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2005
PRC Short Course Series
System-on-Packaging
(SOP) and Nano/Microsystems Packaging Technology
PRC offers annually a comprehensive set of short courses on SOP and next-generation
microsystems packaging technologies. This year’s course series consists
of individual modules taught by highly respected Georgia Tech PRC faculty. The
individual modules are based on the PRC’s System-on-Package vision which
integrates not only digital but also analog, RF, optical and MEMS functions
into one ultra-compact and low-cost mixed signal package system to serve the
needs of convergent telecom, consumer and computer systems of the next decade.
This year’s short course series will focus on three areas:
1. Nano electronics packaging.
2. Embedded component thin-film integration of RF, optical, digital and MEMS
functions.
3. Wafer-level packaging and flip-chip assembly processing.
The titles and schedules of the individual modules to be offered are provided
in the table below. More information about each course or instructor can be
obtained by clicking on the course title. On-line registration is available
through the links below.
2005 Short Course Series Schedule
Date |
Course |
Instructors |
Course Fees* |
Sept. 26 |
Introduction to Nano-scale
Packaging and Systems
CANCELLED |
Rao Tummala & Zhong Lin Wang |
$350 |
Sept. 26 |
MEMS and NEMS Packaging
CANCELLED |
Farrokh Ayazi |
$350 |
Sept. 27 |
Manos Tentzeris & Joy Laskar |
$550 |
|
Sept. 28 |
G.K. Chang & Ali Adibi |
$350 |
|
Sept. 28 |
Wafer Level Packaging: Materials, Process
and Reliability |
C.P. Wong |
$350 |
Sept. 29-30 |
Low Cost Flip Chip Processing and Analysis
with Hands-On Applications CANCELLED |
Daniel Baldwin, Paul Houston & Brian Lewis |
$1,100 |
Full day registration
fee: $495 (on or before 5/10) and $550 (after 5/10)
Full week registration fee: $2,250 (on or before 5/10) and $2,500 (after 5/10)
* PRC member company engineers receive a 20% discount.