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Mixed Signal Design and Tools (MSDT)
An Industry-Academia Consortium in Partnership with Politecnico di Torino

Lead: Professors Madhavan Swaminathan and Stefano Grivet Talocia (Politecnico di Torino)

Goal: Next Generation EDA Tools for Integrated Microsystems

Launched: January 2007 | Next Meeting Info & Online Registration

Contact: Daehyun Chung, daehyun.chung@ece.gatech.edu

Focus: The focus of this consortium is the development of next generation design tools that enable the deployment of SiP (System in Package) and SoP (System on Package) technologies. These tools will interface with commercially available package layout tools and are expected to seamlessly fit into an existing design flow. Along with providing analysis capability, they can also be used to influence designs in an iterative manner. Hence, the goal of the consortium is to develop EDA tools that enable both design and verification.

TASK 1

TASK 2

TASK 3

TASK 4

TASK 5

TASK 6

TASK 7

Research Tasks

1. Power Ground Network Simulator and Optimizer (see Task 1 figure)
2. Design for Manufacturing Methods for SIP (see Task 2 figure)
3. Automated Methods for the Design of EP (see Task 3 figure)
4. Early exploratory Tool for Chip-Package Co-Design (see Task 4 figure)
5. EBG Modeling and Synthesis (see Task 5 figure)
6. Modeling of Coupling in 3D Integration (see Task 6 figure)
7. Parametric Models of Linear 3D Electrical Interconnects and Packages (EIP) (see Task 7 figure)

Participating Companies (Last updated September 10, 2008 )

• Matsushita
• EPCOS
• Infineon
• Sameer
• NXP