|
|
||||||||||
| Georgia Tech >> College of Engineering >> ECE >> PRC | ||||||||||
| Welcome | Academics | Students | Faculty & Staff | Research | Industry Partnerships | News Archive | ||||||||||
PRC Tutorials on SOP and Next Generation Advanced Packaging Technologies
PRC offers annually a comprehensive set of short courses on SOP and next-generation
microsystems packaging technologies. This year’s course series consists
of individual modules taught by highly respected Georgia Tech PRC faculty. The
individual modules are based on the PRC’s System-on-Package vision which
integrates not only digital but also analog, RF, optical and MEMS functions
into one ultra-compact and low-cost mixed signal package system to serve the
needs of convergent telecom, consumer and computer systems of the next decade.
This year’s short course series will focus on three areas:
1. Nano electronics packaging.
2. Embedded component thin-film integration of RF, optical, digital and MEMS
functions.
3. Wafer-level packaging and flip-chip assembly processing.
The titles and schedules of the individual modules to be offered are provided
in the table below. More information about each course or instructor can be
obtained by clicking on the course title. On-line registration is available
through the links below.
2004
Short Course Series Schedule
Register
for full week
| Date | Module Title | Instructor | Course Fees* | |
On or
Before 5/10 |
After
5/10 |
|||
| May 24 8am-12pm |
Introduction
to Nanoscale Packaging and Systems REGISTER |
Tummala & Wang | $295 |
$350 |
| May 24 1pm-5pm |
MEMS and
NEMS Packaging REGISTER |
Ayazi | $295 |
$350 |
| May 25 8am-5pm |
RF/Wireless
Packaging: Fundamentals, Principles, and Current Challenges REGISTER |
Tentzeris & Laskar | $495 |
$550 |
| May 26 8am-12pm |
Optoelectronics
Integration REGISTER |
Chang & Adibi | $295 |
$350 |
| May 26 1pm-5pm |
Wafer Level
Packaging: Materials, Process, and Reliability REGISTER |
Wong | $295 |
$350 |
| May 27-28 8am-5pm |
Low
Cost Flip Chip Processing and Analysis with Hands-On Applications REGISTER |
Baldwin, Houston, & Lewis | $995 |
$1,100 |
Full day registration
fee: $495 (on or before 5/10) and $550 (after 5/10)
Full week registration fee: $2,250 (on or before 5/10) and $2,500 (after 5/10)
* PRC member company engineers receive a 20% discount.