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Embedded Actives and Passives (EMAP)
An Industry-Academia Consortium in Partnership with the Institute of Microelectronics (A*Star) - Singapore
Leaders: Prof R. Tummala (Lead, GT ECE & MSE), Venky Sundaram (Prog. Mgr.); GT Faculty: J.Papapolymerou, M. Swaminathan, Y. Joshi; C. P. Wong; Partner: Prof. Dim Lee Kwong (Institute of Microelectronics–Singapore)
Goal: Develop Core Technologies of Ultra-thin RF-Digital Module with Embedded Active and Passive Components for Mobile Applications.
Launched: January 2007 | Next Meeting Info & Online Registration
Contact
Mr. Venky Sundaram (vsunda@ece.gatech.edu)
Research Tasks
- Electrical Design and Characterization
- Ultra Thin Substrate
- Ultra Thin Si Die
- Thermal Management
- RF MEMS Switch
- Chip-last Interconnections
- Embedded Passives
Participating Companies (Last updated September 10, 2008 )
FULL MEMBERS
- Bosch
- EPCOS
- Draper Labs
- Infineon
- Intel
- Sameer
- Texas Instruments
SUPPLY CHAIN MEMBERS
- AT&S
- Atotech
- Brewer Science
- Disco
- DuPont
- Endicott Interconnect Technologies
- Ibiden
- Rogers Corporation
- Starfire Systems