VISION
The goal of PRC is to produce cross-discipline individual engineers. This means every PRC student will be Interdisciplinary in electrical, mechanical, chemical and materials sciences and engineering, since the electronics systems are interdisciplinary.
PACKAGING COURSES
Courses |
Title |
ECE |
MSE |
ME |
CHE |
9 Undergraduate Courses |
|||||
3025 |
Electromagnetics |
X |
|||
3065 |
Electromagnetic Applications |
X |
|||
4320 |
Electronic Packaging & Design |
X |
|||
4360 |
RF-Microwave Lab |
X |
|||
4390 |
Radar & EM Sensing |
X |
|||
4460 |
Electronic Packaging |
X |
|||
4752 |
IC Fabrication |
X |
|||
4754 |
Electrical Packaging Assembly |
X |
X |
X |
|
4755 |
Packaging Subs Fabrication |
X |
X |
X |
|
17 Graduate Courses |
|||||
6124 |
Finite Element Method |
X |
|||
6140 |
Digital Systems Test |
X |
|||
6226 |
Semiconductor Manufacturing and Assembly |
X |
|||
6360 |
Microwave Design |
X |
|||
6361 |
Microwave Design Lab |
X |
|||
6420 |
Wireless IC Design |
X |
|||
6455 |
Semicon Process Control |
X |
|||
6458 |
Gigascale Integration |
X |
|||
6510 |
Polymers for Elect & Photonics I |
X |
|||
6520 |
Integrated Optics |
X |
|||
6542 |
Optoelectronic Systems |
X |
|||
6609 |
Polymers in Microelectronics |
X |
|||
6771 |
Optoelectronics |
X |
|||
6776 |
Microelectronic System Packaging |
X |
X |
X |
X |
7141 |
Advanced Digital Systems Test |
X |
|||
7228 |
Thermo-Mechanical Reliability |
X |
|||
7510 |
Polymers for Elect &Photonics II |
X |
|||