FUTURECAR 2017 – November 8-10, 2017 – Atlanta, GA
Future car electronics such as autonomous driving, in-car smartphone-like infotainment, privacy and security, and all-electric cars, present unparalelled research, development, manufacturing, education and marketing opportunities. They require new paradigms in devices and packaging particularly in materials,tools,processes, substrates,packages, components and integrated functions in R&D and in manufacturing. Georgia Tech and Semi see unprecedented technical challenges and opportunities in electrical, mechanical and thermal designs, and new digital, RF, radar, LiDAR, camera, millimeter wave, high-power and high-temp technologies.
- Plenary Keynote Sessions
Global leaders from industry and academia will present their perspective on topics related to the Future Car Electronics.
- Power Devices and Packaging
Power devices and packaging session will focus on recent and emerging developments in wideband gap devices and, ultra-high power density and high-temp packaging.
- High-temperature Materials and Reliability
This session will focus on high-temp electronics that include innovative and emerging high-performance devices, dielectrics, interconnections, passives and molding compound materials and structures to achieve ultra-high reliability.
- Sensing Electronics
The sensing electronics session, will focus on self-driving sensing technologies such as radar, LiDAR, cameras and others.
- Computing, Communications and Infotainment
This session will address the changing and diverse requirements for high bandwidth centralized and de-centralized computing within the car and 5G-like communications outside the car.
- Interactive Student Poster Session from Global Universities
Grad students from universities and technical institutes performing leading-edge R&D across the globe will present technical poster papers related to the workshop themes in New Era of Automotive Electronics.
Who Should Attend
Design, R&D and manufacturing leaders across the entire supply-chain – including semiconductor, package, assembly, components and automobile manufacturers.