May 16 - 24, 2002 Short Course Series:
Next Generation of Microelectronics
and Microsystems Packaging Technologies

Georgia Tech's Packaging Research Center (PRC) will offer a short course series entitled "Next Generation of Microelectronics and Microsystems Packaging Technologies" from May 16 to 24, 2002. The series is the most comprehensive set of short courses on next-generation of microelectronics and microsystems packaging technologies. Individual short course modules are based on the PRC's System-on-Package (SOP) vision, which integrates not only digital but also analog, RF, optical and MEMS functions into one ultra- compact and low cost packaging system to serve the needs of convergent telecom, consumer and computer systems of the next decade. The SOP paradigm changes the current chip-centric or SOC system design methodology to a cheaper and faster-to-market systems-on- package-centric design flow. The course series consist of individual modules (see below) taught by highly respected Georgia Tech faculty and industry experts. Attendees can register for any one or more of these modules.

• SOP and SOC: The Best of Both for Next Generation of Systems
  
• Fundamentals of Thermomechanical Reliability Microsystem Packaging
• Polymers for Microelectronics - Materials, Processes and Characterizations
• Optoelectronics: Devices, Circuits, Integration, and Test
• Signal Integrity with Emphasis on Power Distribution for Digital Systems
• Integrated Passive Component Technology
• Integrated MEMS and Packaging
• Future Trends and Recent Advances in Thermal Management and Modeling of Electronic Systems
• Materials, Processing and Characterization High Density Substrates
• Chip and Wafer Scale Packaging
• RF/Wireless Packaging: Status and Challenges

For detailed information please contact Dr. Leyla Conrad, leyla.conrad@ece.gatech.edu.