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PRC: Research, Education, Industry

The Georgia Tech 3D Systems Packaging Research Center focuses on Smart, wearable, IOT, automotive, bio-electronics, and high-performance systems research. Leading-edge electronic systems research, cross-disciplinary education, and industry collaborations with 50+ global companies, make the PRC a leader in System-on-Package research.

3D Systems Packaging Research Center Industry Consortium Projects

This publication outlines the mission, strategy and expertise of the PRC faculty and team. Additionally, over 30 Industry Consortium Research Programs are detailed along with membership benefits and how your company become a partner.

Research Areas

Design: Electrical, Mechanical, and Thermal
Design and demonstrate 2.5D and 3D interposers addressing electrical, mechanical and thermal barriers.
Low-cost Glass Interposer and Package (LGIP)
Panel-based ultra-thin glass as a high performance, high I/O density, and low cost platform.
Interconnections and Assembly (I&A)
All-Cu interconnections with and without solders for highest I/O density, high power handling, warpage reduction and system miniaturization.
Functional Components - Passives and their Integration with Actives
Ultra-thin and high-performance 3D glass modules with double-side integration of actives and passives separated by 30µm.
3D Glass Photonics (3DGP)
Ultra-high bandwidth opto-electronic interconnections beyond TSVs by ultra-short optical vias in glass interposers at low power, low cost, and high alignment tolerance.
MEMS and Sensors – High-power and High-temperature Electronics
Advanced packaging technologies for automotive electronics – towards autonomous driving.

Featured Labs

  • The PRC Low-Cost Substrate Manufacturing Facility

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