PRC Students Seeking Full-Time Employment (1/10)

Name: Abhishek Choudhury [Resume]
Highest Degree Expected or Earned: Master of Science, Material Science & Engineering
Research Specialty: Flip-Chip Interconnects
Area of Interest: Microelectronic Packaging, Mechanical Modeling, Process Engineering
Date available to begin: August, 2010
Phone: (770)-905-6376
Email: abhishek.c@gatech.edu

Name: Abhilash Goyal [Resume]

PRC Students Seeking Internships (1/10)

Name: Vivek Sridharan [Resume]
Highest Degree Expected or Earned: Ph.D. Electrical and Computer Engineering
Research Specialty: RF Design, Fabrication and MEMS Packaging
Refereed Publications:
1) Tummala, R.R, Sundaram, V, Chatterjee, R, Raj, P.M, Kumbhat, N, Sukumaran, V, Sridharan, V, Choudury, A,Qiao Chen, Bandyopadhyay, T, “Trend from ICs to 3D ICs to 3D Systems,” IEEE Custom Integrated Circuits
Conference (CICC), 2009.
2) S. Min, S. Hwang, V. Sridharan, M. Swaminathan, V. Sundaram, H. Chan, R.R. Tummala et al, “Filterintegration in ultra thin organic substrate via 3D stitched capacitor”, IEEE Electrical Design of Advanced
Packaging and Systems Symposium, EDAPS, 2009.
3) Vivek Sridharan, Sunghwan Min, Venky Sundaram, Vijay Sukumaran, Hunter Chan, Fuhan Liu and Rao Tummala, “High Quality Bandpass Filter Design and Fabrication in 3D-Glass Interposer with Through Package Via (TPV)”, accepted for presentation at the 60th Electronic Components and Technology Conference
(ECTC) to be held in Las Vegas, Nevada, USA.
Area of Interest: RF Design, MEMS Packaging, Semiconductor & Package Design and Microsystems Packaging
Date available to begin: May 1, 2010
Phone: 404-702-9964
Email: svivek@gatech.edu

Name: Abhilash Goyal [Resume]