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Industry-Academia Thematic Consortia Programs

The Microsystems Packaging Research Center sponsors a series of consortia development workshops designed to promote research collaborations between Industry and Academia for the development of next generation microsystems packaging solutions. If your company wishes to become involved, please contact us at prcinfo@ece.gatech.edu or 404-894-9097.

 

Currently Underway or in Development

PROGRAM FULL NAME DESCRIPTION
Base System-On-Package SOP projects for full project industry members.
Mixed Signal Design and Tools Next generation EDA for integrated microsystems.
Embedded Actives & Passives Embedding and integration of active and passive components in SOP substrate.
Thermal Interface Materials Next generation materials and thermal cooling methods for SOP systems.
3D All Silicon System Module 3D integration of silicon subsystems using Through-Silicon Vias (TSV) to combine nanoscale components, wiring, interconnects, thermal inteface materials, ICs and 3D ICs, and power supplies.
Next Generation Flip Chip Includes substrate, warpage, interconnects and assembly.

 

Industry Involvement

(Last updated February 11, 2009 )

Industry Involvement

 

Breakdown of Members, Partners and Donors

(Last updated February 11, 2009 )

Base System-On-Package
(BASESOP)
More info

 Embedded Actives & Passives (EMAP)
More info		 Mixed Signal Design & Tools (MSDT)
More info		 Thermal Interface Materials (TIM)
More info		 3D All Silicon System Module (3DASSM)
More info		 Next Generation Flip Chip (NGFC)
More info		 Infrastructure Partners & Donors
  • ATOTECH
  • IBM
  • NTK/NGK
  • SAMEER
  • Rogers Corporation
  • Samsung Techwin
  • Sony

FULL MEMBERS

  • Bosch
  • Draper
  • EPCOS
  • Infineon
  • Intel
  • Texas Instruments
  • SAMEER

 

SUPPLY CHAIN MEMBERS

  • AT&S
  • Atotech
  • Brewer Science
  • DuPont
  • Disco
  • EIT
  • Ibiden
  • Mitsubishi Chemical
  • Rogers Corporation
  • Sony Chemical
  • Starfire Systems

FULL MEMBERS

  • EPCOS
  • Infineon
  • SAMEER
  • Panasonic

 

SUPPLY CHAIN MEMBERS

  • NXP (Philips)

FULL MEMBERS

  • Dow Corning

 

SUPPLY CHAIN MEMBERS

  • Maxtex
  • Bosch
  • Hynix
  • Rohm & Haas
  • Celestica

FULL MEMBERS

(Scheduled to launch Jan. 2009)

Companies currently showing interest:

  • Asahi Kesai EMD
  • Kyocera
  • LSI Logic
  • NXP
  • ST Micro

 

SUPPLY CHAIN MEMBERS

Companies currently showing interest:

  • Allvia
  • ATMI
  • DuPont
  • Entrepix
  • EVG
  • Henkel
  • Ibiden
  • Rogers
  • Semitool
  • Solid State Equipment Corporation
  • Xradia

FULL MEMBERS

(Under development)

 

SUPPLY CHAIN MEMBERS

(Under development)
  • ANVIK
  • Biorasis, Inc.
  • BTU
  • Camalot
  • ECI
  • Gould Electronics
  • Inplane Photonics
  • JSR
  • Matsushita/Panasonic
  • Oak-Mitsui
  • Rockwell Collins
  • Rohm & Haas
  • Sonoscan
  • W.L. Gore

 

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