Poster session with $500 Best Student award and refreshments highlight the evening. Event is free. Registration is required.​

IAB Spring 2016 - May 25-27, 2016

Semi-annual meeting for Full and supply-chain members of the Packaging Research Center Industry-Academic Consortium. Event is free to PRC Conosortium Members. Registration is required.​

 

 

2015 Events

GIT 2015

GIT 2015 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply-chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for Smart and wearable, automotive, and high performance systems.