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| Georgia Tech >> College of Engineering >> ECE >> PRC | ||||||||||
| Welcome | Academics | Students | Faculty & Staff | Research | Industry Partnerships | News Archive | ||||||||||
Industry-Academia Thematic Consortia Programs |
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| The Microsystems Packaging Research Center at Georgia Tech sponsors a series of consortia development workshops designed to promote research collaborations between Industry and Academia for the development of next generation microsystems packaging solutions. If your company wishes to become involved, please contact us at prcinfo@ece.gatech.edu or 404-894-9097. Chart of Memberships, Contract & Partnerships | Global Industry Members by Membership Type Currently Underway or In Development |
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| Mixed Signal Design and Tools Consortium Focuses on Next Generation EDA for Integrated Microsystems | |
| Embedded Actives & Passives Consortium Development | |
| Next Generation Thermal Interface Materials | |
| Nano Packaging, Materials, Components, & Systems | |
| 3D All Silicon Systems Module | |
| Ultra-miniaturized Biolectronics with System-On-Package | |
| Next Generation Flip Chip: Substrate, Warpage, Interconnects & Assembly | |
Memberships, Contracts and Infrastructure Partnerships
(Last updated August 26, 2008 )
(Last updated
August 26, 2008
)
| Base SOP Project Members | Embedded Actives & Passives (EMAP) More info |
Mixed Signal Design & Tools (MSDT) More info |
Thermal Interface Materials (TIM) More info |
Nano Packaging, Components & Systems (NanoPack) More info |
3D All Silicon System Module (3DASSM) More info |
Module & Substrate Warpage (MSW) More info |
Infrastructure Partners & Donors |
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FULL MEMBERS
SUPPLY CHAIN MEMBERS
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FULL MEMBERS
SUPPLY CHAIN MEMBERS
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FULL MEMBERS
SUPPLY CHAIN MEMBERS
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FULL MEMBERS (Under development)
SUPPLY CHAIN MEMBERS (Under development) |
FULL MEMBERS (Under development)
SUPPLY CHAIN MEMBERS (Under development) |
FULL MEMBERS (Under development)
SUPPLY CHAIN MEMBERS (Under development) |
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