PUBLISHED BOOKS
1. Rao R. Tummala, M. Swaminathan (editors), "Introduction to System-On-Package (SOP) Technology",SIP and SOC, Chapter 1, Mcgraw-Hill, NY (Published March 2008).
2. Baik-Woo Lee, T. Bandyopadhyay, C. Yoon, Rao R Tummala, Kenneth M. Brown, "Stacked IC's and Packages (SIP)", Chapter 3, McGraw-Hill, NY (Published March 2008).
3. P. Markondeya Raj, Z. Zhang, Y Li , C. P. Wong, Rao R Tummala, "Wafer Level System-On-Package (WLSOP) Interconnections", Chapter 10, McGraw-Hill, NY (Published March 2008).
4. Rao R.Tummala, T. Bandyopadhyay "Introduction to SOP" Book Chapter 1, Introduction to SOP, SIP and SOC,McGraw-Hill, NY (Published March 2008).
5. V. Sundaram, P. Markondeya Raj, P. Kohl, Rao R. Tummala and G. Krishnan, "SOP Substrate with Imbedded Components", Chapter 7, McGraw-Hill, NY (Published March 2008).
6. Rao R. Tummala, editor, "Fundamentals of Microsystems Packaging", McGraw-Hill, May 2001.
7. Rao R. Tummala , Eugene Rymaszeski and Alan Klofenstein, editors, "Microelectronics Packaging Design Handbook, Part III: Subsystem Packaging", Kluwer, Norwell, MA, 1996.
8. Rao R. Tummala, Eugene Rymaszeski and Alan Klofenstein, editors, "Microelectronics Packaging Design Handbook, Part II: Semiconductor Packaging", Kluwer, Norwell, MA, 1996.
9. Rao R. Tummala , Eugene Rymaszeski and Alan Klofenstein, editors, "Microelectronics Packaging Design Handbook, Part I: Technology Drivers, Kluwer", Norwell, MA, 1996.
10. Rao Tummala, primary co-editor, "Microelectronics Packaging Handbook", Van Nostrand Reinhold, NY, 1989. The first and most widely used references book in electronic packaging in US, Europe, and Japan. Translated into Japanese. This book became the basis of academic involvement in packaging; the number , of universities in packaging as result increased from 2 in 1986 to 80 today.