Skip to content.
Skip to navigation.
Georgia Institute of Technology
Students & Alumni
How to Enroll
Courses
Guests/Visitors
Vision & Mission
PRC Directory
Research Programs
Laboratories
Visitor & Travel Information
Education
Newsletters
Visitor Resources
Visitor 1
Visitor 2
Visitor 3
Sponsors
Full Members
EMAP II
EMAP
Glass & Silicon Packages
TIM
MSDT II
Supply Chain
EMAP II
Glass & Silicon Packages
Student Recruitment
PRC Directory
Visitor & Travel Information
Georgia Tech
College of Engineering
ECE
PRC
About PRC
Mission & Vision
Home
About PRC
Mission & Vision
Legacy & Fast Facts
Visitor Information
Contact Us
Newsletters
Research
Vision & Mission
Core Areas
>
Electrical Design
Mechanical Design
Nanomaterials
Nanocomponents
Interconnection, Assembly & Reliability
Thermal Technologies
System Integration
Education
Vision & Courses
How to Enroll
Industry Partnership
Vision & Strategy
Membership
Participants
Consortia Programs
>
Silicon & Glass Interposers
Embedded MEMS Actives & Passives
Thin Film Passive Components
60GhzFEM
Laboratories
Overview
Safety & Access
>
Training & Safety Links
Lab User Manual
Safety Presentation
Publications
Books
Publications
>
Electrical Design
Mechanical Design
Nanomaterials
Nanocomponents
Interconnection, Assembly & Reliability
Thermal Technologies
System Integration
Newsletters
Team
Visit the PRC
GRA Candidates
Event Calendar
November 14-16, 2012
Global Interposer Technology Workshop
Media Center
Trending Now
2011 GT PRC Annual Research Highlights
2012 Global Interposer Technology Workshop
Welcome GRA candidates
Why is GT PRC Unique?
Unique Opportunities for Graduate Students at GT PRC
Customized Packaging Courses
GT PRC Research Highlights
Featured Articles
Chip Scale Review, "Georgia Tech's Vision for Ultra-Miniaturized Devise and Systems Packaging
"
IEEE Nanotechnology Magazine, "Nanopackaging Research at Georgia Tech"
IEEE Spectrum, "Moore's Law Meets Its Match"
IEEE Spectrum, "Moving Next-Generation Electronics Beyond Moore's Law"